Semiconductor device and method for manufacturing the same
First Claim
1. A semiconductor device comprising:
- a gate electrode layer;
a first insulating layer in contact with the gate electrode layer;
an oxide semiconductor layer in contact with the first insulating layer; and
a second insulating layer in contact with the oxide semiconductor layer,wherein the oxide semiconductor layer has a wurtzite crystal structure and has a concentration gradient in which a nitrogen concentration is increased as a distance from the first insulating layer becomes shorter.
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Accused Products
Abstract
An object to provide a material suitably used for used for a semiconductor included in a transistor, a diode, or the like, with the use of a sputtering method. Specifically, an object is to provide a manufacturing process an oxide semiconductor film having high crystallinity. By intentionally adding nitrogen to the oxide semiconductor, an oxide semiconductor film having a wurtzite crystal structure that is a hexagonal crystal structure is formed. In the oxide semiconductor film, the crystallinity of a region containing nitrogen is higher than that of a region hardly containing nitrogen or a region to which nitrogen is not intentionally added. The oxide semiconductor film having high crystallinity and having a wurtzite crystal structure is used as a channel formation region of a transistor.
126 Citations
8 Claims
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1. A semiconductor device comprising:
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a gate electrode layer; a first insulating layer in contact with the gate electrode layer; an oxide semiconductor layer in contact with the first insulating layer; and a second insulating layer in contact with the oxide semiconductor layer, wherein the oxide semiconductor layer has a wurtzite crystal structure and has a concentration gradient in which a nitrogen concentration is increased as a distance from the first insulating layer becomes shorter. - View Dependent Claims (2, 3)
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4. A semiconductor device comprising:
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a gate electrode layer; a first insulating layer in contact with the gate electrode layer; a first oxide semiconductor layer in contact with the first insulating layer; a second oxide semiconductor layer in contact with the first oxide semiconductor layer; and a second insulating layer in contact with the second oxide semiconductor layer, wherein the first oxide semiconductor layer and the second oxide semiconductor layer each have a wurtzite crystal structure, and wherein the first oxide semiconductor layer has a higher nitrogen concentration than the second oxide semiconductor layer. - View Dependent Claims (5, 6, 7, 8)
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Specification