Methods of manufacture of top port multipart surface mount silicon condenser microphone package

• US 8,633,064 B1
• Filed: 03/15/2013
• Issued: 01/21/2014
• Est. Priority Date: 11/28/2000
• Status: Expired due to Term

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Minervini, Anthony D.
• Primary Examiner(s): Chambliss, Alonzo
• Application Number:
  US13/841,796
• Time in Patent Office: 312 Days
• Field of Search: None
• US Class Current: 438/125
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/092 Buried interconnects in the substrate or in the lid
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81B 7/0038 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: B81C 3/00 Assembling of devices or systems from individually processed components
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 1/222 for microphones H04R1/24, H04R1/26 take precedence
• CPC Class Codes: H04R 1/2892 Mountings or supports for transducers
• CPC Class Codes: H04R 19/005 : using semiconductor materials
• CPC Class Codes: H04R 19/016 : for microphones
• CPC Class Codes: H04R 19/04 : Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 : Mems transducers or their use
• CPC Class Codes: H04R 2225/49 : Reducing the effects of electromagnetic noise on the functioning of hearing aids, by, e.g. shielding, signal processing adaptation, selective (de)activation of electronic parts in hearing aid
• CPC Class Codes: H04R 23/00 : Transducers other than those covered by groups H04R9/00 - H04R21/00 diaphragms for transducers of the distributed-mode type H04R7/045
• CPC Class Codes: H04R 2410/03 : Reduction of intrinsic noise in microphones
• CPC Class Codes: H04R 3/00 : Circuits for transducers , loudspeakers or microphones
• CPC Class Codes: H04R 31/006 : Interconnection of transducer parts of diaphragm and outer suspension by moulding H04R31/003
• CPC Class Codes: Y10T 29/49005 : Acoustic transducer
• CPC Class Codes: Y10T 29/4908 : Acoustic transducer
• CPC Class Codes: Y10T 29/49798 : Dividing sequentially from leading end, e.g., by cutting or breaking

Abstract

The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device'"'"'s printed circuit board and for making electrical connections between package and the device'"'"'s sprinted circuit board.

Claims

1. A method of manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphone devices, the method comprising:

providing an unsingulated panel comprised of a plurality of individual substrates, each substrate having a planar upper surface and a planar lower surface, the upper surface having an interior region and a peripheral region that completely surrounds the interior region, each individual substrate further comprising;

a first plurality of metal pads disposed on the upper surface of the individual substrate;

a second plurality of metal pads disposed on the lower surface of the individual substrate and arranged within a perimeter of the lower surface of the individual substrate, wherein the second plurality of metal pads are configured to mechanically attach and electrically couple the surface mount MEMS microphone device to pads on a surface of an external printed circuit board; and

one or more electrical pathways disposed completely within the individual substrate, wherein the pathways electrically couple one or more of the first plurality of metal pads on the upper surface of the individual substrate to one or more of the second plurality of metal pads on the lower surface of the individual substrate;

providing an unsingulated panel comprised of a plurality of individual lids, each lid having an upper surface and a planar lower surface, the lower surface of each lid having an interior region and a peripheral region that completely surrounds the interior region of the lid, the lid further comprising an acoustic port disposed in the interior region of the lower surface of the lower surface of the lid and passing through the lid;

providing an unsingulated panel comprised of a plurality of individual sidewall spacers, each sidewall spacer having a top surface, a bottom surface, and a window having walls that extend between the top surface and the bottom surface of the sidewall spacer, wherein the unsingulated panel of sidewall spacers has a predefined thickness;

mounting a MEMS microphone die on the lower surface of each lid in the unsingulated panel of lids, each MEMS microphone die being arranged directly over the acoustic port in its respective lid;

attaching the unsingulated panel of substrates, the unsingulated panel of sidewall spacers and the unsingulated panel of lids to each other in a predetermined order, wherein the interior region of the upper surface of each substrate, the walls of the window of its respective sidewall spacer, and the interior region of the lower surface of its respective lid, when attached, define an acoustic chamber that surrounds its respective MEMS microphone die, wherein attaching further comprises electrically coupling each MEMS microphone die to at least one of the first plurality of metal pads on the upper surface of its respective substrate; and

singulating the attached panels into a plurality of individual MEMS microphone devices, wherein the respective lid, sidewall spacer, and substrate of each MEMS microphone device form a housing after singulation of the attached panels, and wherein the housing has surfaces substantially perpendicular to the lower surface of the substrate.

2. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 1, wherein the predetermined order of attaching the unsingulated panels comprises:

attaching the unsingulated panel of substrates to the unsingulated panel of sidewall spacers, wherein the bottom surface of each sidewall spacer is aligned to the peripheral region of the upper surface of its respective substrate in the panel of substrates; and

attaching the unsingulated panel of lids to the joined panels of sidewall spacers and substrates, wherein the peripheral region of the lower surface of each lid is aligned to the top surface of its respective sidewall spacer in the panel of sidewall spacers.

3. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 1, wherein the predetermined order of attaching the unsingulated panels comprises:

attaching the unsingulated panel of lids to the unsingulated panel of sidewall spacers, wherein the peripheral region of the lower surface of each lid is aligned to the top surface of its respective sidewall spacer in the panel of sidewall spacers; and

attaching the unsingulated panel of substrates to the joined panels of sidewall spacers and lids, wherein the bottom surface of each sidewall spacer is aligned to the peripheral region of the upper surface of its respective substrate in the panel of substrates.

4. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 1, wherein the housing protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage.

5. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 1, wherein at least a portion of the walls of the window of the sidewall spacer is coated with conductive material.

6. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 5, wherein at least a portion of the lower surface of the lid is coated with conductive material.

7. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 6, wherein the conductive material on the walls of the window of the sidewall spacer is electrically coupled to the conductive material on the lower surface of its respective lid.

8. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 1, wherein the housing further comprises acoustic material that substantially blocks environmental contaminants from entering the acoustic chamber through the acoustic port.

9. A method of manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphone devices, the method comprising:

providing an unsingulated panel comprised of a plurality of individual bottom portions, each bottom portion comprising multiple layers of non-conductive material and having a planar upper surface and a planar lower surface, the upper surface having an interior region and a peripheral region that completely surrounds the interior region, each individual bottom portion further comprising;

a first plurality of metal pads disposed on the upper surface of the individual bottom portion;

a second plurality of metal pads disposed on the lower surface of the individual bottom portion and arranged within a perimeter of the lower surface of the individual bottom portion, wherein the second plurality of metal pads are configured to mechanically attach and electrically couple the surface mount MEMS microphone device to pads on a surface of an external printed circuit board; and

one or more electrical pathways disposed completely within the individual bottom portion, wherein the pathways electrically couple one or more of the first plurality of metal pads on the upper surface of the individual bottom portion to one or more of the second plurality of metal pads on the lower surface of the individual bottom portion;

providing an unsingulated panel comprised of a plurality of individual top portions, each top portion having an upper surface and a planar lower surface, the lower surface of each top portion having an interior region and a peripheral region that completely surrounds the interior region of the top portion, the top portion further comprising an acoustic port disposed in the interior region of the lower surface of the top portion and passing through the top portion;

providing an unsingulated panel comprised of a plurality of individual sidewall portions, wherein each sidewall portion has a top surface and a bottom surface, and is comprised of at least one layer of non-conductive material having a predefined thickness, and wherein at least a portion of the top surface of each sidewall portion is coated with conductive material, and each sidewall portion further comprises an opening having walls that extend between the top surface and the bottom surface of the sidewall portion;

mounting a MEMS microphone die on the lower surface of each top portion in the panel of unsingulated top portions, each MEMS microphone die being arranged directly over the acoustic port in its respective top portion;

electrically coupling each MEMS microphone die to at least one of the first plurality of metal pads on the upper surface of its respective bottom portion;

mechanically attaching the unsingulated panel of bottom portions, the unsingulated panel of sidewall portions and the unsingulated panel of top portions to each other in a predetermined order, wherein the interior region of the upper surface of each bottom portion, the walls of the opening of its respective sidewall portion, and the interior region of the lower surface of its respective top portion, when attached, define an acoustic chamber that surrounds its respective MEMS microphone die, wherein attaching further comprises electrically coupling each MEMS microphone die to at least one of the first plurality of metal pads on the upper surface of its respective bottom portion; and

singulating the attached panels into a plurality of individual MEMS microphone devices, wherein the respective top portion, sidewall portion, and bottom portion of each MEMS microphone device form a housing after singulation of the attached panels, wherein the housing has surfaces substantially perpendicular to the lower surface of the bottom portion.

10. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 9, wherein the predetermined order of attaching the unsingulated panels comprises:

mechanically attaching the unsingulated panel of bottom portions to the unsingulated panel of sidewall portions, wherein the bottom surface of each sidewall portion is aligned to the peripheral region of the upper surface of its respective bottom portion in the panel of bottom portions; and

mechanically attaching the unsingulated panel of top portions to the joined panels of sidewall portions and bottom portions, wherein the peripheral region of the lower surface of each top portion is aligned to the top surface of its respective sidewall portion in the panel of sidewall portions.

11. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 9, wherein the predetermined order of attaching the unsingulated panels comprises:

mechanically attaching the unsingulated panel of top portions to the unsingulated panel of sidewall portions, wherein the peripheral region of the lower surface of each top portion is aligned to the top surface of its respective sidewall portion in the panel of sidewall portions; and

mechanically attaching the unsingulated panel of bottom portions to the joined panels of sidewall portions and top portions, wherein the bottom surface of each sidewall portion is aligned to the peripheral region of the upper surface of its respective bottom portion in the panel of bottom portions.

12. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 9, wherein the housing protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage.

13. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 9, wherein at least a portion of the walls of the opening of the sidewall portion is coated with conductive material.

14. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 13, wherein at least a portion of the lower surface of the top portion is coated with conductive material.

15. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 14, wherein the conductive material on the walls of the opening of the sidewall portion is electrically coupled to the conductive material on the lower surface of the top portion.

16. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 9, wherein the housing further comprises acoustic material that substantially blocks environmental contaminants from entering the acoustic chamber through the acoustic port.

17. A method of manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphone devices, the method comprising:

providing an unsingulated panel comprised of a plurality of individual substrates, each substrate comprising multiple layers of non-conductive material and having a planar upper surface and a planar lower surface, the upper surface having an interior region and a peripheral region that completely surrounds the interior region, each individual substrate further comprising;

a first plurality of metal pads disposed on the upper surface of the individual substrate;

a second plurality of metal pads disposed on the lower surface of the individual substrate and arranged within a perimeter of the lower surface of the individual substrate, wherein the second plurality of metal pads are configured to mechanically couple and electrically couple the surface mount MEMS microphone device to pads on a surface of an external printed circuit board; and

one or more electrical pathways disposed completely within the individual substrate, wherein the pathways electrically couple one or more of the first plurality of metal pads on the upper surface of the individual substrate to one or more of the second plurality of metal pads on the lower surface of the individual substrate;

providing an unsingulated panel comprised of a plurality of individual lids, each lid having an upper surface and a planar lower surface, the lower surface of each lid having an interior region and a peripheral region that completely surrounds the interior region of the lid, the lid further comprising an acoustic port disposed in the interior region of the lower surface of the lid and passing through the lid;

providing an unsingulated panel comprised of a plurality of individual sidewall spacers, wherein each sidewall spacer has a top surface and a bottom surface, and is comprised of at least one layer of non-conductive material having a predefined thickness, and wherein at least a portion of the top surface of each sidewall spacer is coated with conductive material, and each sidewall spacer further comprises a window having walls that extend between the top surface and the bottom surface of the sidewall spacer;

physically coupling a MEMS microphone die on the lower surface of each lid in the unsingulated panel of lids, each MEMS microphone die being arranged directly over the acoustic port in its respective lid;

physically coupling the unsingulated panel of substrates, the unsingulated panel of sidewall spacers and the unsingulated panel of lids to each other in a predetermined order, wherein the interior region of the upper surface of each substrate, the walls of the window of its respective sidewall spacer, and the interior region of the lower surface of its respective lid, when coupled, define an acoustic chamber that surrounds its respective MEMS microphone die, wherein coupling further comprises electrically coupling each MEMS microphone die to at least one of the first plurality of metal pads on the upper surface of its respective substrate; and

singulating the coupled panels into a plurality of individual MEMS microphone devices, wherein the respective lid, sidewall spacer, and substrate of each MEMS microphone device form a housing after singulation of the coupled panels, wherein the housing has surfaces substantially perpendicular to the lower surface of the substrate.

18. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 17, wherein the predetermined order of physically coupling the unsingulated panels comprises:

physically coupling the unsingulated panel of substrates to the unsingulated panel of sidewall spacers, wherein the bottom surface of each sidewall spacer is aligned to the peripheral region of the upper surface of its respective substrate in the panel of substrates; and

physically coupling the unsingulated panel of lids to the joined panels of sidewall spacers and substrates, wherein the peripheral region of the lower surface of each lid is aligned to the top surface of its respective sidewall spacer in the panel of sidewall spacers.

19. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 17, wherein the predetermined order of physically coupling the unsingulated panels comprises:

physically coupling the unsingulated panel of lids to the unsingulated panel of sidewall spacers, wherein the peripheral region of the lower surface of each lid is aligned to the top surface of its respective sidewall spacer in the panel of sidewall spacers; and

physically coupling the unsingulated panel of substrates to the joined panels of sidewall spacers and lids, wherein the bottom surface of each sidewall spacer is aligned to the peripheral region of the upper surface of its respective substrate in the panel of substrates.

20. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 17, wherein the housing protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage.

21. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 17, wherein at least a portion of the lower surface of the lid is coated with conductive material, and wherein at least a portion of the walls of the window of the sidewall spacer is coated with conductive material.

22. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 21, wherein the conductive material on the walls of the window of the sidewall spacer is electrically coupled to the conductive material on the lower surface of the lid.

23. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 22, wherein the conductive material on the walls of the window of the sidewall spacer is electrically coupled to at least one of the first plurality of metal pads on the upper surface of the substrate.

24. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 17, wherein the housing further comprises acoustic material that substantially blocks environmental contaminants from entering the acoustic chamber through the acoustic port.

25. A method of manufacturing a plurality of solder reflow surface mount microelectromechanical system (MEMS) microphone devices, the method comprising:

providing an unsingulated panel comprised of a plurality of individual printed circuit boards, each printed circuit board having a multi-layer core of conductive and non-conductive materials, wherein the printed circuit board has a planar upper surface and a planar lower surface, the upper surface having an interior region and a peripheral region that completely surrounds the interior region, each individual printed circuit board further comprising;

a first metal layer disposed on the upper surface of the printed circuit board and patterned into a first plurality of metal pads, wherein at least one pad of the first plurality of metal pads is disposed in the peripheral region of the upper surface of the individual printed circuit board;

a second metal layer disposed on the lower surface of the printed circuit board and patterned into a second plurality of metal pads, the second plurality of metal pads arranged within a perimeter of the lower surface of the individual printed circuit board, wherein the second plurality of metal pads are configured to mechanically couple and electrically couple the surface mount MEMS microphone device to pads on a surface of an external printed circuit board; and

one or more electrical pathways disposed completely within the individual printed circuit board, wherein the pathways electrically couple one or more of the first plurality of metal pads on the upper surface of the individual printed circuit board to one or more of the second plurality of metal pads on the lower surface of the individual printed circuit board;

providing an unsingulated panel comprised of a plurality of individual top portions, each top portion having an upper surface and a planar lower surface, the lower surface of each top portion having an interior region and a peripheral region that completely surrounds the interior region of the top portion, the top portion further comprising an acoustic port disposed in the interior region of the lower surface of the top portion and passing through the top portion, wherein at least a portion of the lower surface of each top portion is coated with conductive material;

providing an unsingulated panel comprised of a plurality of individual sidewall portions, wherein each sidewall portion has a top surface and a bottom surface, and is comprised of at least one layer of non-conductive material having a predefined thickness, and wherein at least a portion of the top surface of each sidewall portion is coated with conductive material, and each sidewall portion further comprises an opening having walls that extend between the top surface and the bottom surface of the sidewall portion;

physically coupling a MEMS microphone die on the lower surface of each top portion in the unsingulated panel of top portions, each MEMS microphone die being arranged directly over the acoustic port in its respective top portion;

physically coupling the unsingulated panel of printed circuit boards, the unsingulated panel of sidewall portions and the unsingulated panel of top portions to each other in a predetermined order, wherein the interior region of the upper surface of each printed circuit board, the walls of the opening of its respective sidewall portion, and the interior region of the lower surface of its respective top portion, when coupled, define an acoustic chamber that surrounds its respective MEMS microphone die, wherein coupling further comprises electrically coupling each MEMS microphone die to at least one of the first plurality of metal pads on the upper surface of its respective printed circuit board; and

singulating the coupled panels into a plurality of individual MEMS microphone devices, wherein the respective top portion, sidewall portion, and printed circuit board of each MEMS microphone device form a housing after singulation of the coupled panels wherein the housing has surfaces substantially perpendicular to the lower surface of the printed circuit board.

26. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 25, wherein the predetermined order of physically coupling the unsingulated panels comprises:

physically coupling the unsingulated panel of printed circuit boards to the unsingulated panel of sidewall portions, wherein the bottom surface of each sidewall portion is aligned to the peripheral region of the upper surface of its respective printed circuit board in the panel of printed circuit boards; and

physically coupling the unsingulated panel of top portions to the joined panels of sidewall portions and printed circuit boards, wherein the peripheral region of the lower surface of each top portion is aligned to the top surface of its respective sidewall portion in the panel of sidewall portions.

27. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 25, wherein the predetermined order of physically coupling the unsingulated panels comprises:

physically coupling the unsingulated panel of top portions to the panel of sidewall portions, wherein the peripheral region of the lower surface of each top portion is aligned to the top surface of its respective sidewall portion in the panel of sidewall portions; and

physically coupling the unsingulated panel of printed circuit boards to the joined panels of sidewall portions and top portions, wherein the bottom surface of each sidewall portion is aligned to the peripheral region of the upper surface of its respective printed circuit board in the panel of printed circuit boards.

28. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 25, wherein the housing protects the MEMS microphone die from at least one of light, electromagnetic interference, and physical damage.

29. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 25, wherein at least a portion of the walls of the opening of the sidewall portion is coated with conductive material, and the conductive material on the walls of the opening of the sidewall portion is electrically coupled to the conductive material on the lower surface of the top portion;

and

wherein the conductive material on the walls of the opening of the sidewall portion is electrically coupled to at least one metal pad disposed in the peripheral region of the upper surface of the printed circuit board.

30. A method of manufacturing a plurality of surface mount MEMS microphone devices according to claim 25, wherein the housing further comprises acoustic material that substantially blocks environmental contaminants from entering the acoustic chamber through the acoustic port.