Pyridinium boronic acid quenchers for use in analyte sensors

• US 8,658,795 B2
• Filed: 04/25/2012
• Issued: 02/25/2014
• Est. Priority Date: 05/01/2007
• Status: Active Grant

• Current Assignee: Medtronic Minimed Incorporated (Medtronic Plc)
• Original Assignee: GluMetrics, Inc.
• Inventors: Gamsey, Soya, Wessling, Ritchie A.
• Primary Examiner(s): Aulakh, Charanjit
• Application Number:
  US13/456,059
• Publication Number:
  US 20120208286A1
• Time in Patent Office: 671 Days
• Field of Search: 436/96, 436/95, 424/9.1, 546/13
• US Class Current: 546/13
• CPC Class Codes: C07F 5/025 Boronic and borinic acid compounds
• CPC Class Codes: G01N 2400/00 Assays, e.g. immunoassays or enzyme assays, involving carbohydrates
• CPC Class Codes: G01N 33/523 the element being adapted for a specific analyte
• CPC Class Codes: Y10T 436/104998 Glucose, ketone, nitrate standard or control
• CPC Class Codes: Y10T 436/144444 Glucose
• CPC Class Codes: Y10T 436/145555 Hetero-N

Abstract

Novel pyridinium salts functionalized with boronic acid and methods of making them are disclosed. When combined with a fluorescent dye, the compounds are useful in the detection of polyhydroxyl-substituted organic molecules.

Claims

1. An analyte sensor comprising:

a fluorophore comprising a pyranine derivative configured to absorb light at a first wavelength and emit light at a second wavelength; and

a quencher having the structure;

2. The analyte sensor of claim 1, wherein said pyranine derivative is a hydroxypyrene trisulfonamide derivative.

3. The analyte sensor of claim 1, wherein said pyranine derivative is a polymeric derivative of hydroxypyrene trisulfonic acid.

4. The analyte sensor of claim 1, wherein said pyranine derivative is HPTS-TrisCys-MA.

5. The analyte sensor of claim 1, wherein the said quencher is in the form of a polymer.

6. An analyte sensor comprising:

a fluorophore comprising a pyranine derivative configured to absorb light at a first wavelength and emit light at a second wavelength; and

a quencher having the following structure;