Medical implant device
First Claim
1. A medical implant device, comprising a substrate having an undulating surface provided by peaks that are separated by recesses, wherein the device includes a porous coating layer provided on the undulating surface of the substrate and the porous coating layer includes a plurality of particles, wherein the spacing between adjacent peaks on the surface of the substrate is less than the particle size of the particles, and wherein particles are bonded to at least some of the peaks on the surface of the substrate and adjacent particles are bonded to one another.
1 Assignment
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Accused Products
Abstract
A medical implant device comprises a substrate (10) having an undulating surface provided by peaks (12) which are separated by recesses (14). The device includes a porous coating layer provided on the undulating surface of the substrate which comprises a plurality of particles (16). The spacing between adjacent peaks on the surface of the substrate is less than the particle size of the particles. The particles are bonded to the peaks on the surface of the substrate and adjacent particles are bonded to one another.
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Citations
14 Claims
- 1. A medical implant device, comprising a substrate having an undulating surface provided by peaks that are separated by recesses, wherein the device includes a porous coating layer provided on the undulating surface of the substrate and the porous coating layer includes a plurality of particles, wherein the spacing between adjacent peaks on the surface of the substrate is less than the particle size of the particles, and wherein particles are bonded to at least some of the peaks on the surface of the substrate and adjacent particles are bonded to one another.
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14. A method of making a medical implant device, comprising:
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a. forming a substrate having an undulating surface provided by peaks which are separated by recesses, b. applying a layer of particles on the said surface of the substrate, wherein the spacing between adjacent peaks on the surface of the substrate is less than the particle size of the particles, and c. bonding (i) particles to the peaks on the surface of the substrate and (ii) adjacent particles to one another.
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Specification