Power module and power module manufacturing method

• US 8,659,130 B2
• Filed: 04/26/2011
• Issued: 02/25/2014
• Est. Priority Date: 04/26/2010
• Status: Active Grant

• Current Assignee: Hitachi Astemo Ltd. (Hitachi, Ltd.)
• Original Assignee: Hitachi Automotive Systems Limited (Hitachi, Ltd.)
• Inventors: Takagi, Yusuke, Uchiyama, Kaoru, Suwa, Tokihito, Nakatsu, Kinya, Tokuyama, Takeshi, Hiramitsu, Shinji
• Primary Examiner(s): Graybill, David E
• Application Number:
  US13/640,512
• Publication Number:
  US 20130062751A1
• Time in Patent Office: 1,036 Days
• Field of Search: None
• US Class Current: 257/675
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/33 of a plurality of layer connectors
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73221 Strap and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/84801 Soldering or alloying
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 24/34 Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/84 using a strap connector
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 7/209 : Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.

Claims

1. A power module comprising:

a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on an opposite side of the first surface; and

a case for housing the sealing body, wherein

the case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate,

the intermediate member has a first thin section having thickness smaller than thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate, and

the sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.

2. The power module according to claim 1, wherein a surface of the first heat radiation plate opposed to the first surface of the sealing body is formed to be flush with a surface of the first thin section on an inner side of the case.

3. The power module according to claim 1, wherein pin fins are formed on the first heat radiation plate and the second heat radiation plate.

4. The power module according to claim 1, wherein linear fins are formed on the first heat radiation plate and the second heat radiation plate.

5. The power module according to claim 1, wherein

the intermediate member has a second thin section having thickness smaller than thickness of the second heat radiation plate, more easily elastically deformed than the second heat radiation plate, and formed to surround the second heat radiation plate, and

the sealing body is pressed against the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section and pressed against and fixed to the second heat radiation plate via the second heat radiation plate by elastic force generated in the second thin section.

6. The power module according to claim 1, wherein a holding section is formed in the intermediate member, the holding section having thickness larger than thickness of the first thin section, formed to surround the second heat radiation plate, and having rigidity for preventing the holding section from being deformed even if the holding section receives elastic force of the first thin section generated via the first heat radiation plate and the sealing body.

7. The power module according to claim 6, wherein a first protruding section set in contact with a side of the sealing body is formed on an inner wall of the case on a side where the second heat radiation plate is arranged.

8. The power module according to claim 1, wherein

the sealing body includes a second conductor plate connected to the other electrode surface of the semiconductor element via solder,

a first concave section in which the first conductor plate is exposed in a bottom is formed on the first surface of the sealing body and a second concave section in which the second conductor plate is exposed in a bottom is formed on the second surface of the sealing body, and

the first heat radiation plate is fitted in the first concave section, and the second heat radiation plate is fitted in the second concave section.

9. The power module according to claim 8, further comprising:

a first insulating sheet opposed to an exposed surface of the first conductor plate and stored in the first concave section; and

a second insulating sheet opposed to an exposed surface of the second conductor plate and stored in the second concave section.

10. The power module according to claim 8, wherein

an opening section for inserting the sealing body is formed in the case, and

when projected from a direction perpendicular to the electrode surfaces of the semiconductor element, the first concave section is formed such that length of a first side of a projected portion of the first concave section on a side close to the opening section of the case is larger than length of the second side opposed to the first side, and the first heat radiation plate is formed such that a projected portion of the first heat radiation plate overlaps a projected section of the first concave section.

11. The power module according to claim 10, wherein

the first heat radiation plate is formed such that length of a first side of the projected portion of the first heat radiation plate on a side close to the opening section of the case is larger than length of a second side opposed to the first side.

12. A manufacturing method for a power module including:

a sealing body including a semiconductor element, a conductor plate connected to an electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and

a case including a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate and in which an opening for inserting the sealing body is formed,

the manufacturing method comprising;

a first step of elastically deforming, when a distance between an opposed surface of the first heat radiation plate and an opposed surface of the second heat radiation plate is defined as D and thickness of the sealing body is defined as T, a part of the intermediate member of the case such that, in the case formed to have the D smaller than the T, the D changes to D1 larger than the T;

a second step of inserting the sealing body from the opening of the case; and

a third step of releasing pressurizing force for elastically deforming the part of the intermediate member in the first step such that the D approaches the T from the D1.

13. A manufacturing method for a power module including:

a sealing body including a semiconductor element, a conductor plate connected to an electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the conductor plate, the sealing body having a first concave section formed on one surface and a second concave section formed on the other surface on the opposite side of the one surface, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and

a case including a first heat radiation plate opposed to the first surface of the sealing body and fit in the first concave section, a second heat radiation plate opposed to the second surface of the sealing body and fit in the second concave section, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate and in which an opening for inserting the sealing body is formed,

the manufacturing method comprising;

a first step of elastically deforming, when a distance between an opposed surface of the first heat radiation plate and an opposed surface of the second heat radiation plate is defined as D, a distance between a bottom of the first concave section and a bottom of the second concave section of the sealing body is defined as T1, and thickness of the sealing body is defined as T2, a part of the intermediate member of the case with pressing force of the sealing body inserted from the opening of the case such that, in the case formed to have the D smaller than the T1, the D changes to D1 larger than the T2; and

a second step of fitting the first heat radiation plate in the first concave section of the sealing body and fitting the second heat radiation plate in the second concave section of the sealing body.