Light-emitting diode (LED) package systems

• US 8,628,984 B2
• Filed: 02/15/2013
• Issued: 01/14/2014
• Est. Priority Date: 02/16/2010
• Status: Expired due to Fees

• Current Assignee: Epistar Corporation (Ennostar, Inc.), Sergio Mascarenhas Oliveira
• Original Assignee: TSMC Solid State Lighting Ltd. (Ennostar, Inc.)
• Inventors: Wang, Chung Yu
• Primary Examiner(s): Lee, Kyoung
• Application Number:
  US13/767,994
• Publication Number:
  US 20130157395A1
• Time in Patent Office: 333 Days
• Field of Search: None
• US Class Current: 438/26
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15156 Side view
• CPC Class Codes: H01L 2924/15788 Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2924/18161 of a flip chip
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure.

Claims

1. A method, comprising:

forming a plurality of thermally conductive structures in a first side of a substrate;

forming a plurality of polymer elements in the substrate along scribe lines of the substrate;

forming a plurality of cavities in a second side of the substrate different from the first side, the cavities exposing the thermally conductive structures from the second side;

placing a light-emitting diode (LED) in each of the cavities, the LED being thermally coupled to the thermally conductive structures; and

separating the LED from adjacent LEDs.

2. The method of claim 1, wherein the separating the LED comprises performing a dicing process along each of the polymer elements.

3. The method of claim 1, further comprising:

before the forming the plurality of cavities, attaching a carrier to the first side of the substrate; and

thinning the substrate from the second side after the carrier is attached; and

removing the carrier after the thinning of the substrate.

4. The method of claim 3, wherein the carrier includes a glass material and is attached to the first side of the substrate through an adhesive material.

5. The method of claim 1, further comprising:

forming a lens material around the LED.

6. The method of claim 5, wherein the LED includes a transparent substrate, and wherein the forming the lens material is performed such that a surface of the lens material is substantially level with a surface of the transparent substrate.

7. The method of claim 1, wherein the LED has a plurality of solder bumps that are each coupled to a different one of the thermal conductive structures.

8. The method of claim 1, further comprising:

before the forming the cavities, forming a plurality of beveled grooves in the substrate from the second side such that tips of the grooves are level with bottom surfaces of the thermally conductive structures.

9. A method, comprising:

forming polymer materials in a substrate;

forming a plurality of thermally conductive structures in a first side of the substrate;

coupling a carrier to the first side of the substrate;

removing a portion of the substrate from a second side of the substrate opposite the first side;

thereafter forming a plurality of grooves in the second side of the substrate;

forming a plurality of cavities in the second side of the substrate, each of the cavities joining a different subset of the grooves and exposing a different subset of the thermally conductive structures from the second side;

disposing a plurality of light-emitting diodes (LEDs) in the cavities in a manner such that the LEDs are thermally coupled to the thermally conductive structures, wherein a respective LED is disposed in each of the cavities;

removing the carrier; and

performing a dicing process to singulate the LEDs.

10. The method of claim 9, wherein the carrier includes a glass material.

11. The method of claim 9, wherein the coupling the carrier is performed using an adhesive tape.

12. The method of claim 9, wherein the forming the grooves is performed such that the grooves each have beveled surfaces.

13. The method of claim 9, wherein the forming the grooves is performed such that a tip of at least one of the grooves is level with a bottom surface of at least one of the thermally conductive structures.

14. The method of claim 9, further comprising:

forming a lens material around each of the LEDs.

15. The method of claim 9, wherein the LEDs each include a transparent substrate, and wherein the forming the lens material is performed such that a surface of the lens material is substantially co-planar with surfaces of the transparent substrates.

16. The method of claim 9, wherein the dicing process is performed along the polymer materials.

17. A method, comprising:

forming a plurality of polymer element along scribe lines of a substrate;

forming a plurality of thermally conductive structures in the substrate, the thermally conductive structures being formed from a first side of the substrate and extend toward a second side of the substrate opposite the first side;

attaching a carrier to the second side of the substrate;

thereafter thinning the substrate from the second side;

forming a plurality of cavities in the substrate, the cavities being formed from the second side and exposing the thermally conductive structures to the second side;

disposing a plurality of light-emitting diodes (LEDs) in the cavities in a manner such that a respective LED is disposed in each of the cavities, wherein each LED includes a transparent substrate and a plurality of thermal conductive elements, and wherein the thermal conductive elements of the LEDs are each thermally coupled to a respective one of the thermally conductive structures formed in the substrate;

forming a lens material around each of the LEDs;

detaching the carrier from the substrate; and

dicing the polymer elements, thereby singulating the LEDs.

18. The method of claim 17, further comprising:

before the forming the plurality of cavities, forming a plurality of beveled grooves such that tips of the grooves are level with bottom surfaces of the thermally conductive structures.

19. The method of claim 17, wherein the forming the lens material is performed such that a surface of the lens material is substantially co-planar with surfaces of the transparent substrates of the LEDs.