Semiconductor device and fabrication method thereof
First Claim
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1. A method for fabricating a semiconductor device comprising:
- providing a first dummy gate having a first high-k gate insulator layer, a first composite sacrificial layer, and a first dummy gate electrode sequentially stacked on a substrate;
providing a second dummy gate simultaneously with the provision of the first dummy gate, wherein the second dummy gate has a second high-k gate insulator layer, a second composite sacrificial layer, and a second dummy gate electrode sequentially stacked on the substrate;
removing the first dummy gate electrode to expose the first composite sacrificial layer;
removing the second dummy gate electrode simultaneously with the step of removing the first dummy gate electrode to expose the second composite sacrificial layer;
forming a first patterned photo-resist layer to cover the exposed second composite sacrificial layer,removing the first composite sacrificial layer;
forming a first work function layer on the first high-k gate insulator layer; and
forming a first metal gate electrode on the first work function layer.
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Abstract
A method for fabricating a semiconductor device comprises steps as follows: A first dummy gate having a first high-k gate insulator layer, a first composite sacrificial layer, and a first dummy gate electrode sequentially stacked on a substrate is firstly provided. The first dummy gate electrode is subsequently removed to expose the first composite sacrificial layer. The first composite sacrificial layer is then removed. Thereafter, a first work function layer is formed on the first high-k gate insulator layer, and a first metal gate electrode is formed on the first work function layer.
73 Citations
10 Claims
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1. A method for fabricating a semiconductor device comprising:
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providing a first dummy gate having a first high-k gate insulator layer, a first composite sacrificial layer, and a first dummy gate electrode sequentially stacked on a substrate; providing a second dummy gate simultaneously with the provision of the first dummy gate, wherein the second dummy gate has a second high-k gate insulator layer, a second composite sacrificial layer, and a second dummy gate electrode sequentially stacked on the substrate; removing the first dummy gate electrode to expose the first composite sacrificial layer; removing the second dummy gate electrode simultaneously with the step of removing the first dummy gate electrode to expose the second composite sacrificial layer; forming a first patterned photo-resist layer to cover the exposed second composite sacrificial layer, removing the first composite sacrificial layer; forming a first work function layer on the first high-k gate insulator layer; and forming a first metal gate electrode on the first work function layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for fabricating a complementary metal-oxide semiconductor (CMOS) transistor comprising:
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providing a first dummy gate having a first high-k gate insulator layer, a first composite sacrificial layer, and a first dummy gate electrode sequentially stacked on an N well region of a substrate; providing a second dummy gate simultaneously with the provision of the first dummy gate, wherein the second dummy gate has a second high-k gate insulator layer, a second composite sacrificial layer, and a second dummy gate electrode sequentially stacked on a P well region of the substrate; removing the first dummy gate electrode and the second dummy gate electrode to expose the first composite sacrificial layer and the second composite sacrificial layer; forming a first patterned photo-resist layer to cover the exposed second composite sacrificial layer; removing the first composite sacrificial layer to expose the first high-k gate insulator layer; forming a first work function layer on the first high-k gate insulator layer and the exposed second composite sacrificial layer, after the first patterned photo-resist layer is removed; forming a second patterned photo-resist layer to cover a portion of the first work function layer which covers the first high-k gate insulator layer; performing an etching process to remove portions of the first work function layer and the second composite sacrificial layer that are not covered by the second patterned photo-resist layer; forming a second work function layer on the first high-k gate insulator layer and the second high-k gate insulator layer, after the second patterned photo-resist layer is removed; forming a first metal gate electrode on the first work function layer; and forming a second metal gate electrode on the second work function layer simultaneously with the formation of the first metal gate electrode.
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Specification