Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
First Claim
1. A lead frame-based, over-molded semiconductor package comprising an exposed pad formed with a single, thermally conductive material and a plurality of THT heat spreader pins formed with the thermally conductive material and configured for insertion into corresponding vias formed in a printed circuit board.
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Accused Products
Abstract
A method and apparatus are provided for manufacturing a lead frame based, over-molded semiconductor package (7) with an exposed pad or power die flag (70) having multiple integrated THT heat spreader pins (71) configured for insertion into one or more vias (77) formed in a printed circuit board (78). The through hole heat spreader pins (71) may be formed as an integral part of the exposed pad (52) or may be solidly connected with the exposed pad (62).
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Citations
19 Claims
- 1. A lead frame-based, over-molded semiconductor package comprising an exposed pad formed with a single, thermally conductive material and a plurality of THT heat spreader pins formed with the thermally conductive material and configured for insertion into corresponding vias formed in a printed circuit board.
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7. An electronic device comprising a package structure comprising:
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a mold structure comprising a first exposed surface; a die disposed within the mold structure; and a plurality of input/output (I/O) pads disposed within the mold structure being exposed on the first exposed surface; a die attach pad coupled to the die, said die attach pad comprising a first surface exposed from the mold structure and a first plurality of through hole technology heat spreader pins protruding from the first surface and past the plurality of I/O pads. - View Dependent Claims (8, 9, 10, 11)
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12. A semiconductor package, comprising:
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a die pad comprising first and second opposite surfaces with one or more through hole technology (THT) heat spreader structures protruding through the first surface of the die pad by a first distance; an integrated circuit die affixed to the second surface of the die pad; a mold compound encasing the integrated circuit die and die pad, leaving exposed the first surface of the die pad and a plurality of THT heat spreader structures; and a plurality of input/output (I/O) pads disposed within the mold compound and having exposed I/O pad surfaces such that the plurality of THT heat spreader structures extend from the mold compound and past the exposed I/O pad surfaces. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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Specification