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Thin wafer protection device

  • US 8,629,565 B2
  • Filed: 03/13/2012
  • Issued: 01/14/2014
  • Est. Priority Date: 03/27/2009
  • Status: Active Grant
First Claim
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1. A thin wafer protection device, comprising:

  • a wafer having a plurality of semiconductor chips, the wafer having a first side and an opposite second side;

    a plurality of dies over the first side of the wafer, wherein at least one of the plurality of dies is bonded to at least one of the plurality of semiconductor chips;

    a wafer carrier over the second side of the wafer;

    an encapsulating layer over the first side of the wafer and the plurality of dies, wherein the encapsulating layer has a planar top surface; and

    an adhesive tape over the planar top surface.

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