Electrically interconnected stacked die assemblies
First Claim
1. A stacked die assembly comprising a plurality of stacked dice in which corresponding first die edges of first and third dice are spaced apart from one another in a direction of a height of the assembly at least by a second die of the stacked dice, each die having a front side and a back side and having interconnect pads arranged at the front side in a margin along at least a first die edge, wherein an interconnect pad on the first die of said plurality of dice is electrically connected to the third die of said plurality of dice by a continuous trace of an interconnect material comprising an electrically conductive polymer or an electrically conductive ink, the continuous trace being unsupported as it traverses a portion of an interconnect distance between the first die edges of the first and third dice and adjacent the second die to which the trace is not electrically connected.
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Accused Products
Abstract
In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.
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Citations
29 Claims
- 1. A stacked die assembly comprising a plurality of stacked dice in which corresponding first die edges of first and third dice are spaced apart from one another in a direction of a height of the assembly at least by a second die of the stacked dice, each die having a front side and a back side and having interconnect pads arranged at the front side in a margin along at least a first die edge, wherein an interconnect pad on the first die of said plurality of dice is electrically connected to the third die of said plurality of dice by a continuous trace of an interconnect material comprising an electrically conductive polymer or an electrically conductive ink, the continuous trace being unsupported as it traverses a portion of an interconnect distance between the first die edges of the first and third dice and adjacent the second die to which the trace is not electrically connected.
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27. A stacked die assembly comprising a plurality of stacked dice, each die having a front side and a back side and having interconnect pads arranged at the front side in a margin along at least a first die edge, wherein an interconnect pad on a first die of said plurality of dice is electrically connected to a second die of said plurality of dice by a continuous trace of an interconnect material comprising an electrically conductive polymer or an electrically conductive ink, the continuous trace being unsupported as it traverses a portion of an interconnect distance between the first and second dice, the portion being approximately the same as a thickness of a die of the plurality of dice.
- 28. A stacked die assembly comprising a plurality of stacked dice, each die having a front side and a back side and having interconnect pads arranged at the front side in a margin along at least a first die edge, wherein an interconnect pad on a first die of said plurality of dice is electrically connected to a second die of said plurality of dice by a continuous trace of an interconnect material comprising an electrically conductive polymer or an electrically conductive ink, the continuous trace being unsupported as it traverses a portion of an interconnect distance between the first and second dice.
Specification