Method of forming a patterned substrate
First Claim
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1. A method of forming a patterned substrate comprising:
- providing a substrate having a structured surface region comprising one or more recessed features;
disposing a first liquid onto at least a portion of the structured surface region, wherein the first liquid comprises a metal, a metal precursor, an electroless plating catalyst, an electroless plating catalyst precursor, a mask material, or a combination thereof;
contacting the first liquid with a second liquid; and
displacing the first liquid with the second liquid from at least a portion of the structured surface region, the first liquid selectively located in at least a portion of the one or more recessed features.
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Abstract
A method of forming a patterned substrate is provided. The method includes providing a substrate (300) having a structured surface region comprising one or more recessed features (310). The method includes disposing a first liquid (325) onto at least a portion of the structured surface region. The method includes contacting the first liquid with a second liquid (330). The method includes displacing the first liquid with the second liquid from at least a portion (315) of the structured surface region. The first liquid is selectively located in at least a portion of the one or more recessed features.
47 Citations
20 Claims
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1. A method of forming a patterned substrate comprising:
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providing a substrate having a structured surface region comprising one or more recessed features; disposing a first liquid onto at least a portion of the structured surface region, wherein the first liquid comprises a metal, a metal precursor, an electroless plating catalyst, an electroless plating catalyst precursor, a mask material, or a combination thereof; contacting the first liquid with a second liquid; and displacing the first liquid with the second liquid from at least a portion of the structured surface region, the first liquid selectively located in at least a portion of the one or more recessed features. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of forming a patterned substrate comprising:
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providing a substrate having a metallized structured surface region comprising a metal layer disposed on the substrate, the metallized structured surface region comprising one or more recessed features and a surface region complementary to the one or more recessed features; disposing a first liquid onto at least a portion of the metallized structured surface region; contacting the first liquid with a second liquid; displacing the first liquid with the second liquid from at least a portion of the metallized structured surface region, the first liquid selectively located in at least a portion of the one or more recessed features; and dissolving at least a portion of the metal layer into the second liquid selectively from the surface region complementary to the one or more recessed features. - View Dependent Claims (15, 16, 17, 18, 19)
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20. A method of forming a patterned substrate comprising:
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providing a substrate having a structured surface region comprising one or more recessed features; disposing a first liquid onto at least a portion of the structured surface region; contacting the first liquid with a second liquid; and displacing the first liquid with the second liquid from at least a portion of the structured surface region, the first liquid selectively located in at least a portion of the one or more recessed features, wherein the first liquid converts to a solid after the first liquid is selectively located in at least a portion of the one or more recessed features.
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Specification