Storage device temperature sensing

• US 8,628,239 B2
• Filed: 07/15/2010
• Issued: 01/14/2014
• Est. Priority Date: 07/15/2009
• Status: Expired due to Fees

• Current Assignee: Teradyne Incorporated
• Original Assignee: Teradyne Incorporated
• Inventors: Merrow, Brian S., Akers, Larry W.
• Primary Examiner(s): Caputo, Lisa
• Assistant Examiner(s): Soto, Janice M
• Application Number:
  US12/836,940
• Publication Number:
  US 20110013667A1
• Time in Patent Office: 1,279 Days
• Field of Search: None
• US Class Current: 374/141
• CPC Class Codes: G01K 1/146 arrangements for moving thermometers to or from a measuring position
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: G11C 29/56 External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
• CPC Class Codes: G11C 29/56016 Apparatus features

Abstract

A test slot assembly is provided for testing a storage device. The test slot assembly is configured to receive and support a storage device, or a storage device supported by a storage device transporter. The test slot assembly also includes a temperature sensing assembly. The temperature sensing assembly is arranged to measure a temperature of a storage device by way of physical contact. The test slot assembly also includes a clamping mechanism operatively associated with the housing. The clamping mechanism is operable to move the temperature sensing assembly into contact with a storage device.

Claims

1. A test slot assembly comprising:

a housing configured to receive and to support a storage device;

a temperature sensing assembly associated with the housing and configured to measure a temperature of the storage device by way of physical contact; and

a clamping mechanism that is different from the housing;

wherein a least a portion of the clamping mechanism is adjustable between a first position and a second position;

wherein the clamping mechanism when in the first position is configured to cause the temperature sensing assembly to be disengaged from the storage device;

wherein the clamping mechanism when in the second position is configured to perform a clamping action that moves the temperature sensing assembly into contact with the storage device and to clamp the storage device against movement relative to the housing in response to pressure between the clamping mechanism and the housing; and

wherein the clamping mechanism is adjacent to a portion of a sidewall of the housing, and wherein the temperature sensing assembly is adjacent to the clamping mechanism such that the clamping mechanism is positioned between the portion of the sidewall and the temperature sensing assembly.

2. The test slot assembly of claim 1, wherein the temperature sensing assembly comprises printed circuitry and a thermocouple, wherein the printed circuitry comprises one or more electrically conductive layers, and wherein the thermocouple is integrated in the one or more electrically conductive layers.

3. The test slot assembly of claim 2, wherein the printed circuitry comprises a printed wiring board.

4. The test slot assembly of claim 2, wherein the printed circuitry comprises a flexible printed circuit.

5. The test slot assembly of claim 1, wherein the temperature sensing assembly comprises at least one of a resistive temperature sensor, a semiconductor diode sensor, a thermocouple, an infrared thermometer and a silicon bandgap temperature sensor.

6. The test slot assembly of claim 1, further comprising a conductive heating element arranged to heat the storage device.

7. The test slot assembly of claim 6, wherein the clamping mechanism is further configured to move the conductive heating element into contact with the storage device.

8. The test slot assembly of claim 6, wherein the conductive heating element comprises a resistive heater.

9. The test slot assembly of claim 1, further comprising a storage device transporter for supporting the storage device.

10. The test slot assembly of claim 9, wherein the housing is further configured to receive and to support the storage device transporter.

11. A storage device testing system comprising:

a test slot comprising;

a test compartment for receiving and supporting a storage device;

a temperature sensing assembly associated with the test compartment and configured to measure a temperature of the storage device by way of physical contact;

a clamping mechanism that is different from the test compartment;

wherein a least a portion of the clamping mechanism is adjustable between a first position and a second position;

wherein the clamping mechanism when in the first position is configured to cause the temperature sensing assembly to be disengaged from the storage device;

wherein the clamping mechanism when in the second position is configured to perform a clamping action that moves the temperature sensing assembly into contact with the storage device and to clamp the storage device against movement relative to the test compartment in response to pressure between the clamping mechanism and the test compartment;

wherein the clamping mechanism is adjacent to a portion of a sidewall of the test slot, and wherein the temperature sensing assembly is adjacent to the clamping mechanism such that the clamping mechanism is positioned between the portion of the sidewall and the temperature sensing assembly; and

test electronics configured to communicate one or more test routines to the storage device.

12. The storage device testing system of claim 11, wherein the test slot further comprises a connection interface board configured to provide electrical communication with the test electronics;

and

wherein the test electronics are further configured to monitor a temperature of the storage device based on signals received from the temperature sensing assembly.

13. The storage device testing system of claim 11, wherein the test slot further comprises a connection interface board configured to monitor the temperature of the storage device based on signals received from the temperature sensing assembly.

14. The storage device testing system of claim 11, wherein the test compartment further comprises a conductive heating element configured to heat the storage device.

15. The storage device testing system of claim 14, wherein the test slot further comprises:

a connection interface board configured to;

provide electrical communication between the temperature sensor and the test electronics; and

control a current flow to the conductive heating element based, at least in part, on signals received from the temperature sensing assembly.

16. The storage device testing system of claim 14, wherein the test electronics are further configured to measure a power draw of the storage device and to compensate for an error between an actual temperature of the storage device and the temperature measured by the temperature sensing assembly.

17. The storage device testing system of claim 11, wherein the test slot further comprises a connection interface board configured to provide electrical communication with a conductive heating assembly when the storage device is disposed within the test compartment.

18. A method comprising:

inserting a storage device into a test slot; and

adjusting a clamping mechanism from a first position to a second position;

wherein the clamping mechanism when in the first position is configured to cause a temperature sensor assembly to be disengaged from the storage device;

engaging, based on adjustment to the second position, the clamping mechanism;

clamping, based on engaging, the storage device within a test compartment of the test slot to clamp the storage device against movement relative to the test compartment in response to pressure between the clamping mechanism and the test compartment; and

moving, based on clamping, the temperature sensor into physical contact with the storage device;

wherein the clamping mechanism is adjacent to a portion of a sidewall of the test slot, and wherein the temperature sensor is adjacent to the clamping mechanism such that the clamping mechanism is positioned between the portion of the sidewall and the temperature sensor.

19. The method of claim 18, wherein the storage device is received in a storage device transporter;

and

wherein inserting comprises;

inserting the storage device transporter with the received storage device into the test slot.