In-plane capacitive mems accelerometer

• US 8,656,778 B2
• Filed: 12/30/2010
• Issued: 02/25/2014
• Est. Priority Date: 12/30/2010
• Status: Active Grant

• Current Assignee: Rosemount Aerospace, Inc. (Rtx Corporation)
• Original Assignee: Rosemount Aerospace, Inc. (Rtx Corporation)
• Inventors: Guo, Shuwen, Spivak, Alexander, Fink, Anita
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US12/982,720
• Publication Number:
  US 20120167685A1
• Time in Patent Office: 1,153 Days
• Field of Search: 735/143.2
• US Class Current: 73/514.32
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type

Abstract

A system for determining in-plane acceleration of an object. The system includes an in-plane accelerometer with a substrate rigidly attached to an object, and a proof mass—formed from a single piece of material—movably positioned a predetermined distance above the substrate. The proof mass includes a plurality of electrode protrusions extending downward from the proof mass to form a gap of varying height between the proof mass and the substrate. The proof mass is configured to move in a direction parallel to the upper surfaces of each of the plurality of substrate electrodes when the object is accelerating, which results in a change in the area of the gap, and a change in capacitance between the substrate and the proof mass. The in-plane accelerometer can be fabricated using the same techniques used to fabricate an out-of-plane accelerometer and is suitable for high-shock applications.

Claims

1. An in-plane accelerometer, comprising:

a substrate rigidly attached to an object;

a plurality of first substrate electrodes extending upward from the substrate and alternating with a plurality of second substrate electrodes extending upward from the substrate, with each substrate electrode having a planar upper surface, the plurality of first substrate electrodes being electrically connected to one another and the plurality of second substrate electrodes being electrically connected to one another;

a proof mass formed from a single piece of material, the proof mass being positioned a predetermined distance above the substrate and including a plurality of electrode protrusions extending downward from the proof mass to form a gap of varying height between the proof mass and the substrate, wherein a first capacitor is formed between the proof mass and the plurality of first substrate electrodes, and a second capacitor is formed between the proof mass and the plurality of second substrate electrodes;

a spring configured and adapted to movably position the proof mass relative to the substrate, the spring flexible in a first direction parallel to the planar upper surfaces of the substrate electrodes and stiff in a second direction substantially perpendicular to the first direction; and

a topping wafer bonded to the substrate and configured and adapted to provide shock protection for the proof mass;

wherein the proof mass is configured to be held in an equilibrium position when the velocity of the object is constant, with each of the plurality of electrode protrusions being positioned over a portion of one first substrate electrode and a portion of an adjacent second substrate electrode when the proof mass is in the equilibrium position;

wherein the proof-mass is configured to move in a direction parallel to the upper surfaces of each of the plurality of substrate electrodes when the object is accelerating, thus changing an area of the gap between the upper surface of each of the substrate electrodes and the proof mass, and

wherein the accelerometer includes lateral bumps configured and adapted to prevent the spring from cracking during high shock loads, the lateral bumps defined by structure operatively disposed between a first section coupled to the substrate and a second section offset from the topping wafer, the lateral bumps extending in the first direction beyond the first and second sections.

2. The in-plane accelerometer of claim 1, wherein the proof mass is fainted from a single piece of silicon.

3. The in-plane accelerometer of claim 1, wherein the capacitance of the first capacitor and the capacitance of the second capacitor are equal when the proof mass is in the equilibrium position.

4. The in-plane accelerometer of claim 1, wherein the plurality of electrode protrusions comprise a plurality of fingers formed using a Deep Reactive-Ion Etching (DRIE) process such that the side walls of each of the fingers are vertical.

5. The in-plane accelerometer of claim 1, wherein the plurality of electrode protrusions are etched from the material using potassium hydroxide (KOH) so that the side walls of the protrusions have an angle of 54.7 degrees.

6. The in-plane accelerometer of claim 1, wherein the proof mass includes a first planar surface formed between each pair of adjacent electrode protrusions and a second planar surface formed on each of the electrode protrusions, with both the first and second planar surfaces being parallel to the planar upper surface of each of the substrate electrodes.

7. The in-plane accelerometer of claim 6, wherein a first distance between each of the first planar surfaces and a corresponding planar upper surface of one of the substrate electrodes is greater than a second distance between each of the second planar surfaces and the same planar upper surface of one of the substrate electrodes.

8. The in-plane accelerometer of claim 7, wherein the first distance is at least ten times larger than the second distance.

9. The in-plane accelerometer of claim 1, wherein the proof mass is held in the equilibrium position by the spring, and the spring permits movement only in a direction parallel to the planar upper surfaces of the substrate electrodes.

10. The in-plane accelerometer of claim 9, wherein the cross talk of the spring in a direction perpendicular to the planar upper surfaces of the substrate electrodes is less than 3%.

11. The in-plane accelerometer of claim 1, wherein the proof mass has a thickness of approximately 75 μ

m.

12. The in-plane accelerometer of claim 1, wherein the height of each substrate electrode is between 2 μ

m and 4 μ

m.

13. The in-plane accelerometer of claim 1, further comprising a guard ring surrounding the proof mass.

14. The in-plane accelerometer of claim 1, wherein the proof mass is movably attached to the wafer, and the wafer is fusion bonded to the substrate.

15. A method of measuring in-plane acceleration of an object, the method comprising the steps of:

rigidly attaching a substrate to an object;

securing a proof mass in an equilibrium position a predetermined distance above the substrate to form a gap of varying height between the proof mass and the substrate;

forming a first differential capacitor between the proof mass and a plurality of first substrate electrodes, and forming a second differential capacitor between the proof mass and a plurality of second substrate electrodes, wherein the first substrate electrodes and second substrate electrodes are alternatingly positioned on the substrate;

displacing the proof mass from the equilibrium position in a direction parallel to a planar upper face of the substrate electrodes by applying an acceleration force to the object;

measuring a first change in capacitance in the first differential capacitor;

measuring a second change in capacitance in the second differential capacitor; and

using a circuit to convert the measured changes in capacitance to a voltage representing acceleration of the object,

wherein securing the proof mass includes providing;

a spring configured and adapted to movably position the proof mass relative to the substrate, the spring flexible in a first direction parallel to planar upper surfaces of the substrate electrodes and stiff in a second direction substantially perpendicular to the first direction;

a topping wafer bonded to the substrate and configured and adapted to provide shock protection for the proof mass; and

a plurality of lateral bumps configured and adapted to prevent the spring from cracking during high shock loads, the lateral bumps defined by structure operatively disposed between a first section coupled to the substrate and a second section offset from the topping wafer, the lateral bumps extending in the first direction beyond the first and second sections.

16. The method of claim 15, further comprising summing the first change in capacitance with the second change in capacitance in the circuit.

17. The method of claim 15, further comprising using the circuit to amplify the differential change and to minimize the common capacitive change measured in the first and second capacitors.

18. The method of claim 15, wherein the steps of forming a first differential capacitor and a second differential capacitor comprise centering an electrode protrusion of the proof mass between each pair of adjacent first and second substrate electrodes.

19. A method of determining in-plane acceleration of an object, the method comprising the steps of:

rigidly attaching a substrate to an object;

suspending and securing a proof mass above the substrate, the proof mass being constrained to move in only one direction;

forming a differential capacitor between the proof mass and the substrate, wherein the proof mass includes a plurality of electrode protrusions with each electrode protrusion centered above two substrate electrodes such that an area between an upper planar surface of each substrate electrode and the proof mass changes when the proof mass moves in a direction parallel to the upper planar surfaces of the substrate electrode;

displacing the proof mass by applying an acceleration force to the object;

measuring a change in capacitance between each substrate electrode and the proof mass;

using a circuit to convert the measured change in capacitance to a voltage representing acceleration of the object; and

outputting a voltage from the circuit that is proportional to the change in area between the upper planar surface of each substrate electrode and the proof mass,

wherein suspending and securing the proof mass above the substrate includes providing;

a spring configured and adapted to movably position the proof mass relative to the substrate, the spring flexible in a first direction parallel to the planar upper surfaces of the substrate electrodes and stiff in a second direction substantially perpendicular to the first direction,

a topping wafer bonded to the substrate and configured and adapted to provide shock protection for the proof mass, and

a plurality of lateral bumps configured and adapted to prevent the spring from cracking during high shock loads, the lateral bumps defined by structure operatively disposed between a first section coupled to the substrate and a second section offset from the topping wafer, the lateral bumps extending in the first direction beyond the first and second sections.