Lateral power diode with self-biasing electrode
First Claim
1. A Schottky diode comprising:
- a drift region of a first conductivity type;
a lightly doped silicon region of the first conductivity type disposed in the drift region;
a conductor layer disposed on and in contact with the lightly doped silicon region, the conductor layer forming a Schottky contact with the lightly doped silicon region;
a highly doped silicon region of the first conductivity type disposed in the drift region, the highly doped silicon region being spaced from the lightly doped silicon region in the drift region such that upon biasing the Schottky diode in a conducting state, a current flows between the lightly doped silicon region and the highly doped silicon region through the drift region; and
a trench extending into the drift region perpendicular to a direction of the current flow, the trench including a dielectric layer disposed on at least a portion of a sidewall of the trench and at least one conductive electrode disposed within the dielectric layer.
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Accused Products
Abstract
A schottky diode includes a drift region of a first conductivity type and a lightly doped silicon region of the first conductivity type in the drift region. A conductor layer is over and in contact with the lightly doped silicon region to form a schottky contact with the lightly doped silicon region. A highly doped silicon region of the first conductivity type is in the drift region and is laterally spaced from the lightly doped silicon region such that upon biasing the schottky diode in a conducting state, a current flows laterally between the lightly doped silicon region and the highly doped silicon region through the drift region. A plurality of trenches extend into the drift region perpendicular to the current flow. Each trench has a dielectric layer lining at least a portion of the trench sidewalls and at least one conductive electrode.
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Citations
29 Claims
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1. A Schottky diode comprising:
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a drift region of a first conductivity type; a lightly doped silicon region of the first conductivity type disposed in the drift region; a conductor layer disposed on and in contact with the lightly doped silicon region, the conductor layer forming a Schottky contact with the lightly doped silicon region; a highly doped silicon region of the first conductivity type disposed in the drift region, the highly doped silicon region being spaced from the lightly doped silicon region in the drift region such that upon biasing the Schottky diode in a conducting state, a current flows between the lightly doped silicon region and the highly doped silicon region through the drift region; and a trench extending into the drift region perpendicular to a direction of the current flow, the trench including a dielectric layer disposed on at least a portion of a sidewall of the trench and at least one conductive electrode disposed within the dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of forming a Schottky diode, comprising:
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forming a lightly doped silicon region of a first conductivity type in a drift region of the first conductivity type; forming a conductor layer on and in contact with the lightly doped silicon region, the conductor layer forming a Schottky contact with the lightly doped silicon region; forming a highly doped silicon region of the first conductivity type in the drift region, the highly doped silicon region being spaced from the lightly doped silicon region such that upon biasing the Schottky diode in a conducting state, a current flows between the lightly doped silicon region and the highly doped silicon region through the drift region; forming a trench extending into the drift region perpendicular to a direction of the current flow; forming a dielectric layer lining at least a portion of sidewall of the trench; and forming a conductive electrode in the trench. - View Dependent Claims (13, 14, 15, 16)
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17. A semiconductor diode comprising:
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a semiconductor region of a first conductivity type; an anode region of a second conductivity type, the anode region being disposed within the semiconductor region, the anode region and the semiconductor region forming a pn junction therebetween; doped silicon region of the first conductivity type, the doped silicon region being disposed in the semiconductor region, the doped silicon region being spaced from the anode region such that upon biasing the semiconductor diode in a conducting state, a current flows between the anode region and the doped silicon region through the semiconductor region; and a trench extending into the semiconductor region perpendicular to a direction of the current flow, the trench including; a dielectric layer lining disposed on at least a portion of a sidewall of the trench; and a conductive electrode, the conductive electrode being in electrical contact and in direct physical contact with the semiconductor region along a bottom surface of the trench. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25)
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26. A method of forming a semiconductor diode comprising:
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forming an anode region in a semiconductor region of a first conductivity type, the anode region being of a second conductivity type, the anode region and the semiconductor region forming a pn junction therebetween; forming a highly doped silicon region of the first conductivity type in the semiconductor region, the highly doped silicon region being spaced from the anode region such that upon biasing the semiconductor diode in a conducting state, a current flows between the anode region and the highly doped silicon region through the semiconductor region; forming a trench extending into the semiconductor region perpendicular to a direction of the current flow; forming a dielectric layer lining at least a portion of a sidewall of the trench; and forming a conductive electrode in the trench, wherein the dielectric layer is formed such that the conductive electrode is in electrical contact and in direct physical contact with the semiconductor region along a bottom surface of the trench. - View Dependent Claims (27, 28, 29)
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Specification