Apparatus and method for tire temperature measurement

• US 8,640,535 B2
• Filed: 09/30/2009
• Issued: 02/04/2014
• Est. Priority Date: 09/30/2009
• Status: Active Grant

• Current Assignee: Compagnie générale des établissements Michelin
• Original Assignee: Compagnie générale des établissements Michelin, Michelin Recherche et Technique SA (Compagnie Generale DES Etablissements Michelin SCA)
• Inventors: Weston, David Alan
• Primary Examiner(s): ALLEN, ANDRE J
• Application Number:
  US13/497,633
• Publication Number:
  US 20120300809A1
• Time in Patent Office: 1,588 Days
• Field of Search: None
• US Class Current: 73/146
• CPC Class Codes: B60C 23/0493 for attachment on the tyre
• CPC Class Codes: B60C 23/20 Devices for measuring or signalling tyre temperature only

Abstract

Apparatus and method for tire temperature measurement is disclosed. The apparatus includes a thermocouple having a measurement junction and a pair of first and second conductive leads. The measurement junction is mounted in a passage provided in the tire. The pair of first and second conductive leads extend through the passage in the tire and exit the tire at an interface. A patch is mounted to the tire at the interface. The pair of first and second conductive leads extend from the interface into a passage provided in the patch. The first and second conductive leads are surrounded by the patch at the interface where the first and second conductive leads exit the surface of the tire.

Claims

1. A tire temperature measurement apparatus, comprising:

a thermocouple having a measurement junction and a pair of first and second conductive leads, said measurement junction being mounted in a first passage provided in the tire, said pair of first and second conductive leads extending through the first passage in the tire and exiting the surface of the tire at an interface;

a patch mounted to the tire at said interface, said pair of first and second conductive leads extending from said interface into a second passage provided in said patch; and

a temperature measurement circuit in operable communication with said pair of first and second conductive leads;

wherein said first and second conductive leads are surrounded by said patch at said interface where said first and second conductive leads exit the tire.

2. The tire temperature measurement apparatus of claim 1, wherein said temperature measurement circuit comprises a processor and a reference junction, said reference junction comprising a temperature measurement device in thermal contact with said reference junction.

3. The tire temperature measurement apparatus of claim 2, wherein said temperature measurement device comprises a p-n junction.

4. The tire temperature measurement apparatus of claim 2, wherein said temperature measurement device comprises a thermistor.

5. The tire temperature measurement apparatus of claim 2, wherein said processor and said reference junction are located on a circuit board mounted to said patch.

6. The tire temperature measurement apparatus of claim 2, wherein said processor is located on a circuit board mounted to said patch and said reference junction is embedded in said patch.

7. The tire temperature measurement apparatus of claim 1, wherein said apparatus further comprises:

a first support element embedded in said patch, said first support element comprising a pair of first and second posts extending from said first support element;

a second support element located above a top surface of said patch, said first and second posts extending through said second support element; and

a circuit board located above said second support element, said first and second posts being operably connected to said circuit board to provide mechanical support for said circuit board;

wherein said apparatus comprises a third passage provided through said first support element and said second support element, said third passage being provided between said first post and said second post such that said first and second posts and said third passage are arranged in a substantially linear relationship.

8. The tire temperature measurement apparatus of claim 7, wherein said first and second conductive leads extend through said third passage provided through said first support element and said second support element.

9. The tire temperature measurement apparatus of claim 8, wherein said third passage provided through said first support element and said second support element is filled with a urethane or epoxy material, said urethane or epoxy material having a modulus of elasticity approximately equal to the modulus of elasticity of said first support element and said second support element.

10. The tire temperature measurement apparatus of claim 7, wherein said first and second posts and said third passage provided through said first support element and said second support element are arranged in a substantially linear relationship along a line about 80°

to about 100°

to a longitudinal direction of the patch, the longitudinal direction of the patch being substantially perpendicular to the direction of rotation of the tire.

11. A method for measuring temperature of a tire, comprising:

placing a patch on a surface of the tire;

providing a first passage in said patch and the tire;

inserting a thermocouple comprising a measurement junction and a pair of first and second conductive leads into said first passage provided in said patch and in the tire such that said measurement junction of said thermocouple is mounted in said first passage provided in the tire and said first and second conductive leads extend through said first passage in the tire and exit the surface of the tire at an interface;

placing said first and second wires in operable communication with a temperature measurement circuit; and

determining said temperature of said tire at the location of said measurement junction;

wherein said first and second conductive leads are surrounded by said patch at said interface where said first and second conductive leads exit the surface of the tire.

12. The method of claim 11, wherein said temperature measurement circuit comprises a processor and a reference junction, said reference junction comprising a temperature measurement device in thermal contact with said reference junction.

13. The method of claim 12, wherein said temperature measurement device comprises a p-n junction.

14. The method of claim 12, wherein said temperature measurement device comprises a thermistor.

15. The method of claim 12, wherein said method comprises mounting a circuit board to said patch, said processor and said reference junction being located on said circuit board.

16. The method of claim 12, wherein said method comprises mounting a circuit board to said patch, said processor being located on said circuit board and said reference junction being embedded in said patch.

17. The method of claim 11, wherein said method further comprises:

embedding a first support element in said patch, said first support element comprising a pair of first and second posts extending from said first support element;

positioning a second support element above a top surface of said patch such that said first and second posts extend through said second support element;

operably connecting a circuit board to said first and second posts extending from said first support element; and

providing a second passage through said first support element and said second support element between said first post and said second post such that said first and second posts and said second passage are arranged in a substantially linear relationship.

18. The method of claim 17, wherein said method comprises threading said first and second conductive leads through said second passage provided through said first support element and said second support element.

19. The method of claim 18, wherein said method comprises filling said second passage provided through said first support element and said second support element with a urethane or epoxy material having a modulus of elasticity substantially equal to the modulus of elasticity of said first support element and said second support element.

20. The method of claim 17, wherein said method comprises arranging said patch on said tire such that said first and second posts and said second passage provided through said first support element and said second support element are arranged in a substantially linear relationship along a line about 80°

to about 100°

to a longitudinal direction of the patch, the longitudinal direction of the patch being substantially perpendicular to the direction of rotation of the tire.