Switching circuit layout with heatsink

• US 8,630,098 B2
• Filed: 06/12/2009
• Issued: 01/14/2014
• Est. Priority Date: 06/12/2008
• Status: Active Grant

• Current Assignee: Solaredge Technologies Incorporated
• Original Assignee: Solaredge Technologies Incorporated
• Inventors: Handelsman, Lior, Glovinsky, Tzachi, Grossberg, Amir, Schmidt, Heribert, Rogalia, Snke
• Primary Examiner(s): Dinh, Tuan T
• Application Number:
  US12/483,933
• Publication Number:
  US 20100124027A1
• Time in Patent Office: 1,677 Days
• Field of Search: 361/753, 361780-784, 361823-830, 362230-232, 362609-612
• US Class Current: 361/781
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/09418 Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

A circuit board adapted for use in an switching converter for connecting a plurality of switches including a first switch, a second switch, a third switch and a fourth switch. The circuit board has a layout for connecting the switches. The layout is adapted for locating the switches substantially at or symmetrically with respect to the endpoints of a right-angle cross. The right-angle cross is formed from two line segments intersecting with a ninety degree angle. The circuit board may offsets the switches perpendicularly to the line segments at the endpoints of the line segments either in a clockwise or a counterclockwise direction.

Claims

1. A switching converter comprising:

a plurality of switches including a first switch, a second switch, a third switch and a fourth switch;

a circuit board having a layout for connecting said switches, wherein said layout locates said switches substantially at endpoints of a right-angle cross, wherein said layout includes cutouts at the endpoints of said right angle cross, and wherein said switches are located within said cutouts;

a chassis mounting said switches; and

a heat sink attached to said switches and said chassis.

2. The switching converter of claim 1, wherein said layout is adapted for locating said switches substantially symmetrically with respect to the endpoints of said right-angle cross.

3. The switching converter of claim 1, wherein said switches are interconnected in a full bridge switching topology.

4. The switching converter of claim 1, wherein said switches are interconnected in a buck-boost switching topology.

5. The switching converter of claim 1, wherein said heat sink conducts heat from said switches.

6. The switching converter of claim 1, wherein said first switch, said second switch, said third switch and said fourth switch are selected from the group consisting of:

a silicon controlled rectifier (SCR), an insulated gate bipolar junction transistor (IGBT), a bipolar junction transistor (BJT), a field effect transistor (FET), a junction field effect transistor (JFET), a switching diode, an electrical relay, a reed relay, a solid state relay, an insulated gate field effect transistor (IGFET), a diode for alternating current (DIAC), and a triode for alternating current (TRIAC).

7. The switching converter of claim 1, wherein said switches are insulated gate bipolar junction transistors (IGBT).

8. The switching converter of claim 1, wherein said right-angle cross is formed from two line segments intersecting with a ninety degree angle, wherein the circuit board offsets all said switches perpendicularly to said line segments at the endpoints of the line segments either in a clockwise or a counterclockwise direction, thereby forming said layout of said switches in a shape of a fylfot cross.

9. The switching converter of claim 1, wherein said right-angle cross is formed from two line segments, including a first line segment and a second line segment intersecting with a ninety degree angle, wherein said first switch and said third switch are at the endpoints of said first line segment forming a first pair of said switches and said second switch and said fourth switch are at the endpoints of said second line segment forming a second pair of said switches, and wherein the switching converter switches alternately said first pair of said switches and said second pair of said switches.

10. The switching converter of claim 1, wherein said right-angle cross is formed from two line segments intersecting with a ninety degree angle, wherein the circuit board offsets only two of said switches perpendicularly to one of said line segments at the endpoints of said one line segment either in a clockwise or a counterclockwise directions.

11. The switching converter of claim 10, wherein, when the switching converter is mounted vertically, said one line segment is substantially vertical and one of said two switches is substantially below and offset horizontally from the second of said two switches so that while the switching converter is operating heat from the lower of said two switches does not flow vertically near the upper of said two switches.

12. A switching converter comprising:

a chassis;

a heat sink;

a circuit board having a first switch, a second switch, a third switch and a fourth switch connected thereto, wherein the circuit board includes cutouts, wherein said switches are located within the cutouts and mounted to the heat sink, wherein the heat sink and circuit board are mounted vertically within the chassis, and wherein the switches are located such that heat from any one of the switches does not flow vertically through the heat sink to the other switches.