Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

• US 8,659,146 B2
• Filed: 06/11/2010
• Issued: 02/25/2014
• Est. Priority Date: 04/06/2006
• Status: Active Grant

• Current Assignee: Chip Packaging Technologies, LLC
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Bauer, Robert, Kolbeck, Anton
• Primary Examiner(s): AU, BAC H
• Application Number:
  US12/813,903
• Publication Number:
  US 20100237479A1
• Time in Patent Office: 1,355 Days
• Field of Search: 257/690, 257/706, 257/712, 257/717, 257/720, 257/796
• US Class Current: 257/706
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49568 specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01076 : Osmium [Os]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A method and apparatus are provided for manufacturing a lead frame based, over-molded semiconductor package (7) with an exposed pad or power die flag (70) having multiple integrated THT heat spreader pins (71) configured for insertion into one or more vias (77) formed in a printed circuit board (78). The through hole heat spreader pins (71) may be formed as an integral part of the exposed pad (52) or may be solidly connected with the exposed pad (62).

Claims

1. A lead frame-based, over-molded semiconductor package comprising an exposed pad formed with a single, thermally conductive material and a plurality of THT heat spreader pins formed with the thermally conductive material and configured for insertion into corresponding vias formed in a printed circuit board.

2. The semiconductor package of claim 1, further comprising a plurality of input/output (I/O) pads disposed within the mold structure having exposed I/O pad surfaces.

3. The semiconductor package of claim 1, where said plurality of THT heat spreader pins are formed as an integral part of the exposed pad.

4. The semiconductor package of claim 1, where said plurality of THT heat spreader pins are formed separately from the exposed pad and are attached to the exposed pad.

5. The semiconductor package of claim 1, where the over-molded semiconductor package comprises a PQFN, QFN, HSOP, SOIC, QFP, TQFP or MO-188 package.

6. The semiconductor package of claim 1, where said exposed pad and THT heat spreader pins are formed with copper.

7. An electronic device comprising a package structure comprising:

a mold structure comprising a first exposed surface;

a die disposed within the mold structure; and

a plurality of input/output (I/O) pads disposed within the mold structure being exposed on the first exposed surface;

a die attach pad coupled to the die, said die attach pad comprising a first surface exposed from the mold structure and a first plurality of through hole technology heat spreader pins protruding from the first surface and past the plurality of I/O pads.

8. The electronic device of claim 7, where the first plurality of through hole technology heat spreader pins and the first surface of the die attach pad are exposed from the first exposed surface of the mold structure.

9. The electronic device of claim 7, further comprising a heat sink disposed in thermal communication with the first plurality of through hole technology heat spreader pins of the die attach pad.

10. The electronic device of claim 7, where the first plurality of through hole technology heat spreader pins is inserted into the die attach pad.

11. The electronic device of claim 7, where the first plurality of through hole technology heat spreader pin is formed as an integral part of the die attach pad.

12. A semiconductor package, comprising:

a die pad comprising first and second opposite surfaces with one or more through hole technology (THT) heat spreader structures protruding through the first surface of the die pad by a first distance;

an integrated circuit die affixed to the second surface of the die pad;

a mold compound encasing the integrated circuit die and die pad, leaving exposed the first surface of the die pad and a plurality of THT heat spreader structures; and

a plurality of input/output (I/O) pads disposed within the mold compound and having exposed I/O pad surfaces such that the plurality of THT heat spreader structures extend from the mold compound and past the exposed I/O pad surfaces.

13. The semiconductor package of claim 12, where the plurality of THT heat spreader structures are positioned and disposed for attachment to a printed circuit board.

14. The semiconductor package of claim 13, where the plurality of THT heat spreader structures are positioned and disposed for insertion through a plurality of vias formed in the printed circuit board.

15. The semiconductor package of claim 12, where the plurality of THT heat spreader structures are formed as an integral part of the die pad.

16. The semiconductor package of claim 12, where the plurality of THT heat spreader structures are formed as an integral part of the die pad by etching, milling, punching or machining a lead frame.

17. The semiconductor package of claim 12, where the die pad comprises:

a pad having a plurality of mounting holes formed in the first surface;

a plurality of THT heat spreader pins affixed into the plurality of mounting holes of the pad so that the plurality of THT heat spreader pins protrude from the pad.

18. The semiconductor package of claim 17, where the plurality of THT heat spreader pins are affixed by press fitting, cold welding or inserting the plurality of THT heat spreader pins into the plurality of mounting holes.

19. The semiconductor package of claim 12, where the plurality of THT heat spreader pins comprise copper.