Method for making dust cover, electronic device, and method for fixing dust cover to electronic device housing

• US 8,631,558 B2
• Filed: 08/30/2011
• Issued: 01/21/2014
• Est. Priority Date: 12/14/2010
• Status: Expired due to Fees

• Current Assignee: Futaihua Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Futaihua Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Inventors: Liang, Yan
• Primary Examiner(s): Edwards, Anthony Q
• Application Number:
  US13/220,963
• Publication Number:
  US 20120147534A1
• Time in Patent Office: 875 Days
• Field of Search: None
• US Class Current: 29/592
• CPC Class Codes: H04R 1/00 Details of transducers, loudspeakers or microphones
• CPC Class Codes: H04R 1/02 Casings; Cabinets ; Supports therefor; Mountings therein H04R1/28 takes precedence ; attachments for microphones H04R1/08; mounting of transducers in earpieces H04R1/1075
• CPC Class Codes: H04R 1/023 Screens for loudspeakers
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

A dust cover includes an anti-dust portion and an adhering portion integrally formed for framing the anti-dust portion. The anti-dust portion is a mesh sheet. The adhering portion is integrally formed on the anti-dust portion via a heat pressing process. The anti-dust portion is a coarser mesh, and the adhering portion is a mesh sheet with finer holes. The disclosure further provides a method for making the dust cover and an electronic device using the dust cover.

Claims

1. A method for making a dust cover, comprising the following steps:

providing a mesh object; and

heat pressing the mesh object to form an adhering portion adjacent to a peripheral edge of one surface of the mesh object and an anti-dust portion surrounded by the adhering portion;

wherein, the anti-dust portion is a coarser mesh, and the adhering portion is a mesh sheet with a plurality of finer holes.

2. The method for making the dust cover of claim 1, wherein the adhering portion has greater surface area than that of the anti-dust portion.

3. The method for making the dust cover of claim 1, wherein the mesh object is made of nylon material, and the heat pressing temperature of the heat pressing process is controlled between 80 to 120 degrees Celsius.

4. The method for making the dust cover of claim 3, wherein the heat pressing temperature of the heat pressing process is about 96 degrees Celsius.

5. An electronic device, comprising:

a housing defining a speaker hole; and

a dust cover fixedly mounted to the housing for covering the speaker hole of the housing, the dust cover comprising;

an anti-dust portion being a mesh sheet; and

an adhering portion, the adhering portion being an encircled frame integrally formed adjacent to a peripheral edge of one surface of the anti-dust portion;

wherein, the anti-dust portion is a coarser mesh, the adhering portion is a mesh sheet with a plurality of finer holes, the adhering portion is directly fixed to the housing surrounding the speaker hole, and the anti-dust portion covers the speaker hole.

6. The electronic device of claim 5, wherein the adhering portion comprises an adhering surface, the adhering surface of the adhering portion has greater surface area than that of the anti-dust portion.

7. A method for fixing a dust cover to an electronic device housing for protecting a speaker hole in the electronic device housing, comprising the following steps:

providing a mesh object;

heat pressing the mesh object to form an adhering portion adjacent to a peripheral edge of one surface of the mesh object and an anti-dust portion surrounded by the adhering portion; and

adhering the adhering portion to the electronic device housing surrounding the speaker hole by a double-sided tape, wherein the anti-dust portion covers the speaker hole.

8. The method for fixing the dust cover to the electronic device housing of claim 7, wherein the anti-dust portion is a coarser mesh, and the adhering portion is a mesh sheet with a plurality of finer holes.

9. The method for fixing the dust cover to the electronic device housing of claim 7, wherein the adhering portion has greater surface area than that of the anti-dust portion.

10. The method for fixing the dust cover to the electronic device housing of claim 7, wherein the mesh object is made of nylon material, and the heat pressing temperature of the heat pressing process is controlled between 80 to 120 degrees Celsius.

11. The method for fixing the dust cover to the electronic device housing of claim 7, wherein the heat pressing temperature of the heat pressing process is about 96 degrees Celsius.