Arrangements for an integrated sensor
First Claim
Patent Images
1. An integrated circuit, comprising:
- a lead frame;
a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the lead frame;
a second substrate having first and second opposing surfaces, wherein the first substrate and the second substrate are coupled such that the first surface of the second substrate is proximate to the first surface of the first substrate and the second surface of the second substrate is distal from the first surface of the first substrate;
an electronic component disposed on the first surface of the first substrate;
a first magnetic field sensing element disposed on the first surface of the second substrate; and
a second magnetic field sensing element disposed on the first surface of the first substrate wherein the first magnetic field sensing element provides a first sensitivity to a magnetic field, wherein the second magnetic field sensing element provides a selected second different sensitivity to the magnetic field, and wherein the integrated circuit is configured to provide a first operating range responsive to the first magnetic field sensing element and a second selected different operating range responsive to the second magnetic field sensing element.
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Abstract
An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.
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Citations
70 Claims
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1. An integrated circuit, comprising:
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a lead frame; a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the lead frame; a second substrate having first and second opposing surfaces, wherein the first substrate and the second substrate are coupled such that the first surface of the second substrate is proximate to the first surface of the first substrate and the second surface of the second substrate is distal from the first surface of the first substrate; an electronic component disposed on the first surface of the first substrate; a first magnetic field sensing element disposed on the first surface of the second substrate; and a second magnetic field sensing element disposed on the first surface of the first substrate wherein the first magnetic field sensing element provides a first sensitivity to a magnetic field, wherein the second magnetic field sensing element provides a selected second different sensitivity to the magnetic field, and wherein the integrated circuit is configured to provide a first operating range responsive to the first magnetic field sensing element and a second selected different operating range responsive to the second magnetic field sensing element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An integrated circuit, comprising:
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a lead frame; a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the lead frame such that the second surface of the first substrate is above the lead frame and the first surface of the first substrate is above the second surface of the first substrate; a second substrate having first and second opposing surfaces, wherein the first substrate and the second substrate are coupled such that the second surface of the second substrate is above the first surface of the first substrate and the first surface of the second substrate is above the second surface of the second substrate; an electronic component disposed on the first surface of the first substrate; a first magnetic field sensing element disposed on the first surface of the second substrate; and a second magnetic field sensing element disposed on the first surface of the first substrate, wherein the first magnetic field sensing element provides a first sensitivity to a magnetic field, wherein the second magnetic field sensing element provides a selected second different sensitivity to the magnetic field, and wherein the integrated circuit is configured to provide a first operating range responsive to the first magnetic field sensing element and a second selected different operating range responsive to the second magnetic field sensing element. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. An integrated circuit, comprising:
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a lead frame; a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the lead frame; a second substrate having first and second opposing surfaces, wherein the first substrate and the second substrate are coupled such that the first surface of the second substrate is proximate to the first surface of the first substrate and the second surface of the second substrate is distal from the first surface of the first substrate; an electronic component disposed on the first surface of the first substrate; and a first magnetic field sensing element disposed on the first surface of the second substrate, wherein the lead frame further comprises a plurality of leads, wherein at least two of the plurality of leads are coupled to form a current conductor portion, wherein the current conductor portion is disposed proximate to the second substrate, and wherein the integrated circuit is responsive to a current flowing through the current conductor portion. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26)
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27. An integrated circuit, comprising:
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a lead frame; a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the lead frame such that the second surface of the first substrate is above the lead frame and the first surface of the first substrate is above the second surface of the first substrate; a second substrate having first and second opposing surfaces, wherein the first substrate and the second substrate are coupled such that the second surface of the second substrate is above the first surface of the first substrate and the first surface of the second substrate is above the second surface of the second substrate; an electronic component disposed on the first surface of the first substrate; and a first magnetic field sensing element disposed on the first surface of the second substrate, wherein the lead frame further comprises a plurality of leads, wherein at least two of the plurality leads are coupled to form a current conductor portion, wherein the current conductor portion is disposed proximate to the second substrate, and wherein the integrated circuit is responsive to a current flowing through the current conductor portion. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34)
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35. An integrated circuit, comprising:
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a lead frame; a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the lead frame; a second substrate having first and second opposing surfaces, wherein the first substrate and the second substrate are coupled such that the first surface of the second substrate is proximate to the first surface of the first substrate and the second surface of the second substrate is distal from the first surface of the first substrate; an electronic component disposed on the first surface of the first substrate; and a first magnetic field sensing element disposed on the first surface of the second substrate, wherein the integrated circuit is adapted to be responsive to a current passing through a wire. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42, 43)
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44. An integrated circuit, comprising:
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a lead frame; a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the lead frame such that the second surface of the first substrate is above the lead frame and the first surface of the first substrate is above the second surface of the first substrate; a second substrate having first and second opposing surfaces, wherein the first substrate and the second substrate are coupled such that the second surface of the second substrate is above the first surface of the first substrate and the first surface of the second substrate is above the second surface of the second substrate; an electronic component disposed on the first surface of the first substrate; and a first magnetic field sensing element disposed on the first surface of the second substrate, wherein the integrated circuit is adapted to be responsive to a current passing through a wire. - View Dependent Claims (45, 46, 47, 48, 49, 50, 51)
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52. An integrated circuit, comprising;
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a lead frame; a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the lead frame; a second substrate having first and second opposing surfaces, wherein the first substrate and the second substrate are coupled such that the first surface of the second substrate is proximate to the first surface of the first substrate and the second surface of the second substrate is distal from the first surface of the first substrate; an electronic component disposed on the first surface of the first substrate; a first magnetic field sensing element disposed on the first surface of the second substrate; a current conductor disposed proximate to the second substrate; and a flux concentrator shaped so that a first portion of the flux concentrator is disposed under the lead frame and a second portion of the flux concentrator is disposed above the second surface of the second substrate. - View Dependent Claims (53, 54, 55, 56, 57, 58, 59, 60, 61)
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62. An integrated circuit, comprising:
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a lead frame; a first substrate having first and second opposing surfaces, wherein the first substrate is coupled to the lead frame such that the second surface of the first substrate is above the lead frame and the first surface of the first substrate is above the second surface of the first substrate; a second substrate having first and second opposing surfaces, wherein the first substrate and the second substrate are coupled such that the second surface of the second substrate is above the first surface of the first substrate and the first surface of the second substrate is above the second surface of the second substrate; an electronic component disposed on the first surface of the first substrate; and a first magnetic field sensing element disposed on the first surface of the second substrate; a current conductor disposed proximate to the second substrate; and a flux concentrator shaped so that a first portion of the flux concentrator is disposed under the lead frame and a second portion of the flux concentrator is disposed above the first surface of the second substrate. - View Dependent Claims (63, 64, 65, 66, 67, 68, 69, 70)
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Specification