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Liner formation in 3DIC structures

  • US 8,629,066 B2
  • Filed: 07/30/2012
  • Issued: 01/14/2014
  • Est. Priority Date: 07/08/2009
  • Status: Active Grant
First Claim
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1. A method comprising:

  • forming an opening in a substrate; and

    forming a liner dielectric in the opening using spraying, wherein the liner dielectric comprises a sidewall portion on a sidewall of the opening and a bottom portion on a bottom of the opening, and wherein thicknesses of the sidewall portion increase substantially continuously from top to bottom.

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