Capacitor including registration feature for aligning an insulator layer

• US 8,644,002 B2
• Filed: 05/31/2011
• Issued: 02/04/2014
• Est. Priority Date: 05/31/2011
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Iyer, Rajesh V.
• Primary Examiner(s): Sinclair, David M
• Application Number:
  US13/149,600
• Publication Number:
  US 20120307416A1
• Time in Patent Office: 980 Days
• Field of Search: 361/302, 29/254.2
• US Class Current: 361/502
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: Y10T 29/435 Solid dielectric type
• CPC Class Codes: Y10T 29/49227 Insulator making

Abstract

In one example, a capacitor structure may include a capacitor comprising a surface that defines at least one feedthrough aperture and a ceramic insulator layer attached to the surface. The surface of the capacitor may include a capacitor registration feature, and the ceramic insulator layer may include a ceramic insulator layer registration feature. The capacitor registration feature and the ceramic insulator layer registration feature may cooperate to substantially align the ceramic insulator layer to the capacitor, e.g., prior to the ceramic layer being attached to surface of the capacitor.

Claims

1. A method comprising:

substantially aligning at least one capacitor registration feature formed on a first surface of a capacitor with at least one ceramic insulator layer registration feature formed in a ceramic insulator layer;

contacting the ceramic insulator layer to the first surface with the at least one capacitor registration feature and the at least one ceramic insulator layer registration feature in substantial alignment; and

attaching the ceramic insulator layer to the first surface, wherein attaching the ceramic insulator layer to the first surface comprises laminating the ceramic insulator layer to the capacitor at a temperature between about 800°

C. and about 900°

C. and a pressure of between about 800 psi and about 1500 psi.

2. The method of claim 1, wherein the at least one ceramic insulator layer registration feature comprises at least one registration aperture, wherein the at least one capacitor registration feature comprises at least one capacitor registration aperture, wherein the method further includes placing a registration pin in the at least one capacitor registration aperture, and wherein contacting the ceramic insulator layer to the first surface with the at least one capacitor registration feature and the at least one ceramic insulator layer registration feature in substantial alignment comprises contacting the ceramic insulator layer to the first surface and placing the at least one registration aperture of the ceramic insulator layer about the at least one registration pin.

3. The method of claim 1, wherein the at least one ceramic insulator layer registration feature comprises at least one registration aperture, wherein the at least one capacitor registration feature comprises at least one registration protrusion, and wherein contacting the ceramic insulator layer to the first surface with the at least one capacitor registration feature and the at least one ceramic insulator layer registration feature in substantial alignment comprises contacting the ceramic insulator layer to the first surface and placing the at least one registration aperture of the ceramic insulator layer about the at least one registration protrusion.

4. The method of claim 1, wherein the at least one ceramic insulator layer registration feature comprises a ceramic insulator layer perimeter, wherein the at least one capacitor registration feature comprises at least one registration protrusion along a perimeter of the capacitor, and wherein contacting the ceramic insulator layer to the first surface with the at least one capacitor registration feature and the at least one ceramic insulator layer registration feature in substantial alignment comprises contacting the ceramic insulator layer to the first surface and engaging the ceramic insulator layer perimeter with the at least one registration protrusion.

5. The method of claim 1, further comprising cutting at least one feedthrough aperture in the ceramic insulator layer prior to substantially aligning the at least one capacitor registration feature formed on the first surface of the capacitor with the at least one ceramic insulator layer registration feature formed in the ceramic insulator layer.

6. The method of claim 1, further comprising cutting at least one feedthrough aperture in the ceramic insulator layer prior to laminating the ceramic insulator layer to the first surface.

7. The method of claim 1, further comprising cutting at least one feedthrough aperture in the ceramic insulator layer after to laminating the ceramic insulator layer to the first surface.

8. A method comprising:

substantially aligning at least one capacitor registration feature formed on a first surface of a capacitor with at least one ceramic insulator layer registration feature formed in a ceramic insulator layer;

contacting the ceramic insulator layer to the first surface with the at least one capacitor registration feature and the at least one ceramic insulator layer registration feature in substantial alignment;

attaching the ceramic insulator layer to the first surface; and

cutting at least one feedthrough aperture in the ceramic insulator layer after to laminating the ceramic insulator layer to the first surface.