Light emitting devices with improved light extraction efficiency
First Claim
1. A method comprising:
- mounting a light emitting device die to a submount through at least one contact element; and
bonding an optical element to the light emitting device die after the light emitting device die is mounted to the submount, wherein;
the optical element is connected to the light emitting device die by a bonding layer disposed between the optical element and the light emitting device die, andthe bonding layer does not encapsulate the light emitting device die.
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Accused Products
Abstract
Light emitting devices with improved light extraction efficiency are provided. The light emitting devices have a stack of layers including semiconductor layers comprising an active region. The stack is bonded to a transparent lens having a refractive index for light emitted by the active region preferably greater than about 1.5, more preferably greater than about 1.8. A method of bonding a transparent lens to a light emitting device having a stack of layers including semiconductor layers comprising an active region includes elevating a temperature of the lens and the stack and applying a pressure to press the lens and the stack together. Bonding a high refractive index lens to a light emitting device improves the light extraction efficiency of the light emitting device by reducing loss due to total internal reflection. Advantageously, this improvement can be achieved without the use of an encapsulant.
80 Citations
12 Claims
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1. A method comprising:
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mounting a light emitting device die to a submount through at least one contact element; and bonding an optical element to the light emitting device die after the light emitting device die is mounted to the submount, wherein; the optical element is connected to the light emitting device die by a bonding layer disposed between the optical element and the light emitting device die, and the bonding layer does not encapsulate the light emitting device die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method comprising:
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providing a semiconductor light emitting device comprising a stack of semiconductor layers including an active region;
providing an optical element; andbonding the semiconductor light emitting device to the optical element; wherein; the optical element is connected to the light emitting device by a bonding layer disposed between the optical element and the semiconductor light emitting device, and the bonding layer comprises a metal oxide and does not encapsulate the light emitting device.
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Specification