Light emitting diode device including a heat-radiation/light-reflection member

• US 8,648,374 B2
• Filed: 12/22/2011
• Issued: 02/11/2014
• Est. Priority Date: 05/09/2011
• Status: Expired due to Fees

• Current Assignee: LumiRich Co., Ltd.
• Original Assignee: LumiRich Co., Ltd.
• Inventors: Huh, Sea-Kyoung, Chong, Hwa-Gune, Kim, Ha chul
• Primary Examiner(s): Ho, Anthony
• Application Number:
  US13/334,117
• Publication Number:
  US 20120286310A1
• Time in Patent Office: 782 Days
• Field of Search: 257/98
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A light emitting diode device includes: a cathode lead frame; an anode lead frame which is electrically insulated from the cathode lead frame; a light emitting diode chip which is electrically connected to the cathode lead frame and the anode lead frame respectively; a synthetic resin member which forms an indentation receiving the light emitting diode chip and fixes the cathode lead frame and the anode lead frame; and a metallic heat-radiation/light-reflection member which covers at least a portion of the indentation and covers an upper surface of the synthetic resin member.

Claims

1. A light emitting diode device, comprising:

a cathode lead frame;

an anode lead frame which is electrically insulated from the cathode lead frame;

a light emitting diode chip which is electrically connected to the cathode lead frame and the anode lead frame respectively;

a synthetic resin member which forms an indentation receiving the light emitting diode chip and fixes the cathode lead frame and the anode lead frame; and

a metallic heat-radiation/light-reflection member which covers at least a portion of the indentation and covers an upper surface of the synthetic resin member, the metallic heat-radiation/light-reflection member being formed as a separate member from both the cathode lead frame and the anode lead frame, and being spaced from the cathode lead frame and the anode lead frame within said indentation, the metallic heat-radiation/light-reflection member including

a light-reflection portion which covers at least a portion of an inner surface of the indentation so as to form a reflection space where light emitted from the light emitting diode chip is reflected, and

a heat radiation portion which is extended from the light-reflection portion to cover the upper surface of the synthetic resin member, the heat radiation portion extending from the upper surface of the synthetic resin member and along a side of the synthetic resin member to a bottom of the synthetic resin member, the heat radiation portion being formed to contact one of the cathode lead frame and the anode lead frame.

2. The light emitting diode device of claim 1, wherein the light emitting diode chip is mounted to one of the cathode lead frame and the anode lead frame, and the heat radiation portion contacts the one of the cathode lead frame and the anode lead frame to which the light emitting diode chip is mounted.

3. The light emitting diode device of claim 1, wherein the cathode lead frame and the anode lead frame comprises respectively a cathode lead part and an anode lead part which are respectively extended to the bottom of the synthetic resin member, and the heat radiation portion contacts one of the cathode lead part and the anode lead part.

4. The light emitting diode device of claim 3, wherein the light emitting diode chip is mounted to one of the cathode lead frame and the anode lead frame, and the heat radiation portion contacts one of the cathode lead part and the anode lead part so as to contact the one of the cathode lead frame and the anode lead frame on which the light emitting diode chip is mounted.

5. The light emitting diode device of claim 1, wherein the light-reflection portion is formed to cover an upper portion of the inner surface of the indentation, and a lower portion of the inner surface of the indentation is formed as a reflection surface to reflect light emitted from the light emitting diode chip.

6. The light emitting diode device of claim 5, wherein the light-reflection portion is separated from upper surfaces of the cathode lead frame and the anode lead frame by the synthetic resin member.

7. The light emitting diode device of claim 1, wherein a surface of the light-reflection portion is coated with metal for improving a light reflectivity.

8. The light emitting diode device of claim 1, wherein the reflection space is emptied so as to form an air layer, and the light emitting diode device further comprises a lens, which is provided on an upper surface of the metallic heat-radiation/light-reflection member to cover the reflection space, provided with a phosphor layer.

9. The light emitting diode device of claim 8, wherein a surface of the metallic heat-radiation/light-reflection member is coated with phosphor.

10. The light emitting diode device of claim 1, wherein the heat radiation portion contacts the one of the cathode lead frame and the anode lead frame at a position outside of the indentation.

11. The light emitting diode device of claim 1, wherein the heat radiation portion contacts the one of the cathode lead frame and the anode lead frame at a position which is not between any two parts of the synthetic resin member on any straight line,

further wherein the synthetic resin member extends along each of two opposite sides of the cathode lead frame, and along each of two opposite sides of the anode lead frame.

12. The light emitting diode device of claim 1, wherein the heat radiation portion is free of any contact with both the cathode lead frame and the anode lead frame within the indentation.

13. The light emitting diode device of claim 1, wherein the heat radiation portion extends along outer peripheral sides of the synthetic resin member.