Printed circuit board, manufacturing method thereof and radio-frequency device

• US 8,633,393 B2
• Filed: 05/27/2010
• Issued: 01/21/2014
• Est. Priority Date: 12/14/2007
• Status: Active Grant

• Current Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Inventors: Yang, Ruiquan, Sheng, Haiqiang, Li, Hongcai
• Primary Examiner(s): Dinh, Tuan T
• Assistant Examiner(s): SAWYER, STEVEN T
• Application Number:
  US12/789,247
• Publication Number:
  US 20100238635A1
• Time in Patent Office: 1,335 Days
• Field of Search: 361/748, 361/751, 361/525, 174/252
• US Class Current: 174/252
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/025 Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H01L23/66
• CPC Class Codes: H05K 1/03 Use of materials for the substrate
• CPC Class Codes: H05K 1/036 Multilayers with layers of different types
• CPC Class Codes: H05K 1/11 Printed elements for providing electric connections to or between printed circuits
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 2201/09845 Stepped hole, via, edge, bump or conductor
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB metallic supports H05K3/0061
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/4688 Composite multilayer circuits, i.e. comprising insulating layers having different properties having a special base or central core H05K3/4602
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A printed circuit board (PCB) is provided. The PCB includes a first microwave board material, a second prepreg, and a third ordinary board material that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.

Claims

1. A Printed Circuit Board (PCB), comprising:

a first board material, a second board material, and a third board material sequentially pressed together, wherein the first board material, the second board material, and the third board material are provided with an opening respectively;

at least two of the openings have different sizes, wherein, the openings are used for accommodating a heat-dissipation metal block, a surface of the heat-dissipation metal block is solder with a soldering surface of at least one of the first board material, the second board material, and the third board material, wherein, in the first board material the second board material and the third board material, corresponding two openings of at least two of the first board material the second board material and the third board material form a step-shaped region, and the board material in a region between boundaries of the two openings forming the step-shaped region is provided with a soldering surface on one surface thereof close to a larger opening of the two openings and the soldering surface is configured to solder a corresponding region of a partially-sintered heat-dissipation metal block, wherein, the first board material is a high-frequency PCB material, the second board material is a prepreg, and the third board material is a low-frequency PCB material, and each of the first board material, the second board material and the third board material comprises at least one layer.

2. The PCB according to claim 1, wherein, a borehole passing through the three board materials is further provided in a region outside the largest opening.

3. The PCB according to claim 1, wherein, at least one borehole is provided with a back-drilled hole or a back-drilled groove.

4. A method for manufacturing a Printed Circuit Board (PCB), comprising:

forming an opening in each of a first board material, a second board material, and a third board material respectively, at least two of the openings have different sizes;

wherein the openings are used for accommodating a heat-dissipation metal block, a surface of the heat-dissipation metal block is solder with a soldering surface of at least one of the first board material, the second board material, and the third board material;

stacking the first board material, the second board material, and the third board material are-sequentially; and

pressing the stacked first board material, second board material, and third board material together; and

wherein after stacking and pressing, in the first board material the second board material and the third board material corresponding two openings of at least two of the first board material the second board material, and the third board material form a step-shaped region; and

the board material in a region between boundaries of the two openings forming the step-shaped region is provided with a soldering surface on one surface thereof close to a larger opening of the two openings and the soldering surface is configured to solder a corresponding region of a partially-sintered heat-dissipation metal block, wherein, the first board material is a high-frequency PCB material, the second board material is a prepreg, and the third board material is a low-frequency PCB material, and each of the first board material, the second board material and the third board material comprises at least one layer.

5. The method according to claim 4, wherein, the method further comprises:

forming a borehole which is in a region outside the largest opening and passes through the three board materials.

6. The method according to claim 4, wherein, the method further comprises:

back-drilling on a part chosen from a borehole which has been metallized in the pressed board material from backside.

7. The method according to claim 5, wherein, the method further comprises:

mounting a radio-frequency component or a heat sink on the pressed board material.

8. The method according to claim 7, wherein, the step of mounting a radio-frequency component or a heat sink on the pressed board material comprises:

soldering a component on the back surface and/or the front surface of the laminated PCB;

fixing a heat-dissipation metal block with the opening by mounting and sintering the heat-dissipation metal block to the opening; and

mounting the heat sink on the heat-dissipation metal block.

9. A radio-frequency device, comprising:

a Printed Circuit Board (PCB) and a radio-frequency component mounted on the PCB, wherein the PCB comprises a first board material, a second board material, and a third board material sequentially pressed together;

the first board material, the second board material, and the third board material are provided with an opening respectively; and

at least two of the openings have different sizes, wherein the openings are used for accommodating a heat-dissipation metal block, a surface of the heat-dissipation metal block is solder with a soldering surface of at least one of the first board material, the second board material, and the third board material, wherein in the first board material the second board material, and the third board material, corresponding two openings of at least two of the first board material the second board material, and the third board material form a step-shaped region, and the board material in a region between boundaries of the two openings forming the step-shaped region is provided with a soldering surface on one surface thereof close to a larger opening of the two openings and the soldering surface is configured to solder a corresponding region of a partially-sintered heat-dissipation metal block, wherein, the first board material is a high-frequency PCB material, the second board material is a prepreg, and the third board material is a low-frequency PCB material, and each of the first board material, the second board material and the third board material comprises at least one layer.

10. The radio-frequency device according to claim 9, wherein, a borehole passing through the three board materials is further provided in a region outside the largest opening.

11. The radio-frequency device according to claim 9, wherein, at least one borehole is provided with a back-drilled hole or a back-drilled groove.

12. The radio-frequency device according to claim 9, wherein, the radio-frequency device is a base station and the radio-frequency component is one of a high-power radio-frequency PA low noise amplifier or a transceiver and a power supply circuit component.