Method for fabricating a proximity sensing module

• US 8,657,982 B2
• Filed: 07/17/2012
• Issued: 02/25/2014
• Est. Priority Date: 11/15/2011
• Status: Active Grant

• Current Assignee: Quanta Computer
• Original Assignee: Quanta Computer
• Inventors: Wu, Chia-Hui, Liang, Yuan-Chen, Lee, Hung-Ta, Lin, Yi-Chun, Chien, Li-Chuan, Hsu, Kuo-Hsiang
• Primary Examiner(s): Goff, John
• Assistant Examiner(s): Kwon, Hannuri L
• Application Number:
  US13/551,041
• Publication Number:
  US 20130118676A1
• Time in Patent Office: 588 Days
• Field of Search: 298/25, 298/29, 345/173, 345/174, 345/175, 361/179, 361/181
• US Class Current: 156/239
• CPC Class Codes: H03K 17/955 using a capacitive detector
• CPC Class Codes: H03K 2017/9602 characterised by the type or shape of the sensing electrodes
• CPC Class Codes: H03K 2217/960755 Constructional details of capacitive touch and proximity switches
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1039 Surface deformation only of sandwich or lamina [e.g., embossed panels]
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing
• CPC Class Codes: Y10T 156/1064 Partial cutting [e.g., grooving or incising]
• CPC Class Codes: Y10T 156/108 Flash, trim or excess removal
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

The steps of a method for fabricating a proximity sensing module that is adapted to be attached to a mobile device, include: (a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad; (b) adhering an adhesive sheet to the patterned conductive film; and (c) forming a through hole in the adhesive sheet such that the upper connective pad is exposed from the through hole.

Claims

1. A method for fabricating a proximity sensing module that is adapted to be attached to an inner surface of a housing of a mobile device, the method comprising:

adhering a lower conductive film to a release sheet;

patterning the lower conductive film into a lower connective pad after the adhering the lower conductive film;

patterning an upper conductive film to form a patterned conductive film after the patterning the lower conductive film, the patterned conductive film including an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad, wherein the upper conductive film is formed to cover the lower connective pad, and the upper connective pad is formed at a position corresponding to the lower connective pad and while patterning the upper conductive film, the lower connective pad is patterned into a shape corresponding to an outline of the upper connective pad;

adhering an adhesive sheet to the patterned conductive film, the adhesive sheet having an area capable of covering the upper connective pad and the induced circuit pattern;

forming a first through hole in the adhesive sheet such that the upper connective pad is exposed from the first through hole.

2. The method of claim 1, further comprising adhering the upper conductive film to the release sheet before the patterning the upper conductive film.

3. The method of claim 2, wherein the adhesive sheet is also adhered to the release sheet exposed from the patterned conductive film.

4. The method of claim 2, wherein the step of patterning the upper conductive film is conducted by stamping the upper conductive film, followed by removing an undesired part of the upper conductive film.

5. The method of claim 1, wherein the adhesive sheet is also adhered to the release sheet exposed from the patterned conductive film.

6. The method of claim 1, wherein the step of patterning the lower conductive film is conducted by stamping the lower conductive film, followed by removing an undesired part of the lower conductive film.

7. The method of claim 1, further comprising:

forming a protective film on a surface of the adhesive sheet opposite to the patterned conductive film; and

forming a second through hole in the protective film to align with the first through hole such that the upper connective pad is exposed from the first and second through holes.

8. The method of claim 7, further comprising:

removing a non-essential part of each of the adhesive sheet and the protective film.

9. The method of claim 1, wherein the induced circuit pattern includes a plurality of induced blocks, and a wire unit that interconnects the induced blocks and the upper connective pad.

10. The method of claim 1, wherein the upper conductive film is made of copper.