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Contact stress sensor

  • US 8,646,335 B2
  • Filed: 01/12/2012
  • Issued: 02/11/2014
  • Est. Priority Date: 11/17/2004
  • Status: Active Grant
First Claim
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1. A method, comprising:

  • providing a sensor element that includes a body having a thickness no greater than 280 μ

    m, a recessed portion and a pressure sensitive element that extends over said recessed portion;

    operatively connecting an electric circuit to said pressure sensitive element, wherein said circuit includes a pressure signal generating circuit element configured to provide a signal when a force is exerted on said pressure sensitive element, wherein said electric circuit comprises implant material implanted into said pressure sensitive element, wherein said pressure sensitive element comprises a substrate selected from the group consisting of an N type substrate, a P type substrate, an N type well in a P type substrate and a P type well in an N type substrate; and

    locating said sensor element within a package to provide a packaged sensor element, wherein said sensor element together with said package comprises a total thickness no greater than 300 μ

    m and wherein said package comprises a material selected from the group consisting of ceramic, metal, and plastic.

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