Source/drain stack stressor for semiconductor device
First Claim
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1. A semiconductor device comprising:
- a substrate;
a fin formed by a first semiconductor material have a first lattice constant on the substrate;
a gate region formed on a portion of the fin on the substrate;
a source region and a drain region separated by the gate region on the substrate;
a source/drain stack having a thickness (T) on the source and drain region;
a second semiconductor material, having a second lattice constant, as a bottom portion of the source/drain stack and contacting a low portion of the fin in the gate region, wherein the second lattice constant is substantial smaller than the first lattice constant; and
a third semiconductor material, having a third lattice constant and a thickness (t), on top of the second semiconductor material as an upper portion of the source/drain stack and contacting an upper portion of the fin in the gate region, wherein the third lattice is larger or equal to the first lattice constant.
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Abstract
The present disclosure provides a semiconductor device. The device includes a substrate, a fin structure formed by a first semiconductor material, a gate region on a portion of the fin, a source region and a drain region separated by the gate region on the substrate and a source/drain stack on the source and drain region. A low portion of the source/drain stack is formed by a second semiconductor material and it contacts a low portion of the fin in the gate region. An upper portion of the source/drain stack is formed by a third semiconductor material and it contacts an upper portion of the fin in the gate region.
175 Citations
20 Claims
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1. A semiconductor device comprising:
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a substrate; a fin formed by a first semiconductor material have a first lattice constant on the substrate; a gate region formed on a portion of the fin on the substrate; a source region and a drain region separated by the gate region on the substrate; a source/drain stack having a thickness (T) on the source and drain region; a second semiconductor material, having a second lattice constant, as a bottom portion of the source/drain stack and contacting a low portion of the fin in the gate region, wherein the second lattice constant is substantial smaller than the first lattice constant; and a third semiconductor material, having a third lattice constant and a thickness (t), on top of the second semiconductor material as an upper portion of the source/drain stack and contacting an upper portion of the fin in the gate region, wherein the third lattice is larger or equal to the first lattice constant. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor device comprising:
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a substrate having a first fin; a second fin on top of the first fin, formed by epitaxial growth germanium (Ge); a gate region formed on a portion of the second fin; a source region and a drain region separated by the gate region on the substrate; a source/drain stack having a thickness (T) on the source and drain region beside of the second Ge fin in the gate region; an epitaxially grown silicon germanium (SiGe) as a bottom portion of the source/drain stack and contacting a lower portion of the second Ge fin; and an epitaxially grown Ge, having a thickness (t), on top of the SiGe as an upper portion of source/drain stack and contacting an upper portion of the second Ge fin in the gate region. - View Dependent Claims (13, 14)
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15. A method for fabricating a fin field-effect transistor (FinFET) device, the method comprising:
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providing a substrate having first fins and isolation regions between the first fins; recessing the first fins; epitaxially growing a first semiconductor material having a first lattice constant to form second fin on the recessed first fins; forming a dummy gate stack on a portion of the second fins, wherein the portion of the second fins being defined as a gate region; recessing a portion of the second fins beside the dummy gate stack to form a source/drain region; epitaxially growing a second semiconductor material having a second lattice constant in the source/drain region to form a lower portion of a source/drain stack and contacting a lower portion of the second fin in the gate region, where in the second lattice constant is substantial smaller than the first lattice constant; and epitaxially growing a third semiconductor material having a third lattice constant in the source/drain region to form an upper portion of a source/drain stack and contacting an upper portion of the second fin in the gate region, where in the third lattice constant is substantial larger than the second lattice constant. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification