Method and apparatus for integrated-circuit battery devices

• US 8,637,349 B2
• Filed: 12/27/2010
• Issued: 01/28/2014
• Est. Priority Date: 03/24/2000
• Status: Expired due to Fees

• Current Assignee: Cymbet Corporation
• Original Assignee: Cymbet Corporation
• Inventors: Jenson, Mark L., Klaassen, Jody J.
• Primary Examiner(s): TRINH, MICHAEL MANH
• Application Number:
  US12/979,277
• Publication Number:
  US 20110097609A1
• Time in Patent Office: 1,128 Days
• Field of Search: 438/121, 438/107, 438/108, 438/127, 438/124, 429/7, 429/152, 429/162
• US Class Current: 438/107
• CPC Class Codes: A61N 1/3787 from an external energy source
• CPC Class Codes: C23C 14/0031 Bombardment of substrates by reactive ion beams
• CPC Class Codes: C23C 14/0676 Oxynitrides
• CPC Class Codes: C23C 14/08 Oxides C23C14/10 takes precedence
• CPC Class Codes: C23C 16/047 using irradiation by energy or particles
• CPC Class Codes: G02F 1/13306 Circuit arrangements or driving methods for the control of single liquid crystal cells G02F1/132, G02F1/133382 take precedence
• CPC Class Codes: G02F 1/13324 Circuits comprising solar cells
• CPC Class Codes: H01G 11/08 Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component
• CPC Class Codes: H01G 11/26 characterised by their structure, e.g. multi-layered, porosity or surface features
• CPC Class Codes: H01G 11/56 Solid electrolytes, e.g. gels; Additives therein
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 31/073 comprising only AIIBVI compound semiconductors, e.g. CdS/CdTe solar cells
• CPC Class Codes: H01L 31/1828 : the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
• CPC Class Codes: H01M 10/0436 : Small-sized flat cells or batteries for portable equipment
• CPC Class Codes: H01M 10/0472 : Vertically superposed cells with vertically disposed plates
• CPC Class Codes: H01M 10/052 : Li-accumulators
• CPC Class Codes: H01M 10/0525 : Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
• CPC Class Codes: H01M 10/0562 : Solid materials
• CPC Class Codes: H01M 10/058 : Construction or manufacture
• CPC Class Codes: H01M 10/0585 : of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• CPC Class Codes: H01M 10/42 : Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells H01M10/60 takes precedence
• CPC Class Codes: H01M 10/425 : Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing printed circuits H05K1/00
• CPC Class Codes: H01M 10/4257 : Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
• CPC Class Codes: H01M 10/4264 : with capacitors
• CPC Class Codes: H01M 10/44 : Methods for charging or discharging circuits for charging H02J7/00
• CPC Class Codes: H01M 10/46 : Accumulators structurally combined with charging apparatus circuits for charging H02J7/00
• CPC Class Codes: H01M 10/465 : with solar battery as charging system
• CPC Class Codes: H01M 14/00 : Electrochemical current or voltage generators not provided for in groups H01M6/00 - H01M12/00; Manufacture thereof
• CPC Class Codes: H01M 14/005 : Photoelectrochemical storage cells light sensitive devices H01G9/20, semiconductors sensitive to light H01L31/00
• CPC Class Codes: H01M 2004/021 : Physical characteristics, e.g. porosity, surface area
• CPC Class Codes: H01M 2008/1293 : Fuel cells with solid oxide electrolytes
• CPC Class Codes: H01M 4/0421 : involving vapour deposition
• CPC Class Codes: H01M 4/0423 : Physical vapour deposition
• CPC Class Codes: H01M 4/0426 : Sputtering
• CPC Class Codes: H01M 4/1391 : of electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
• CPC Class Codes: H01M 4/1393 : of electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
• CPC Class Codes: H01M 4/1397 : of electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy
• CPC Class Codes: H01M 4/382 : Lithium H01M4/405 takes precedence
• CPC Class Codes: H01M 4/405 : Alloys based on lithium
• CPC Class Codes: H01M 4/483 : for non-aqueous cells H01M4/485 takes precedence
• CPC Class Codes: H01M 4/581 : Chalcogenides or intercalation compounds thereof
• CPC Class Codes: H01M 4/5825 : Oxygenated metallic salts or polyanionic structures, e.g. borates, phosphates, silicates, olivines
• CPC Class Codes: H01M 4/587 : for inserting or intercalating light metals
• CPC Class Codes: H01M 4/8885 : Sintering or firing
• CPC Class Codes: H01M 4/9016 : Oxides, hydroxides or oxygenated metallic salts
• CPC Class Codes: H01M 50/103 : prismatic or rectangular H01M50/109, H01M50/11 take precedence
• CPC Class Codes: H01M 50/209 : adapted for prismatic or rectangular cells H01M50/216 takes precedence
• CPC Class Codes: H01M 50/403 : Manufacturing processes of separators, membranes or diaphragms
• CPC Class Codes: H01M 6/185 : with oxides, hydroxides or oxysalts as solid electrolytes
• CPC Class Codes: H01M 6/186 : Only oxysalts-containing solid electrolytes
• CPC Class Codes: H01M 6/188 : Processes of manufacture
• CPC Class Codes: H01M 6/40 : Printed batteries , e.g. thin film batteries
• CPC Class Codes: H01M 6/42 : Grouping of primary cells into batteries H01M6/40 takes precedence
• CPC Class Codes: H01M 8/1007 : with both reactants being gaseous or vaporised H01M8/12 takes precedence
• CPC Class Codes: H01M 8/1286 : Fuel cells applied on a support, e.g. miniature fuel cells deposited on silica supports
• CPC Class Codes: H04M 1/0262 : for a battery compartment
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: Y02E 10/543 : Solar cells from Group II-VI materials
• CPC Class Codes: Y02E 60/10 : Energy storage using batteries
• CPC Class Codes: Y02E 60/13 : Energy storage using capacitors
• CPC Class Codes: Y02E 60/50 : Fuel cells
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10S 117/902 : Specified orientation, shape, crystallography, or size of seed or substrate
• CPC Class Codes: Y10T 29/49108 : Electric battery cell making
• CPC Class Codes: Y10T 29/49114 : including adhesively bonding
• CPC Class Codes: Y10T 29/49115 : including coating or impregnating
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53135 : Storage cell or battery

Abstract

A combined battery and device apparatus and associated method. This apparatus includes a first conductive layer, a battery comprising a cathode layer; an anode layer, and an electrolyte layer located between and electrically isolating the anode layer from the cathode layer, wherein the anode or the cathode or both include an intercalation material, the battery disposed such that either the cathode layer or the anode layer is in electrical contact with the first conductive layer, and an electrical circuit adjacent face-to-face to and electrically connected to the battery. Some embodiments further include a photovoltaic cell and/or thin-film capacitor. In some embodiments, the substrate includes a polymer having a melting point substantially below 700 degrees centigrade. In some embodiments, the substrate includes a glass. For example, some embodiments include a battery deposited directly on the back of a liquid-crystal display (LCD) device.

Claims

1. A method for fabricating an integrated-circuit package comprising:

providing a substrate;

depositing an integrated-circuit chip in the integrated-circuit package;

electrically connecting a plurality of electrical terminals on an external surface of the integrated-circuit package to the integrated-circuit chip;

depositing a thin-film battery on the substrate, wherein the thin-film battery includes a first electrode that is not electrically connected to the integrated-circuit chip in the integrated-circuit package and a second electrode;

electrically connecting the first electrode of the thin-film battery to an electrical terminal on an external surface of the integrated-circuit package;

electrically connecting the second electrode of the thin-film battery to an electrical terminal on an external surface of the integrated-circuit package;

encapsulating the integrated-circuit chip and the thin-film battery to form the integrated-circuit package,

wherein the depositing of the integrated-circuit chip in the integrated-circuit package and the electrically connecting of the plurality of electrical terminals further includes;

forming a first plurality of elongated metal-conductor leads, each of the first plurality of leads extending in a single plane, wherein the first plurality of leads are configured to form a die-support location,

affixing the integrated-circuit chip to the die-support location, and

electrically connecting the second electrode of the thin-film battery to the die-support location; and

wherein the depositing of the thin-film battery includes;

successively depositing a plurality of layers on one another as solid-state thin-film layers, wherein the plurality of layers includes a first electrode layer having the first electrode and a second electrode layer having the second electrode.

2. The method of claim 1, wherein the depositing of the thin-film battery on the substrate further includes fabricating the thin-film battery as a separate unit and then affixing the pre-fabricated thin-film battery to the substrate.

3. The method of claim 1, wherein the depositing of the thin-film battery on the substrate further includes:

depositing a plurality of thin-film cells on a flexible sheet;

attaching the plurality of thin-film cells to one another in series to form the battery;

fan folding the flexible sheet in a z-fold-type configuration; and

affixing the folded sheet to the substrate.

4. The method of claim 1, wherein the depositing of the thin-film battery on the substrate further includes depositing an electrolyte layer located between and electrically isolating the first electrode from the second electrode.

5. The method of claim 1, further comprising electrically isolating the second electrode of the thin-film battery from the integrated-circuit chip such that the second electrode of the thin-film battery is not electrically connected to the integrated-circuit chip in the integrated-circuit package.

6. The method of claim 1, further comprising electrically connecting the integrated-circuit chip to the second electrode of the thin-film battery.

7. The method of claim 1, further comprising electrically connecting the first electrode to an external component to provide electrical power from the thin-film battery to the external component.

8. The method of claim 1, wherein the depositing of the integrated-circuit chip and the depositing of the thin-film battery include depositing the integrated-circuit chip and the thin-film battery in a side-by-side arrangement on the substrate.

9. The method of claim 1, wherein the depositing of the integrated-circuit chip includes depositing an energy-conversion device configured to recharge the battery.

10. The method of claim 1, further comprising wirelessly recharging the thin-film battery.

11. The method of claim 1, wherein the thin-film battery is a lithium-ion battery.

12. The method of claim 1, wherein the plurality of layers of the thin-film battery comprises an electrolyte layer, and wherein the electrolyte layer includes a LiPON material.

13. A method for fabricating an integrated-circuit package comprising:

providing an integrated-circuit chip;

providing a first plurality of elongated metal-conductor leads, each of the first plurality of leads extending in a single plane, wherein the first plurality of leads are configured to form a die-support location;

providing a thin-film battery on a substrate, wherein the thin-film battery includes a first electrode deposited as one of a plurality of successive layers and a second electrode deposited as another of the plurality of successive layers;

depositing the integrated-circuit chip to a location that will be in the integrated-circuit package;

affixing the integrated-circuit chip to the die-support location;

electrically connecting a plurality of electrical terminals on an external surface of the integrated-circuit package to the integrated-circuit chip;

electrically connecting the first electrode of the thin-film battery to an electrical terminal on an external surface of the integrated-circuit package;

electrically connecting the second electrode of the thin-film battery to an electrical terminal on an external surface of the integrated-circuit package;

electrically connecting the second electrode of the thin-film battery to the die-support location; and

encapsulating the integrated-circuit chip and the thin-film battery to form the integrated-circuit package, wherein the first electrode of the thin-film battery is not electrically connected to the integrated-circuit chip in the integrated-circuit package.

14. The method of claim 13, wherein the providing of the thin-film battery on the substrate further includes fabricating the thin-film battery as a separate unit and then affixing the pre-fabricated thin-film battery to the substrate.

15. The method of claim 13, further comprising electrically isolating the second electrode of the thin-film battery from the integrated-circuit chip such that the second electrode of the thin-film battery is not electrically connected to the integrated-circuit chip in the integrated-circuit package.

16. The method of claim 13, further comprising electrically connecting the integrated-circuit chip to the second electrode of the thin-film battery.

17. The method of claim 13, further comprising electrically connecting the first electrode to an external component to provide electrical power from the thin-film battery to the external component.

18. The method of claim 13, wherein the providing of the integrated-circuit chip and the providing of the thin-film battery on the substrate further include depositing the integrated-circuit chip and the thin-film battery in a side-by-side arrangement on the substrate.

19. The method of claim 13, wherein the providing of the integrated-circuit chip includes depositing, in the integrated-circuit package, an energy-conversion device configured to recharge the battery.

20. The method of claim 13, further comprising wirelessly recharging the thin-film battery.