System and method for selectively engaging cooling fans within an electronic display

• US 8,649,170 B2
• Filed: 02/05/2013
• Issued: 02/11/2014
• Est. Priority Date: 02/16/2010
• Status: Active Grant

• Current Assignee: Manufacturing Resources International, Inc.
• Original Assignee: Manufacturing Resources International, Inc.
• Inventors: Dunn, William, Hubbard, Tim, Bedell, Ware
• Primary Examiner(s): Vu, Phu
• Application Number:
  US13/759,744
• Publication Number:
  US 20130170139A1
• Time in Patent Office: 371 Days
• Field of Search: 349/161, 361/679.47, 362/547
• US Class Current: 361/679.47
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: G02F 1/13 based on liquid crystals, e.g. single liquid crystal display cells
• CPC Class Codes: G02F 1/133385 with cooling means, e.g. fans
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133628 with cooling means
• CPC Class Codes: G02F 2201/36 Airflow channels, e.g. constructional arrangements facilitating the flow of air
• CPC Class Codes: G05D 23/1934 each space being provided with one sensor acting on one or more control means
• CPC Class Codes: H05K 7/20972 Forced ventilation, e.g. on heat dissipaters coupled to components

Abstract

A system and method for cooling an electronic image assembly having a plurality of cooling gas pathways place behind the electronic image assembly. A first fan may be used to force cooling gas through a first grouping of cooling gas pathways while a second fan may be used to force cooling gas through a second grouping of cooling gas pathways. Temperature sensing devices may be positioned so as to measure the temperature of the first and second groupings of cooling gas pathways. The speeds of the first and second fans may be adjusted based on the temperature measurements of the cooling gas pathway groupings. Additional fans with additional temperature sensing devices may be used for further accuracy and control over the temperature gradients of the electronic image assembly. Manifolds may be used to distribute/collect cooling gas to/from the cooling gas pathways.

Claims

1. A system for cooling an electronic image assembly comprising:

a plurality of ambient gas pathways positioned behind the electronic image assembly;

a first fan positioned to force cooling gas through a first grouping of ambient gas pathways;

a second fan positioned to force cooling gas through a second grouping of ambient gas pathways;

a first temperature sensing device positioned to measure the temperature of one or more of the ambient gas pathways in the first grouping;

a second temperature sensing device positioned to measure the temperature of one or more of the ambient gas pathways in the second grouping; and

a microprocessor in electrical communication with the fans and temperature sensing devices.

2. The cooling system of claim 1 further comprising:

a third fan positioned to force cooling gas through a third grouping of ambient gas pathways;

a third temperature sensing device positioned to measure the temperature of one or more of the ambient gas pathways in the third grouping; and

wherein the microprocessor is in electrical communication with the third fan and third temperature sensing device.

3. The cooling system of claim 1 wherein:

the ambient gas pathways are in conductive thermal communication with the electronic image assembly.

4. The cooling system of claim 1 further comprising:

a transparent front plate placed in front of the electronic image assembly, the space between the front plate and the electronic image assembly defining a circulating gas pathway;

a circulating fan position to force circulating gas through the circulating gas pathway; and

a pass through plate having a first pass through for ambient gas travelling through the ambient gas pathways and a second pass through for circulating gas.

5. The cooling system of claim 1 further comprising:

a first manifold in gaseous communication with each ambient gas pathway, and arranged to accept ambient gas and distribute ambient gas to each ambient gas pathway; and

a second manifold in gaseous communication with each ambient gas pathway and arranged to accept ambient gas from each ambient gas pathway and direct the ambient gas towards an exhaust.

6. The cooling system of claim 1 wherein:

the ambient gas pathways are metallic ducts.

7. The cooling system of claim 5 wherein:

the first and second fans are positioned within the first manifold to push the ambient gas through the ambient gas pathways.

8. The cooling system of claim 5 wherein:

the first and second fans are positioned within the second manifold to pull the ambient gas through the ambient gas pathways.

9. A system for cooling a first and second rear portion of an electronic image assembly, the system comprising:

a first plurality of cooling ducts placed behind the first rear portion of the electronic image assembly;

a second plurality of cooling ducts placed behind the second rear portion of the electronic image assembly;

a manifold in gaseous communication with each cooling duct;

a first temperature measurement device positioned to measure a temperature near the first rear portion of the electronic display;

a second temperature measurement device positioned to measure the temperature near the second rear portion of the electronic display;

a first fan positioned to force cooling gas through the first plurality of cooling ducts;

a second fan positioned to force cooling gas through the second plurality of cooling ducts; and

a means for controlling the speed of the first fan in response to data from the first temperature measurement device and controlling the speed of the second fan in response to data from the second temperature measurement device.

10. The cooling system of claim 9 wherein:

the cooling ducts are in conductive thermal communication with the electronic image assembly.

11. The cooling system of claim 9 wherein:

the manifold is placed along a vertical edge of the electronic image assembly.

12. The cooling system of claim 9 wherein:

the fans are placed within the manifold.

13. The cooling system of claim 9 wherein:

the means for controlling the speed of the first fan in response to data from the first temperature measurement device is a computer processor.

14. The cooling system of claim 9 further comprising:

a front plate placed in front of the electronic image assembly, the space between the front plate and the electronic image assembly defining a circulating gas pathway;

a circulating fan position to force circulating gas through the circulating gas pathway; and

a pass through plate having a first pass through for ambient gas and a second pass through for circulating gas.

15. The cooling system of claim 14 wherein:

the first and second pass throughs do not allow the ambient gas and circulating gas to mix.

16. The cooling system of claim 9 wherein:

the electronic image assembly is a liquid crystal display.

17. A method for cooling an electronic image assembly having a plurality of cooling gas pathways placed behind the electronic image assembly, a first fan positioned to force cooling gas through a first grouping of cooling gas pathways, and a second fan positioned to force cooling gas through a second grouping of cooling gas pathways, the method comprising the steps of:

measuring the temperature T1 of the first grouping of cooling gas pathways;

measuring the temperature T2 of the second grouping of cooling gas pathways;

increasing the speed of the first fan if T1 is greater than T2; and

increasing the speed of the second fan if T2 is greater than T1.

18. A method for cooling an electronic image assembly having a plurality of cooling gas pathways placed behind the electronic image assembly where the cooling gas pathways have a desired operating temperature range, a first fan positioned to force cooling gas through a first grouping of cooling gas pathways, a second fan positioned to force cooling gas through a second grouping of cooling gas pathways, and a third fan positioned to force cooling gas through a third grouping of cooling gas pathways, the method comprising the steps of:

measuring the temperature T1 of the first grouping of cooling gas pathways;

measuring the temperature T2 of the second grouping of cooling gas pathways;

measuring the temperature T3 of the third grouping of cooling gas pathways;

increasing the speed of the first fan if T1 is higher than the desired operating temperature range;

increasing the speed of the second fan if T2 is higher than the desired operating temperature range; and

increasing the speed of the third fan if T3 is higher than the desired operating temperature range.

19. The method of claim 18 further comprising the steps of:

decreasing the speed of the first fan if T1 is lower than the desired operating temperature range;

decreasing the speed of the second fan if T2 is lower than the desired operating temperature range; and

decreasing the speed of the third fan if T3 is lower than the desired operating temperature range.

20. The method of claim 19 wherein:

the steps of increasing and decreasing the speed of the fans is performed by any one of the following;

microcontroller, CPU, and microprocessor.