Method for packaging semiconductor dies having through-silicon vias
First Claim
Patent Images
1. A structure comprising:
- a die comprising a through via, the through via protruding from a surface of the die, a cross-sectional area of the through via in the surface of the die being equal to a cross-sectional area of a protruding portion of the through via in a plane parallel to the surface of the die; and
an anisotropic conducting film (ACF) adjoining the surface of the die, the protruding portion of the through via penetrating the ACF.
0 Assignments
0 Petitions
Accused Products
Abstract
Integrated circuit structures and methods are provided. According to an embodiment, a circuit structure includes a die and an anisotropic conducting film (ACF). The die comprises a through via, and the through via protrudes from a surface of the die. A cross-sectional area of the through via in the surface of the die is equal to a cross-sectional area of a protruding portion of the through via in a plane parallel to the surface of the die. The ACF adjoins the surface of the die, and the protruding portion of the through via penetrates the ACF.
-
Citations
20 Claims
-
1. A structure comprising:
-
a die comprising a through via, the through via protruding from a surface of the die, a cross-sectional area of the through via in the surface of the die being equal to a cross-sectional area of a protruding portion of the through via in a plane parallel to the surface of the die; and an anisotropic conducting film (ACF) adjoining the surface of the die, the protruding portion of the through via penetrating the ACF. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method comprising:
-
forming a through via through a first surface of a substrate; after the forming the through via, causing the through via to protrude from a second surface of the substrate, the second surface of the substrate being opposite from the first surface of the substrate; and attaching an anisotropic conducting film (ACF) to the second surface of the substrate, a protruding portion of the through via penetrating into the ACF, the ACF being a part of a wafer-mount tape. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
-
-
17. A method of forming a package structure, the method comprising:
-
attaching a wafer to a wafer-mount tape, the wafer-mount tape comprising an ultra-violet wafer-mount tape and an anisotropic conducting film (ACF), a first surface of the wafer being in contact with the ACF; singulating the wafer to separate dies; exposing the ultra-violet wafer-mount tape to an ultra-violet light; detaching the ultra-violet wafer-mount tape from the ACF; and mounting a die separated from the wafer onto a package substrate, the ACF being between the die and the package substrate. - View Dependent Claims (18, 19, 20)
-
Specification