Coupled MEMS structure for motion amplification

• US 8,633,787 B2
• Filed: 09/21/2007
• Issued: 01/21/2014
• Est. Priority Date: 09/22/2006
• Status: Active Grant

• Current Assignee: Cornell Research Foundation Incorporated (Cornell University)
• Original Assignee: Cornell Research Foundation Incorporated (Cornell University)
• Inventors: Desai, Shahyaan, Netravali, Anil N., Thompson, Michael O.
• Primary Examiner(s): Summons, Barbara
• Application Number:
  US12/442,369
• Publication Number:
  US 20100295414A1
• Time in Patent Office: 2,314 Days
• Field of Search: 333/186, 333/197, 310/309, 735/040.4, 735/041.2, 735/041.3, 735/041.4, 735/041.5
• US Class Current: 333/186
• CPC Class Codes: G01P 15/097 by vibratory elements
• CPC Class Codes: H02N 1/002 Electrostatic motors
• CPC Class Codes: H03H 9/2457 Clamped-free beam resonators

Abstract

A microelectromechanical structure (MEMS) device includes a secondary MEMS element displaceably coupled to a substrate. A primary MEMS element is displaceably coupled to the secondary MEMS element and has a resonant frequency substantially equal to the secondary MEMS element and has a much larger displacement than the secondary MEMS element.

Claims

1. A microelectromechanical structure (MEMS) device comprising:

a secondary cantilever MEMS element displaceably coupled to a substrate; and

a primary cantilever MEMS element displaceably coupled to the secondary cantilever MEMS element and having a resonant frequency substantially equal to the secondary cantilever MEMS element and having a much larger displacement than the secondary cantilever MEMS element.

2. The device of claim 1 wherein the primary cantilever MEMS element comprises a primary element of mass, m, supported by a primary arm with spring constant, k, coupled to the secondary cantilever MEMS element.

3. The device of claim 2 wherein the secondary cantilever MEMS element comprises a secondary element of mass, M, supported by a secondary arm with spring constant, K, coupled to the substrate.

4. The device of claim 3 wherein the primary arm is longer than the secondary arm.

5. The device of claim 3 wherein the primary arm is coupled to the secondary element.

6. The device of claim 3 wherein k/m is approximately equal to K/M.

7. The device of claim 6 wherein m is less than M.

8. A microelectromechanical structure (MEMS) device comprising:

a secondary cantilever MEMS resonator coupled to a substrate; and

a primary cantilever MEMS resonator coupled to the secondary cantilever MEMS resonator and having a resonant frequency substantially equal to the secondary cantilever MEMS resonator, wherein the primary cantilever MEMS resonator is coupled to the secondary cantilever MEMS resonator to provide a much larger displacement than the secondary cantilever MEMS resonator.

9. The device of claim 8 wherein the primary cantilever MEMS resonator comprises a primary element of mass, m, supported by a primary arm with spring constant, k, coupled to the secondary cantilever MEMS resonator and wherein the secondary cantilever MEMS resonator comprises a secondary element of mass, M, supported by a secondary arm with spring constant, K, coupled to the substrate.

10. The device of claim 9 wherein the primary arm is longer than the secondary arm and wherein the primary arm is coupled to the secondary element.

11. The device of claim 9 wherein k/m is approximately equal to K/M and wherein m is less than M.

12. A method comprising:

subjecting a secondary cantilever MEMS resonator that is coupled to a substrate to a source of energy to cause it to vibrate at a resonant frequency; and

causing a primary cantilever MEMS resonator coupled to the secondary cantilever MEMS resonator to vibrate at the resonant frequency, wherein both the primary and secondary cantilever MEMS resonators have approximately the same resonant frequency.

13. The method of claim 12 wherein the secondary cantilever MEMS resonator ceases vibrating with most of the vibration energy being applied to the primary cantilever MEMS resonator increasing a vibration displacement of the primary cantilever MEMS resonator in response to the source of energy.

14. The method of claim 12 wherein the primary cantilever MEMS resonator has a mass less than a mass of the secondary cantilever MEMS resonator.

15. The method of claim 12 wherein the source of energy is applied to the secondary cantilever MEMS resonator by at least one of piezoelectric, electrostatic, electromagnetic, and thermal actuation.

16. The method of claim 15 wherein the source of energy has a frequency at or near the resonant frequency of the cantilever MEMS resonators.