Method for producing a semiconductor layer

• US 8,647,968 B2
• Filed: 06/10/2009
• Issued: 02/11/2014
• Est. Priority Date: 06/10/2008
• Status: Active Grant

• Current Assignee: Infineon Technologies Austria Ag (Infineon Technologies AG)
• Original Assignee: Infineon Technologies Austria Ag (Infineon Technologies AG)
• Inventors: Schulze, Hans-Joachim, Strack, Helmut, Timme, Hans-Joerg, Winkler, Rainer
• Primary Examiner(s): MULPURI, SAVITRI
• Application Number:
  US12/482,101
• Publication Number:
  US 20090305486A1
• Time in Patent Office: 1,707 Days
• Field of Search: 438471-479, 438/513, 438/528, 438/975
• US Class Current: 438/478
• CPC Class Codes: C30B 25/18 characterised by the substrate
• CPC Class Codes: C30B 29/06 Silicon
• CPC Class Codes: C30B 33/02 Heat treatment C30B33/04, C30B33/06 take precedence
• CPC Class Codes: H01L 21/02381 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02529 Silicon carbide
• CPC Class Codes: H01L 21/02532 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02543 Phosphides
• CPC Class Codes: H01L 21/02546 Arsenides
• CPC Class Codes: H01L 21/02658 Pretreatments cleaning in general H01L21/02041
• CPC Class Codes: H01L 21/263 with high-energy radiation H01L21/261 takes precedence
• CPC Class Codes: H01L 21/3225 Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering H01L21/3226 takes precedence
• CPC Class Codes: H01L 29/04 characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes characterised by physical imperfections H01L29/30
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body

Abstract

A method for producing a semiconductor layer is disclosed. One embodiment provides for a semiconductor layer on a semiconductor substrate containing oxygen. Crystal defects are produced at least in a near-surface region of the semiconductor substrate. A thermal process is carried out wherein the oxygen is taken up at the crystal defects. The semiconductor layer is deposited epitaxially over the near-surface region of the semiconductor substrate.

Claims

1. A method for producing a semiconductor including a semiconductor layer on a semiconductor substrate containing oxygen, comprising:

producing crystal defects by implanting protons at least in a near-surface region of the semiconductor substrate, the semiconductor substrate having a concentration of oxygen between 3×

10¹⁷ cm<sup>−

3</sup> and 1×

10¹⁸ cm<sup>−

3</sup>;

carrying out a first thermal process, wherein oxygen is taken up at the crystal defects to form oxygen precipitates;

epitaxially depositing the semiconductor layer over the near-surface region of the semiconductor substrate after the first thermal process; and

diffusing oxygen from the semiconductor substrate from a region of the semiconductor substrate that has no crystal defects in a direction of the crystal defects such that the oxygen is taken up at the crystal defects to form oxygen precipitates.

2. The method of claim 1, wherein the semiconductor substrate is a monocrystalline silicon wafer.

3. The method of claim 2, comprising producing the silicon wafer according to the Czochralski method.

4. The method of claim 1, wherein the radiation dose of the protons is between 1×

10¹³ cm<sup>−

2</sup> to 1×

10¹⁵ cm<sup>−

2</sup>.

5. The method of claim 1, comprising wherein the duration of the first thermal process is between 1 hour and 30 hours.

6. The method of claim 1, comprising heating the semiconductor substrate during the first thermal process for a first time duration, which is shorter than 10 hours, to a temperature of between 750°

C. and 850°

C. and subsequently for a second time duration, which is longer than 10 hours, to a temperature of between 950°

C. and 1050°

C.

7. The method of claim 6, comprising wherein the first time duration is 5 hours and the second time duration is 20 hours.

8. The method of claim 6, comprising wherein, prior to the epitaxial deposition of the semiconductor layer, the semiconductor substrate is exposed to a second thermal process, wherein the semiconductor substrate is heated to a temperature of greater than 1050°

C. and is exposed to an inert atmosphere.

9. The method of claim 8, comprising carrying out the second thermal process out prior to producing the crystal defects.

10. The method of claim 8, comprising exposing the semiconductor substrate to an inert atmosphere during the first thermal process.

11. The method of claim 10, comprising adding a chlorine-containing compound to the inert atmosphere.

12. The method of claim 1, wherein the first thermal process comprises heating the semiconductor substrate to a temperature between 700°

C. and 1100°

C.

13. The method of claim 1, wherein carrying out the first thermal process comprises carrying out the first thermal process in an inert atmosphere.

14. A method for producing a semiconductor including a semiconductor layer on a semiconductor substrate containing oxygen, comprising:

producing crystal defects at least in a near-surface region of the semiconductor substrate by implanting protons into the semiconductor substrate, the semiconductor substrate having a concentration of oxygen between 3×

10¹⁷ cm<sup>−

3</sup> and 1×

10¹⁸ cm<sup>−

3</sup>;

carrying out a first thermal process in an inert atmosphere, wherein oxygen is taken up at the crystal defects to form oxygen precipitates;

epitaxially depositing the semiconductor layer over the near-surface region of the semiconductor substrate after the first thermal process; and

diffusing oxygen from the semiconductor substrate from a region of the semiconductor substrate that has no crystal defects in a direction of the crystal defects such that the oxygen is taken up at the crystal defects to form oxygen precipitates,

wherein the protons at least partly penetrate through the semiconductor substrate.

15. The method of claim 14, wherein a penetration depth T of the protons into the semiconductor substrate is at least 1 μ

m.

16. The method of claim 15, wherein the penetration depth T is at least 5 μ

m.

17. The method of claim 14, comprising effecting the penetration from a first surface of the semiconductor substrate in the direction of a second surface of the semiconductor substrate, lying opposite the first surface.

18. The method of claim 17, comprising depositing the semiconductor layer on the first surface of the semiconductor substrate.

19. The method of claim 17, comprising ending the penetrated region of the semiconductor substrate at most 3 μ

m before the second surface.

20. The method of claim 19, comprising depositing the semiconductor layer on the second surface of the semiconductor substrate.

21. The method of claim 14, wherein the first thermal process comprises heating the semiconductor substrate to a temperature between 700°

C. and 1100°

C.

22. A method of making a power semiconductor comprising:

providing a semiconductor substrate having a concentration of oxygen between 3×

10¹⁷ cm<sup>−

3</sup> and 1×

10¹⁸ cm<sup>−

3</sup>;

producing crystal defects by implanting protons at least in a near-surface region of the semiconductor substrate having the concentration of oxygen between 3×

10¹⁷ cm<sup>−

3</sup> and 1×

10¹⁸ cm<sup>−

3</sup>;

carrying out a first thermal process in an inert atmosphere, wherein the oxygen is taken up at the crystal defects to form oxygen precipitates;

epitaxially depositing a semiconductor layer over the near-surface region of the semiconductor substrate after the first thermal process;

diffusing oxygen from the semiconductor substrate from a region of the semiconductor substrate that has no crystal defects in a direction of the crystal defects such that the oxygen is taken up at the crystal defects to form oxygen precipitates; and

producing the power semiconductor using the semiconductor layer and semiconductor substrate.

23. The method of claim 22, wherein the first thermal process comprises heating the semiconductor substrate to a temperature between 700°

C. and 1100°

C.

25. The method of claim 23, wherein a duration of the first thermal process is between 1 hour and 30 hours.

24. A method for producing a semiconductor including a semiconductor layer on a semiconductor substrate containing oxygen, comprising:

producing crystal defects in an entirety of the semiconductor substrate by implanting protons into the semiconductor substrate;

carrying out a first thermal process in an inert atmosphere, wherein the oxygen is taken up at the crystal defects to form oxygen precipitates; and

epitaxially depositing the semiconductor layer directly over the semiconductor substrate after the first thermal process.