Differential temperature and acceleration compensated pressure transducer
First Claim
1. A pressure sensor, comprising:
- a chip;
a first pressure sensing device, disposed on a first portion of the chip;
a second pressure sensing device, disposed on a second portion of the chip;
a sealing pattern disposed on a third portion of the chip and between the first pressure sensing device and the second pressure sensing device, anda contact glass bonded to the chip in an overlying manner;
wherein the sealing pattern is used to physically isolate the first pressure sensing device from the second pressure sensing device.
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Accused Products
Abstract
A dual diaphragm pressure transducer, or sensor, with compensation for non-pressure effects is disclosed. The pressure sensor can include two pressure transducers located on separate portions of a chip. The first pressure transducer can be a differential pressure transducer, which produces a signal proportional to one or more applied pressures and includes other non-pressure effects. The second pressure transducer can be sealed in a hermetic chamber and thus can produce a signal proportional only to non-pressure effects. The signals can be combined to produce a signal proportional to the applied pressures with no non-pressure effects. The first and second pressure transducers can be physically and/or electrically isolated to improve sealing between the two pressure transducers and prevent pressure leaks therebetween.
24 Citations
17 Claims
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1. A pressure sensor, comprising:
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a chip; a first pressure sensing device, disposed on a first portion of the chip; a second pressure sensing device, disposed on a second portion of the chip; a sealing pattern disposed on a third portion of the chip and between the first pressure sensing device and the second pressure sensing device, and a contact glass bonded to the chip in an overlying manner; wherein the sealing pattern is used to physically isolate the first pressure sensing device from the second pressure sensing device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A pressure sensor, comprising:
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a chip; a first deflectable diaphragm, disposed on a first portion of the chip; a first set of two or more piezoresistors disposed on the first deflectable diaphragm, wherein the first set of two or more piezoresistors are used to measure a deflection of the first deflectable diaphragm; a second deflectable diaphragm, disposed on a second portion of the chip, wherein the second deflectable diaphragm is enclosed in a hermetically sealed chamber, wherein a first reference pressure is applied to a first side of the second deflectable diaphragm and a second reference pressure is applied to a second side of the second deflectable diaphragm, wherein the first reference pressure is substantially equivalent to the second reference pressure; a second set of two or more piezoresistors disposed on the second deflectable diaphragm, wherein the second set of two or more piezoresistors are used to measure a deflection of the second deflectable diaphragm; an interconnect for electrically connecting the first set of two or more piezoresistors to the second set of two or more piezoresistors to form a Wheatstone bridge; a contact glass bonded to the chip in an overlying manner; and a sealing pattern disposed on the chip to provide a sealing surface for the contact glass and to prevent pressure leaks between the first deflectable diaphragm and the second deflectable diaphragm. - View Dependent Claims (12, 13, 14, 15)
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16. A method of manufacturing a pressure sensor, comprising:
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disposing a first deflectable diaphragm on a first portion of a chip; disposing a second deflectable diaphragm on a second portion of the chip; mounting a first set of one or more piezoresistors on the first diaphragm; mounting a second set of one or more piezoresistors on the second diaphragm; connecting the first set of piezoresistors to the second set of piezoresistors using one or more interconnects having one or more gaps between the one or more interconnects to provide electrical isolation, wherein each of the one or more gaps comprising one or more narrowed portions disposed between the first deflectable diaphragm and the second deflectable diaphragm; oxidizing the chip to form a non-conductive oxide layer to seal over the one or more narrowed portions of the one or more gaps to prevent pressure leaks between the first diaphragm and the second diaphragm on the chip; and bonding a contact glass to the surface of the non-conductive oxide layer. - View Dependent Claims (17)
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Specification