Method of manufacturing rigid-flexible printed circuit board

• US 8,631,567 B2
• Filed: 03/08/2010
• Issued: 01/21/2014
• Est. Priority Date: 07/13/2006
• Status: Expired due to Fees

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Lee, Yang Je, Shin, Il Woon, Kim, Going Sik, Hong, Doo Pyo, Kim, Ha Il, An, Dong Gi
• Primary Examiner(s): Kim, Paul D
• Application Number:
  US12/719,618
• Publication Number:
  US 20100162562A1
• Time in Patent Office: 1,415 Days
• Field of Search: 298/25, 298/30, 298/31, 29846-848, 298/51, 298/55, 298/58, 156/184, 156/289, 174/254, 361/742, 361748-751, 361/804, 439/595, 439/637
• US Class Current: 29/846
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 2201/0195 Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2203/054 Continuous temporary metal layer over resist, e.g. for selective electroplating
• CPC Class Codes: H05K 2203/0554 Metal used as mask for etching vias, e.g. by laser ablation
• CPC Class Codes: H05K 3/0035 of blind holes, i.e. having a metal layer at the bottom
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: H05K 3/4652 Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: H05K 3/4664 Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence
• CPC Class Codes: H05K 3/4691 Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49158 with molding of insulated base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49171 : with encapsulating

Abstract

A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays.

Claims

1. A method of manufacturing a rigid-flexible printed circuit board, comprising:

providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed;

layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate;

forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region;

forming outer circuit patterns including areas adjacent to the first windows; and

applying solder resist in the rigid region to expose portions of the external circuit patterns,

wherein the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays.

2. The method as set forth in claim 1, wherein the via hole formed in the rigid region and the first windows formed in the flexible region are formed using a CO₂ laser.

3. The method as set forth in claim 1, further comprising, after layering the insulation layers and copper foil layers on portions of the coverlays:

forming a through hole in the rigid region through a drilling process; and

forming a second window in the cooper foil layer in the rigid region.

4. The method as set forth in claim 3, wherein further comprising forming a blind via hole in the rigid region to correspond to the second window.

5. The method as set forth in claim 1, further comprising, after applying the solder resist in the rigid region to expose portions of the external circuit patterns:

applying conductive paste to form ground shield layers on outer sides of the flexible region.