Inputting module and submount thereof and manufacturing method of the submount

• US 8,658,961 B2
• Filed: 08/05/2011
• Issued: 02/25/2014
• Est. Priority Date: 08/05/2011
• Status: Active Grant

• Current Assignee: TrueLight Corporation
• Original Assignee: TrueLight Corporation
• Inventors: Chen, Chih-Cheng, Pan, Jin-Shan
• Primary Examiner(s): Sohn, Seung C
• Application Number:
  US13/198,902
• Publication Number:
  US 20130032701A1
• Time in Patent Office: 935 Days
• Field of Search: 250/216, 250/227.11, 356/71, 382/124, 382/127
• US Class Current: 250/216
• CPC Class Codes: G06F 3/03547 Touch pads, in which fingers can move on a surface
• CPC Class Codes: H01J 3/14 Arrangements for focusing or reflecting ray or beam H01J3/02, H01J3/04 take precedence
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

A submount is used for disposing an illuminant element or a light-receiving element having an optical axis. The submount is disposed at a plane and has a main body. The main body includes a first surface and a second surface. The first surface is approximately parallel to the plane and far away from the plane. The second surface is approximately parallel to the plane and adjacent to the plane. A disposing part of the first surface is tilted with respect to the second surface at a predetermined angle. The illuminant element or the light-receiving element is disposed on the disposing part. The optical axis of the illuminant element or the light-receiving element is tiled with respect to a normal of the second surface at the predetermined angle.

Claims

1. A submount for optical device is disposed on a plane and used for disposing an illuminant element or a light-receiving element having an optical axis, the submount comprising:

a main body, comprising;

a first surface parallel to the plane and far away from the plane; and

a second surface parallel to the plane and adjacent to the plane;

wherein a disposing part of the first surface is tilted with respect to the second surface at a predetermined angle, the illuminant element or the light-receiving element is disposed on the disposing part and the optical axis of the illuminant element or the light-receiving element is tiled with respect to a normal of the second surface at the predetermined angle.

2. The submount in claim 1, wherein the predetermined angle is between 5 and 45 degrees.

3. The submount in claim 1, further comprises two electrodes attached to the first surface.

4. The submount in claim 1, wherein the disposing part is a recess, the recess has a bottom surface and the bottom surface is tilted with respect to the second surface at the predetermined angle.

5. An inputting module, comprising:

a circuit board having an upper surface and a lower surface;

an illuminant element package disposed on the upper surface of the circuit board, the illuminant element package comprising;

a submount, comprising;

a first surface which is parallel to the circuit board and far away from the circuit board;

a second surface which is parallel to the circuit board and adjacent to the circuit board, a disposing part of the first surface is tilted with respect to the second surface at a predetermined angle;

an illuminant element having an optical axis and disposed on the upper surface of the circuit board, the optical axis of the illuminant element is tilted with respect to a normal of the second surface at the predetermined angle; and

a sensing element disposed on the upper surface of the circuit board, the sensing element comprising a sensing surface and a rear surface which is opposite to the sensing surface, the sensing surface having a sensing area.

6. The inputting module in claim 5, wherein the predetermined angle is between 5 and 45 degrees.

7. The inputting module in claim 5, wherein the illuminant element is a vertical-cavity surface emitting laser die.

8. The inputting module in claim 5, wherein the first surface further comprising a recess and a platform which is opposite to the recess, the recess has a bottom surface and the bottom surface is tiled with respect to a normal of the second surface at the predetermined angle.

9. The inputting module in claim 5, wherein the submount further comprising two electrodes respectively attached to the first surface and the two electrodes electrically connected to two conductive electrodes of the illuminant element.

10. The inputting module in claim 9, further comprising at least a wire bridged over the conductive electrodes and the electrodes.

11. The inputting module in claim 5, further comprising:

an intermediary board comprising an upper surface and a lower surface opposite to the upper surface, the upper surface is attached to the second surface of the submount;

two electrodes attached to the upper surface of the intermediary board and electrically connected to two conductive electrodes of the illuminant element;

two solder pads attached to the lower surface of the intermediary board and electrically connected to the electrodes.

12. The inputting module in claim 11, further comprising at least a wire bridged over the conductive electrode and the electrode of the illuminant element.

13. The imputing module in claim 12, further comprising a transmissive adhesive disposed on the upper surface of the intermediary board, wherein the illuminant element and the wire are enclosed within the transmissive adhesive.

14. The inputting module in claim 5, wherein the sensing element is a complementary metal-oxide-semiconductor image sensing element.

15. The inputting module in claim 5, further comprising a shield having an opening, the shield is positioned on the sensing element and the opening is aligned to the sensing area of the sensing element.

16. The inputting module in claim 5, wherein the sensing element further comprising a submount, the submount comprising:

a first surface which is parallel to the circuit board and far away from the circuit board;

a second surface which is parallel to the circuit board and adjacent to the circuit board, a disposing part of the first surface is tilted with respect to the second surface at a predetermined angle;

wherein the sensing element is disposed on the disposing part and the optical axis of the sensing element is tiled with respect to a normal of the second surface at the predetermined angle.

17. A manufacturing method of a submount, the submount used for disposing an illuminant element or a light-receiving element, the method comprising:

A. providing a silicon ingot;

B. cutting the silicon ingot into at least a wafer along a predetermined lattice plane with a predetermined angle;

C. coating a photoresist layer on a surface of the wafer;

D. providing a mask and positioning on the surface which coated with the photoresist layer;

E. providing a light source to illuminate the wafer to exposure the photoresist layer;

F. removing the mask;

G. providing a developing solution and putting the wafer into the developing solution to remove the non-necessity part of the photoresist layer;

H. providing an etching solution and putting the wafer into the etching solution to form a plurality of recesses on the wafer;

I. providing at least an electrode and attaching to the wafer;

J. cutting the wafer into a plurality of submounts.

18. The manufacturing method of the submount in claim 17, wherein the predetermined angle is between 5 and 45 degrees.

19. The manufacturing method of the submount in claim 17, wherein the etching solution is potassium hydroxide.

20. The manufacturing method of the submount in claim 17, wherein the predetermined lattice plane is (1, 1, 1) lattice plane or (0, 0, 1) lattice plane.