Electrically interconnected stacked die assemblies

• US 8,629,543 B2
• Filed: 10/27/2010
• Issued: 01/14/2014
• Est. Priority Date: 06/11/2007
• Status: Active Grant

• Current Assignee: Vertical Circuits Solutions, Inc.
• Original Assignee: Invensas Corporation
• Inventors: McElrea, Simon J. S., Andrews, Lawrence Douglas Jr., McGrath, Scott, Caskey, Terrence, Crane, Scott Jay, Robinson, Marc E., Cantillep, Loreto
• Primary Examiner(s): Trinh, Hoa B
• Application Number:
  US12/913,604
• Publication Number:
  US 20110037159A1
• Time in Patent Office: 1,175 Days
• Field of Search: 257/E23.141, 257685-686, 257/690, 257777-779, 257782-784, 257/786
• US Class Current: 257/686
• CPC Class Codes: H01L 2224/24011 Deposited, e.g. MCM-D type
• CPC Class Codes: H01L 2224/24145 the bodies being stacked
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2225/06524 Electrical connections formed on device or on substrate, e.g. a deposited or grown layer
• CPC Class Codes: H01L 2225/06551 Conductive connections on the side of the device
• CPC Class Codes: H01L 2225/06555 Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06562 at least one device in the stack being rotated or offset
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/25 of a plurality of high density interconnect connectors
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01038 : Strontium [Sr]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.

Claims

1. A stacked die assembly comprising a plurality of stacked dice in which corresponding first die edges of first and third dice are spaced apart from one another in a direction of a height of the assembly at least by a second die of the stacked dice, each die having a front side and a back side and having interconnect pads arranged at the front side in a margin along at least a first die edge, wherein an interconnect pad on the first die of said plurality of dice is electrically connected to the third die of said plurality of dice by a continuous trace of an interconnect material comprising an electrically conductive polymer or an electrically conductive ink, the continuous trace being unsupported as it traverses a portion of an interconnect distance between the first die edges of the first and third dice and adjacent the second die to which the trace is not electrically connected.

2. The stacked die assembly of claim 1 wherein odd-numbered dice of said plurality of dice are vertically aligned at one stack face, and even-numbered dice of said plurality of dice are vertically aligned at the opposite stack face.

3. The stacked die assembly of claim 2 wherein the interconnect pads of each of the first and third dice are disposed other than at the first die edge.

4. The stacked die assembly of claim 1 wherein each die has an X-dimension greater than a Y-dimension, and the first die edge is a narrower die edge, wherein succeeding die in the stack are oriented at 90°

in relation to vertically adjacent die below or above.

5. The stacked die assembly of claim 4 wherein the interconnect pads of each of the first and third dice are disposed other than at the first die edge and corresponding overlying interconnect pads are connected by the continuous trace.

6. The stacked die assembly of claim 1 wherein the stack is provided with an electrically insulative conformal coating formed on the die stack.

7. The stacked die assembly of claim 6 wherein the conformal coating is formed in a space between vertically adjacent die, providing adhesion between the die.

8. The stacked die assembly of claim 6 wherein the conformal coating is formed over at least the portions of a die surface over which the continuous trace is situated.

9. The stacked die assembly of claim 1 wherein at least one of the die is provided with an electrically insulative conformal coating.

10. The stacked die assembly of claim 1 wherein at least one of the die is provided with an electrically insulative conformal coating over at least the front surface and the sidewalls adjacent the die margin on which the interconnect pads are arranged.

11. The stacked die assembly of claim 1 wherein at least one of the dice is provided with an electrically insulative conformal coating over the front surface, the back surface, and the sidewall surfaces of the die.

12. The stacked die assembly of claim 11 wherein the material of the conformal coating includes an organic polymer.

13. The stacked die assembly of claim 12 wherein the organic polymer is a parylene.

14. The stacked die assembly of claim 10 wherein the conformal coating is formed by deposition.

15. The stacked die assembly of claim 1 wherein the interconnect material comprises an electrically conductive polymer.

16. The stacked die assembly of claim 15 wherein the interconnect material comprises a curable conductive epoxy.

17. The stacked die assembly of claim 1 wherein the interconnect material is applied using an application tool.

18. The stacked die assembly of claim 17 wherein the interconnect material is extruded from the tool in a continuous flow.

19. The stacked die assembly of claim 17 wherein the interconnect material exits the tool dropwise.

20. The stacked die assembly of claim 1 wherein a plurality of continuous traces are formed in a single operation.

21. The stacked die assembly of claim 20 wherein the interconnect material is applied using an application tool comprising a plurality of needles or nozzles ganged together.

22. The stacked die assembly of claim 1 wherein the continuous trace is formed by printing.

23. A stacked die assembly, comprising the stacked die assembly of claim 1 electrically interconnected with circuitry in a system.

24. The stacked die assembly of claim 23 wherein the stacked die assembly is interconnected such that the active side of at least one of the dice faces toward the underlying circuitry.

25. The stacked die assembly of claim 23 wherein the stacked die assembly is interconnected such that the back side of at least one of the dice faces toward the underlying circuitry.

26. The stacked die assembly of claim 2, wherein the portion of the interconnect distance includes the distance between the odd-numbered dice.

27. A stacked die assembly comprising a plurality of stacked dice, each die having a front side and a back side and having interconnect pads arranged at the front side in a margin along at least a first die edge, wherein an interconnect pad on a first die of said plurality of dice is electrically connected to a second die of said plurality of dice by a continuous trace of an interconnect material comprising an electrically conductive polymer or an electrically conductive ink, the continuous trace being unsupported as it traverses a portion of an interconnect distance between the first and second dice, the portion being approximately the same as a thickness of a die of the plurality of dice.

28. A stacked die assembly comprising a plurality of stacked dice, each die having a front side and a back side and having interconnect pads arranged at the front side in a margin along at least a first die edge, wherein an interconnect pad on a first die of said plurality of dice is electrically connected to a second die of said plurality of dice by a continuous trace of an interconnect material comprising an electrically conductive polymer or an electrically conductive ink, the continuous trace being unsupported as it traverses a portion of an interconnect distance between the first and second dice.

29. The stacked die assembly of claim 28 wherein the interconnect pads of each of the first and second dice are disposed other than at the first die edge.