Wiring substrate, imaging device and imaging device module

• US 8,659,105 B2
• Filed: 11/26/2010
• Issued: 02/25/2014
• Est. Priority Date: 11/26/2009
• Status: Active Grant

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Takeshita, Fumiaki, Moriyama, Yousuke
• Primary Examiner(s): Ho, Anthony
• Application Number:
  US13/262,598
• Publication Number:
  US 20120104524A1
• Time in Patent Office: 1,187 Days
• Field of Search: 257/432
• US Class Current: 257/432
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 27/14618 Containers

Abstract

A imaging device includes a first insulating substrate having a through hole, a connection electrode and a first wiring conductor, a second insulating substrate having outside terminals and a second wiring conductor, and an imaging element including a light-receiving portion arranged at a center portion on an upper surface thereof and a connection terminal arranged at an outer peripheral portion thereof, at least one of the lower surface of the first insulating substrate and the upper surface of the second insulating substrate including a recess portion, the through hole being located on an inner side thereof, the imaging element being arranged below the first insulating substrate such that the light-receiving portion is located within the through hole, the connection terminal being electrically connected to the connection electrode, the imaging element being accommodated inside the recess portion, outer peripheral portions of the first insulating substrate and the second insulating substrate being electrically connected to each other.

Claims

1. A wiring substrate, comprising:

a first insulating substrate comprising

a through hole formed in a center portion thereof,

a connection electrode to which a connection terminal of an imaging element is connected, being arranged around the through hole on a lower surface of the first insulating substrate, and

a first wiring conductor comprising one end connected to the connection electrode and the other end led out to an outer peripheral portion on the lower surface of the first insulating substrate; and

a second insulating substrate comprising

a plurality of outside terminals arranged on a lower surface of the second insulating substrate, and

a second wiring conductor comprising one end connected to the outside terminals and the other end led out to an outer peripheral portion on an upper surface of the second insulating substrate, wherein

at least one of the lower surface of the first insulating substrate and the upper surface of the second insulating substrate comprises a recess portion, the through hole being located on an inner side of the recess portion in a plan view, and

an outer peripheral portion of the first insulating substrate being joined to an outer peripheral portion of the second insulating substrate so that the first wiring conductor and the second wiring conductor are electrically connected to each other,

wherein a size of the first insulating substrate and a size of the second insulating substrate are different in a plan view, and

wherein the first insulating substrate and the second insulating substrate are joined together with a joining member, the joining member being arranged at an outer peripheral portion of the larger insulating substrate and an outer peripheral portion and a lateral surface of the smaller insulating substrate.

2. An imaging device, comprising:

a first insulating substrate comprising

a through hole formed in a center portion thereof,

a connection electrode arranged around the through hole on a lower surface of the first insulating substrate, and

a first wiring conductor comprising one end connected to the connection electrode and the other end led out to an outer peripheral portion on the lower surface of the first insulating substrate;

a second insulating substrate comprising

a plurality of outside terminals arranged on a lower surface of the second insulating substrate, and

a second wiring conductor comprising one end connected to the outside terminals and the other end led out to an outer peripheral portion on an upper surface of the second insulating substrate; and

an imaging element comprising

a light-receiving portion arranged at a center portion on an upper surface thereof, and

a connection terminal arranged at an outer peripheral portion thereof, wherein

at least one of the lower surface of the first insulating substrate and the upper surface of the second insulating substrate comprises a recess portion, the through hole being located on an inner side thereof,

the imaging element is arranged below the first insulating substrate such that the light-receiving portion on the upper surface of the imaging element is located within the through hole in a plan view,

the connection terminal being electrically connected to the connection electrode, and

an outer peripheral portion of the first insulating substrate being joined to an outer peripheral portion of the second insulating substrate so that the first wiring conductor and the second wiring conductor are electrically connected to each other and the imaging element is accommodated inside the recess portion,

wherein the outer peripheral portion of the first insulating substrate and the outer peripheral portion of the second insulating substrate are joined together at a joint portion, and

wherein, in a thickness direction of the imaging device, a distance between the joint portion and the lower surface of the second insulating substrate is smaller than a distance between the light receiving-portion of imaging element and the lower surface of the second insulating substrate.

3. The imaging device according to claim 2, wherein

the first insulating substrate and the second insulating substrate are made of materials with a same thermal expansion coefficient.

4. The imaging device according to claim 2, wherein

the outer peripheral portion of the first insulating substrate and the outer peripheral portion of the second insulating substrate are joined together by engaging together a depression and a protrusion that are formed at the outer peripheral portion of the first insulating substrate and the outer peripheral portion of the second insulating substrate.

5. The imaging device according to claim 2, wherein

the joint portion is joined to the outer peripheral portion of the second insulating substrate is inclined from an outer periphery side of the first insulating substrate and an outer periphery side of the second insulating substrate toward a center of the second insulating substrate to the second insulating substrate side.

6. The imaging device according to claim 2, wherein

a size of the first insulating substrate and a size of the second insulating substrate are different in a plan view, and

the first insulating substrate and the second insulating substrate are joined together with a joining member, the joining member being arranged at an outer peripheral portion of the larger insulating substrate and an outer peripheral portion and a lateral surface of the smaller insulating substrate.

7. The imaging device according to claim 2, wherein

a light-transmitting plate member is attached to the upper surface of the first insulating substrate and covers the through hole.

8. The imaging device according to claim 7, wherein

a space enclosed by the imaging element, the light-transmitting plate member and the first insulating substrate is sealed.

9. An imaging device module, comprising:

the imaging device according to claim 2; and

a lens arranged over the through hole on the upper surface of the first insulating substrate.