Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit

• US 8,646,675 B2
• Filed: 10/27/2005
• Issued: 02/11/2014
• Est. Priority Date: 11/02/2004
• Status: Expired due to Fees

• Current Assignee: HID Global GmbH (Assa Abloy AB)
• Original Assignee: HID Global GmbH (Assa Abloy AB)
• Inventors: Lang, Ulrich
• Primary Examiner(s): Ewald, Maria Veronica
• Assistant Examiner(s): MEHTA, MEGHA S
• Application Number:
  US11/718,512
• Publication Number:
  US 20090033585A1
• Time in Patent Office: 3,029 Days
• Field of Search: 228/180.5, 228/4.5
• US Class Current: 228/4.5
• CPC Class Codes: B23K 20/005 Capillary welding
• CPC Class Codes: B23K 20/106 Features related to sonotrodes
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01052 Tellurium [Te]
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H05K 13/06 : Wiring by machine
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53261 : Means to align and advance work part

Abstract

The invention relates to a laying device which is used to lay wire windings on transponder units, wherein the wire is guided in an axial manner in the laying device, a contacting device is used place the wires in contact with an automatic thermal clamping arrangement, an advancing system is used to advance machining devices by means of a piezo-leg-motor, a production system is used to produce transponder units in a console structural manner. The invention also relates to a method for the production of transponder units with horizontal ultrasonic introduction and a transponder unit wherein the wire ends engage directly on the ends of the connection surfaces of the chip.

Claims

1. Feed device for taking up and guiding a tool device, in particular a laying apparatus for laying a wire on a substrate and/or a contacting device for contacting the wire with a chip, comprising:

a guide carriage being movable in a first direction by means of a drive along a first guide having a first longitudinal axis substantially parallel to the first direction; and

a connection carriage for taking up the tool device, the connection carriage being movable in the first direction along a second guide having a second longitudinal axis substantially parallel to the first direction, wherein the first and second longitudinal axes are the same, whereby

the guide carriage and the connection carriage are mechanically coupled together by a load gauge, in particular a force gauge, and is such that the displacement of the guide carriage along the first guide is substantially equivalent to the movement of the connection carriage along the second guide.

2. Feed device according to claim 1, wherein the load gauge is a strain-gauge sensor.

3. Feed device according to claim 1, wherein the drive is a piezoelectric drive.

4. Feed device according to claim 2, wherein the piezoelectric drive is a piezo-leg drive, wherein at least one finger is piezoelectrically activated in order to move a ceramic plate slide being coupled to the guide carriage and so move the guide carriage along the first guide.

5. Feed device according to claim 1, wherein the first guide and the second guide are one single guide.

6. Feed device according to claim 1, wherein the load gauge has damping characteristics and compensates for overshooting of the drive by approximately 100 μ

m in the longitudinal direction.

7. Feed device according to claim 1, wherein the load gauge is used to measure the pressure applied on the tool device and transmitted to the connection carriage, so that a control system for the drive can be acted on for regulation purposes.