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Sensor device and method

  • US 8,652,866 B2
  • Filed: 01/03/2013
  • Issued: 02/18/2014
  • Est. Priority Date: 03/12/2009
  • Status: Active Grant
First Claim
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1. A method of manufacturing a sensor device, comprising:

  • providing a first semiconductor chip having a sensing region;

    attaching the first semiconductor chip to a porous structure element with the sensing region facing a first region of the porous structure element, the porous structure element comprising an interconnected network of pores; and

    encapsulating the first semiconductor chip and the porous structure element such that a second region of the porous structure element remains exposed.

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