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Micro device transfer head

  • US 8,646,505 B2
  • Filed: 02/13/2012
  • Issued: 02/11/2014
  • Est. Priority Date: 11/18/2011
  • Status: Active Grant
First Claim
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1. A micro device transfer head comprising:

  • a base substrate;

    a mesa structure including sidewalls;

    an electrode formed over the mesa structure;

    a dielectric layer covering the electrode; and

    a conductive ground plane formed over the dielectric layer and surrounding the mesa structure.

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