Ultrasonic transducer for bi-directional wireless communication

• US 8,626,295 B2
• Filed: 03/02/2011
• Issued: 01/07/2014
• Est. Priority Date: 03/04/2010
• Status: Active Grant

• Current Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Original Assignee: Cardiac Pacemakers Incorporated (Boston Scientific Corporation)
• Inventors: Doron, Eyal, Mi, Bin, Chavan, Abhi V., Maile, Keith R.
• Primary Examiner(s): Layno, Carl H
• Assistant Examiner(s): Patel, Natasha
• Application Number:
  US13/038,754
• Publication Number:
  US 20110218594A1
• Time in Patent Office: 1,042 Days
• Field of Search: 607/32, 607/60
• US Class Current: 607/32
• CPC Class Codes: A61B 2560/0214 of power generation or supply
• CPC Class Codes: A61N 1/37217 characterised by the communication link, e.g. acoustic or tactile
• CPC Class Codes: G08C 23/02 using infrasonic, sonic or ultrasonic waves
• CPC Class Codes: G10K 9/122 using piezoelectric driving means G10K9/121 takes precedence
• CPC Class Codes: H04B 11/00 Transmission systems employing sonic, ultrasonic or infrasonic waves

Abstract

A piezoelectric element within an external ultrasonic transducer assembly can be used for wireless communication of data between an implantable device and the external ultrasonic transducer assembly such as using ultrasonic energy coupled to a flexible portion of a housing of the transducer assembly. The flexible portion can be configured to contact skin of a body containing the implantable device. The transducer assembly can be configured to respectively transmit or receive ultrasonic energy using at least partially overlapping respective ranges of resonant frequencies.

Claims

1. An ultrasonic transducer assembly comprising:

a housing including a flexible portion, the flexible portion configured to contact skin of a body containing an implantable device;

a piezoelectric element within the housing configured for wireless communication of data between the implantable device and the ultrasonic transducer assembly using ultrasonic energy coupled to the flexible portion of the housing;

a matching circuit included at least partially within the housing;

wherein the matching circuit is configured to provide energy to the piezoelectric element using a first resonant operating frequency range, and to receive energy from the piezoelectric element using a second resonant operating frequency range when the piezoelectric element is receiving ultrasonic energy; and

wherein the first and second resonant operating frequency ranges are at least partially overlapping.

2. The ultrasonic transducer assembly of claim 1, wherein the piezoelectric element is configured to operate in a voltage-driven mode when the piezoelectric element is providing ultrasonic energy;

and

wherein the piezoelectric element is configured to provide a charge output to drive a charge amplifier when the piezoelectric element is receiving ultrasonic energy.

3. The ultrasonic transducer assembly of claim 1, wherein the piezoelectric element is configured to at least one of provide or receive the ultrasonic energy using a flexural vibration mode of the flexible portion of the housing.

4. The ultrasonic transducer assembly of claim 3, wherein the piezoelectric element includes a circular footprint;

and wherein the flexural vibration mode of the flexible housing includes a deformation component orthogonal to a face of the circular footprint.

5. The ultrasonic transducer assembly of claim 1, wherein the first and second resonant operating frequency ranges each include a like frequency of determinable efficiency between 20 kHz and 800 kHz.

6. The ultrasonic transducer assembly of claim 5, wherein the first and second resonant operating frequency ranges each include a like frequency of peak efficiency at about 40 kHz.

7. The ultrasonic transducer assembly of claim 1, wherein the housing includes one of aluminum or stainless steel.

8. The ultrasonic transducer assembly of claim 1, wherein the housing includes an insulating layer on the flexible portion.

9. The ultrasonic transducer assembly of claim 8, wherein the insulating layer is located on an exterior face of the flexible portion.

10. The ultrasonic transducer assembly of claim 9, wherein the insulating layer is configured to decrease an acoustic impedance mismatch between the ultrasonic transducer assembly and the body in contact with the flexible portion of the ultrasonic transducer assembly in one or more of the first or second resonant operating frequency ranges.

11. The ultrasonic transducer assembly of claim 9, wherein at least a portion of the housing is electrically coupled to a portion of the piezoelectric element and wherein at least a portion of the housing is electrically coupled to the matching circuit.

12. The ultrasonic transducer assembly of claim 8, wherein the insulating layer is located on an interior face of the flexible portion and is configured to electrically isolate the flexible portion of the housing from the piezoelectric element.

13. A method, comprising:

providing or using an ultrasonic transducer assembly, including a matching circuit coupled to a piezoelectric element, for wireless communication of data between an implantable device within the body and the ultrasonic transducer assembly, the providing including using ultrasonic energy coupled between the piezoelectric element and the implantable device;

providing or using energy coupled through a matching circuit to the piezoelectric element for transmission to the implantable device using a first resonant operating frequency range;

providing or using energy coupled from the piezoelectric element through the matching circuit using a second resonant operating frequency range when the piezoelectric element is receiving the ultrasonic energy; and

wherein first and second resonant operating frequency ranges are at least partially overlapping.

14. The method of claim 13, comprising at least one of providing a charge output when the piezoelectric element is receiving ultrasonic energy or providing ultrasonic energy using the piezoelectric element operating in a voltage-driven mode.

15. The method of claim 13, comprising at least one of providing or receiving ultrasonic energy using a flexural vibration mode of a flexible portion of a housing coupled to the piezoelectric element.

16. The method of claim 13, wherein the first and second resonant operating frequency ranges each include a like frequency of determinable efficiency between 20 kHz and 800 kHz.

17. The ultrasonic transducer assembly of claim 16, wherein the first and second resonant operating frequency ranges each include a like frequency of peak efficiency at about 40 kHz.

18. The method of claim 13, comprising providing or using an insulating layer on a flexible portion of a housing of the ultrasonic transducer assembly;

and

wherein the flexible portion is configured to contact skin of the body containing the implantable device.

19. The method of claim 17, wherein the providing or using the insulating layer includes providing or using an insulating layer on an exterior face of the flexible portion of the housing;

wherein the body provides a first acoustic impedance and the ultrasonic transducer assembly provides a second acoustic impedance; and

wherein the providing or using the insulating layer includes decreasing an impedance mismatch between the first and second acoustic impedances at least in part using the insulating layer.

20. The method of claim 17, wherein the electrically insulating comprises providing an insulating layer on an interior face of the flexible portion of the housing to electrically isolate the piezoelectric element from the flexible portion of the housing.