Electronic equipment and method for connecting electronic circuit substrate
First Claim
Patent Images
1. Electronic equipment comprising:
- a first electronic circuit substrate;
a second electronic circuit substrate;
a first coil connected to said first electronic circuit substrate; and
a second coil connected to said second electronic circuit substrate,each of said first coil and said second coil being configured with a plurality of flexible-substrate coils,wherein power is transmitted from said first coil to said second coil by electromagnetic induction so that said first electronic circuit substrate and said second electronic circuit substrate are electrically connected,wherein said first coil has;
a first power coil that transmits power from said first electronic circuit substrate to said second electronic circuit substrate; and
a first communication coil that communicates between said first electronic circuit substrate and said second electronic circuit substrate,wherein said second coil has;
a second power coil that receives power transmitted by said first power coil; and
a second communication coil that communicates with said first communication coil, andwherein the plurality of flexible-substrate coils of each of said first coil and said second coil are placed one over another in parallel with a plane direction.
1 Assignment
0 Petitions
Accused Products
Abstract
Wireless power supply and information communication are achieved between electronic circuit substrates in the electronic equipment, and the size of the circuitry for achieving the above is reduced. There are provided a first electronic circuit substrate, a second electronic circuit substrate, a first coil connected to the first electronic circuit substrate, and a second coil connected to the second electronic circuit substrate. Power is transmitted from the first coil to the second coil by electromagnetic induction so that the first electronic circuit substrate and the second electronic circuit substrate are electrically connected.
57 Citations
15 Claims
-
1. Electronic equipment comprising:
-
a first electronic circuit substrate; a second electronic circuit substrate; a first coil connected to said first electronic circuit substrate; and a second coil connected to said second electronic circuit substrate, each of said first coil and said second coil being configured with a plurality of flexible-substrate coils, wherein power is transmitted from said first coil to said second coil by electromagnetic induction so that said first electronic circuit substrate and said second electronic circuit substrate are electrically connected, wherein said first coil has; a first power coil that transmits power from said first electronic circuit substrate to said second electronic circuit substrate; and a first communication coil that communicates between said first electronic circuit substrate and said second electronic circuit substrate, wherein said second coil has; a second power coil that receives power transmitted by said first power coil; and a second communication coil that communicates with said first communication coil, and wherein the plurality of flexible-substrate coils of each of said first coil and said second coil are placed one over another in parallel with a plane direction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. Electronic equipment comprising:
-
a first electronic circuit substrate; a second electronic circuit substrate; a first coil connected to said first electronic circuit substrate; and a second coil connected to said second electronic circuit substrate, wherein power is transmitted from said first coil to said second coil by electromagnetic induction so that said first electronic circuit substrate and said second electronic circuit substrate are electrically connected, wherein said first coil has; a first power coil that transmits power from said first electronic circuit substrate to said second electronic circuit substrate; and a first communication coil that communicates between said first electronic circuit substrate and said second electronic circuit substrate, wherein said second coil has; a second power coil that receives power transmitted by said first power coil; and a second communication coil that communicates with said first communication coil, and wherein each of said first coil and said second coil is configured in a single coil by dividing the single coil into two coils with a center tap, then said first power coil and said first communication coil and said second power coil and said second communication coil are provided.
-
-
14. Electronic equipment comprising:
-
a first electronic circuit substrate; a second electronic circuit substrate; a first coil connected to said first electronic circuit substrate; a second coil connected to said second electronic circuit substrate; and
,data synthesis means for synthesizing data transmitted by said first coil or said second coil with said serial data into a single transmission data, wherein power is transmitted from said first coil to said second coil by electromagnetic induction so that said first electronic circuit substrate and said second electronic circuit substrate are electrically connected, wherein said first coil has; a first power coil that transmits power from said first electronic circuit substrate to said second electronic circuit substrate; and a first communication coil that communicates between said first electronic circuit substrate and said second electronic circuit substrate, wherein said second coil has; a second power coil that receives power transmitted by said first power coil; and a second communication coil that communicates with said first communication coil wherein the first coil and the second coil transmit and receive serial data each other, and wherein said first coil or said second coil transmits said transmission data synthesized by said data synthesis means. - View Dependent Claims (15)
-
Specification