Compact folded configuration for integrated circuit packaging

• US 8,634,204 B2
• Filed: 08/19/2010
• Issued: 01/21/2014
• Est. Priority Date: 08/19/2010
• Status: Expired due to Fees

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Rothkopf, Fletcher R., Hobson, Phillip M., Mittleman, Adam, Shedletsky, Anna-Katrina
• Primary Examiner(s): Dinh, Tuan T
• Application Number:
  US12/859,694
• Publication Number:
  US 20120044636A1
• Time in Patent Office: 1,251 Days
• Field of Search: 174254-260, 361/749, 361/803, 361782-784, 361/816, 361/818
• US Class Current: 361/789
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1684 Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2225/06558 the devices having passive surfaces facing each other, i.e. in a back-to-back arrangement
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06593 Mounting aids permanently on device; arrangements for alignment
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1434 : Memory
• CPC Class Codes: H01L 2924/1438 : Flash memory
• CPC Class Codes: H01Q 1/243 : with built-in antennas
• CPC Class Codes: H01Q 1/526 : Electromagnetic shields
• CPC Class Codes: H04R 2499/11 : Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
• CPC Class Codes: H04R 3/00 : Circuits for transducers , loudspeakers or microphones
• CPC Class Codes: H05K 1/0215 : Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/189 : characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/042 : Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/10159 : Memory
• CPC Class Codes: H05K 2201/10371 : Shields or metal cases
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing

Abstract

A memory unit for a computing device is described. The memory device can include a number of memory chips, such as flash nand chips, linked together via a flexible circuit connector. During installation of the memory device, portions of the flexible circuit connector can be bent or folded in different locations to allow an orientation of the memory chips to be changed relative to one another. In one embodiment, a memory device with a number of chips can be provided in a flat configuration and then can be folded to allow the chips to be installed in a stacked configuration. In another embodiment, the flexible circuit connector can be grounded to other conductive components to allow the flexible circuit connector to be used as part of a faraday cage surrounding the memory chips.

Claims

1. A device having a memory device, wherein the memory device comprises:

a first chip coupled to a first portion of flexible circuit connector;

a second chip including a top surface and a bottom surface, coupled to a second portion of the flexible circuit connector wherein the second portion of the flexible circuit connector proximately covers the bottom surface;

a third portion of the flexible circuit connector between the first portion and the second portion;

a fourth portion of the flexible circuit connector extending from the second portion including connector pads coupled to circuit traces within the flexible circuit connector, wherein the top surface of the second chip is bonded to the first chip by folding over the third portion of the flexible circuit connector, wherein the folded third portion of the flexible circuit connector configures the connector pads to ground the fourth portion of the flexible connector to a metal component surrounding the memory device, wherein the flexible circuit connector and the metal component form a faraday cage surrounding the memory device, wherein the connector pads are grounded to the metal component such that the circuit traces-form a part of the faraday cage for preventing the radio frequency signals generated by the first chip and the second chip from leaving the faraday cage.

2. The device of claim 1, wherein the memory device is coupled to a printed circuit board that includes the metal component prior to installation in the device.

3. The device of claim 1, wherein the connector pads are soldered to the metal component.

4. The device of claim 1, wherein the connector pads are bonded to the metal component via a conductive adhesive tape.

5. The device of claim 1, further comprising a fifth portion of the flexible circuit connector, extending from the second portion, including second connector pads, wherein to install the memory device in the computing device the fifth portion is folded over to allow the second connector pads to be coupled the metal component.

6. The device of claim 1, further comprising:

a housing;

an antenna coupled to the housing;

wherein the faraday cage surrounds the first and second chips and prevents radio frequency (RF) signals generated by the first and second chips from reaching the antenna wherein the flexible circuit connector is grounded to the metal frame.

7. The device of claim 1, wherein the metal frame is formed from a silver-nickel alloy.

8. The device of claim 6, further comprising a printed circuit board wherein the second chip is coupled to the printed circuit board.

9. The device of claim 8, wherein the fourth portion of the flexible circuit connector comprises a first component;

and

a metal shield coupled to the printed circuit board and proximate to the first chip and the second chip, including an aperture, wherein during assembly of the portable computing device, the third portion of the flexible circuit connector is folded over to allow the first component to fit through the aperture in the metal shield.

10. The device of claim 9, further comprising:

conductive tape, wherein the conductive tape is placed over the connector pads and a portion of the metal shield to ground the flexible circuit connector to the metal shield.

11. The device of claim 9, further comprising:

a plurality of components coupled to the fourth portion of the flexible circuit connector wherein the third portion is folded over to allow each component to fit through an associated aperture in the metal shield.

12. The device of claim 9, wherein the metal shield and the second portion of the flexible circuit connector are part of the faraday cage for preventing RF signals generated by the first chip and the second chip from leaving the faraday cage.

13. The device of claim 9, wherein the device is a portable computing device.

14. The device of claim 13, wherein the portable computing device comprises:

a cover glass; and

a display that is interposed between the cover glass and the printed circuit board.