Feedthrough assembly including electrical ground through feedthrough substrate

• US 8,644,936 B2
• Filed: 01/09/2012
• Issued: 02/04/2014
• Est. Priority Date: 01/09/2012
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Iyer, Rajesh V., Goldman, Simon E., Miltich, Thomas P.
• Primary Examiner(s): Koharski, Christopher D
• Assistant Examiner(s): CAREY, MICHAEL JAMES
• Application Number:
  US13/346,424
• Publication Number:
  US 20130176658A1
• Time in Patent Office: 757 Days
• Field of Search: 607/36, 333/182, 361/302
• US Class Current: 607/36
• CPC Class Codes: H01G 2/04 specially adapted for mounting on a chassis
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/236 leading through the housing, i.e. lead-through
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors

Abstract

A feedthrough assembly may include a ferrule defining a ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a feedthrough at least partially disposed within the ferrule opening. In some examples, the capacitive filter array includes a filter array ground conductive pathway. In some examples, the feedthrough includes a feedthrough ground conductive via. The feedthrough ground conductive via may be electrically coupled to the filter array ground conductive pathway, and the feedthrough ground conductive via may be electrically coupled to the ferrule.

Claims

1. A method comprising:

attaching a perimeter wall of a cofired feedthrough to an interior wall of a ferrule to form a hermetic seal between the cofired feedthrough and the ferrule, wherein the cofired feedthrough comprises a feedthrough ground conductive via and a feedthrough ground conductive pathway electrically coupled to the feedthrough ground conductive via;

electrically coupling the feedthrough ground conductive via to the ferrule;

attaching a cofired capacitive filter array to the feedthrough, wherein the cofired capacitive filter array includes a filter array ground conductive pathway and at least two filter array active conductive pathways, wherein the at least two filter array active conductive pathways are capacitively coupled to the filter array ground conductive pathway; and

electrically coupling the filter array ground conductive pathway to the feedthrough ground conductive pathway.

2. The method of claim 1, wherein electrically coupling the cofired feedthrough ground conductive via to the ferrule comprises:

electrically coupling a perimeter conductive contact formed on a perimeter wall of the feedthrough to the ferrule, wherein the perimeter conductive contact is electrically connected to the feedthrough ground conductive via.

3. The method of claim 2, wherein electrically coupling the perimeter conductive contact formed on the perimeter wall of the cofired feedthrough to the ferrule comprises:

forming an electrical connection between the feedthrough ground conductive via and the ferrule using at least one of brazing, welding, soldering, or disposing a thick film conductive paste between the perimeter conductive contact and the ferrule.

4. The method of claim 1, wherein electrically coupling the feedthrough ground conductive via to the ferrule comprises:

forming an electrical connection between the feedthrough ground conductive via and the ferrule using at least one of brazing, welding, soldering, or disposing a thick film conductive paste between the feedthrough ground conductive via and the ferrule.

5. The method of claim 1, wherein electrically coupling the filter array ground conductive pathway to the feedthrough ground conductive via comprises:

electrically coupling the filter array ground conductive pathway and the feedthrough ground conductive via using an electrically conductive lead.

6. The method of claim 1, wherein electrically coupling the filter array ground conductive pathway to the feedthrough ground conductive via comprises:

electrically coupling the filter array ground conductive pathway and the feedthrough ground conductive via using a thick film conductive paste.

7. The method of claim 1, further comprising:

electrically and mechanically coupling the ferrule to a housing of an implantable medical device.