ESD protection in a very small form factor consumer electronic product

• US 8,634,178 B2
• Filed: 08/27/2010
• Issued: 01/21/2014
• Est. Priority Date: 08/27/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Dabov, Teodor, Yeates, Kyle, Montevirgen, Anthony
• Primary Examiner(s): Barnie, Rexford
• Assistant Examiner(s): BROOKS, ANGELA D
• Application Number:
  US12/870,513
• Publication Number:
  US 20120050938A1
• Time in Patent Office: 1,243 Days
• Field of Search: None
• US Class Current: 361/220
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: G06F 1/1658 related to the mounting of internal components, e.g. disc drive or any other functional module
• CPC Class Codes: H05F 3/02 by means of earthing connections
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2203/044 Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
• CPC Class Codes: H05K 3/3415 on both sides of the substrate or combined with lead-in-hole components
• CPC Class Codes: H05K 3/3468 Applying molten solder
• CPC Class Codes: H05K 9/0007 Casings standardised racks H05K9/0062
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A very small form factor consumer electronic product includes at least a single piece housing having an integral front and side walls that cooperate to form a cavity in cooperation with a front opening where an edge of the side walls define a rear opening and at least some of the edges have flanges. The consumer electronic product also includes an user input assembly having a size and shape in accordance with the front opening and a clip assembly having a size and shape in accordance with the rear opening and having an external user actionable clip, a plurality of internal hooking features, and a plurality of internal latching features. The clip assembly is secured by engaging at least some of the hooking features and the flanges on the edges of the housing and engaging the latching features and corresponding attachment features on the internal support plate.

Claims

1. A media player, comprising:

a housing having an anodized aluminum surface; and

a button assembly that includes an external feature arranged to receive a user input event, the external feature being connected to an internal switch displaced from the external feature by way of an electrically conductive arm that fits through a slit in a moisture flow inhibiting seal formed of an insulating material, wherein at least a portion of the seal is combined with a conductive dopant such that a conductive path is formed between the electrically conductive arm and a portion of the anodized surface of the housing along which a portion of a surface layer has been removed, the conductive path allowing a quantity of charge deposited at the external feature to flow directly to the portion of the anodized surface of the housing by way of the electrically conductive arm and the conductive portion of the seal, thereby bypassing the internal switch.

2. The media player, as recited in claim 1, wherein the housing provides a chassis ground and has a cavity sized to enclose a plurality of operational components at least some of which are susceptible to damage when exposed to an electrostatic discharge (ESD) event.

3. The media player as recited in claim 1, wherein the dopant comprises a plurality of silver micro-spheres.

4. A media player, comprising:

a housing having an anodized aluminum surface; and

a button assembly comprising;

an external feature arranged to receive a user input event, an electrically conductive arm arranged to connect the external feature to an internal switch, a metal base portion integrally formed with the external feature, the metal base portion connecting the external feature to the electrically conductive arm; and

a metal label conductively mounted to the metal base portion, wherein the metal label is conductively mounted to the metal base portion using a conductive adhesive such that a conductive path is formed between the external feature and a portion of the aluminum surface of the housing along which a surface layer has been substantially removed by way of the metal label and the metal base portion, the conductive path allowing a quantity of charge deposited at the external feature to flow directly to the portion of the anodized surface of the housing and bypass the internal switch.

5. The media player as recited in claim 4, wherein the conductive adhesive is solder.

6. The media player as recited in claim 4, wherein the portion of the surface of the housing along which the surface layer has been substantially removed comprises exposed aluminum.

7. A method comprising:

obtaining a housing comprising an anodized aluminum surface, the housing having at least one opening;

obtaining a button assembly that includes an external feature arranged to receive a user input event, the external feature being connected to an internal switch displaced from the external feature by way of an electrically conductive arm;

obtaining a block formed of an electrically insulating and moisture resistant material having a slot sized to accommodate the electrically conductive arm;

introducing a conductive dopant into at least a portion of the block such that the portion of the block is electrically conductive;

inserting the external feature into the opening in the housing; and

inserting the electrically conductive arm into and through the slot in electrical contact with the conductive portion of the block, wherein a conductive path is formed between the external feature and a portion of the anodized aluminum surface along which a surface layer has been substantially removed by way of the electrically conductive arm and the conductive portion of the block, the conductive path allowing a quantity of charge deposited at the external feature to flow directly to the portion of the anodized aluminum surface of the housing, thereby bypassing the internal switch.

8. The method as recited in claim 7, wherein the housing provides a chassis ground and has a cavity sized to enclose a plurality of operational components at least some of which are susceptible to damage when exposed to an electrostatic discharge (ESD) event.

9. The method as recited in claim 7, wherein the dopant comprises a plurality of silver micro-spheres.

10. A method, comprising:

obtaining a housing comprising an anodized aluminum surface; and

obtaining a button assembly, the button assembly comprising an external feature arranged to receive a user input event, an electrically conductive arm arranged to connect the external feature to an internal switch, a metal base portion integrally formed with the external feature, the metal base portion connecting the external feature to the electrically conductive arm, and a metal label; and

conductively mounting the metal label to the metal base portion using a conductive adhesive, wherein a conductive path is formed between the external feature and a portion of the anodized aluminum surface of the housing along which a portion of a surface layer has been removed by way of the metal label and the metal base portion, the conductive path allowing a quantity of charge deposited at the external feature to flow directly to the portion of the anodized surface of the housing and bypass the internal switch.

11. The method as recited in claim 10, wherein the conductive adhesive is solder.

12. The method as recited in claim 11, wherein the electrically conductive material is aluminum.

13. The method as recited in claim 11, wherein the portion of the anodized aluminum surface of the housing along which the portion of the surface layer has been removed comprises exposed aluminum, and wherein the exposed aluminum does not abrade the metal label.