Tileable sensor array
First Claim
1. A method for forming a tileable detector array, comprising:
- forming a detector module, comprising;
providing a sensor array having a first side and a second side, wherein the sensor array comprises a first plurality of contact pads disposed on the second side of the sensor array;
disposing the sensor array on an interconnect layer, wherein the interconnect layer comprises;
a redistribution layer having a first side and a second side, wherein the redistribution layer comprises a second plurality of contact pads disposed on the first side of the redistribution layer;
an integrated circuit having a plurality of through vias disposed therethrough, wherein a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, wherein the integrated circuit comprises a plurality of through vias disposed in a patterned arrangement on the first side and the second side of the integrated circuit and wherein the patterned arrangement of the through vias on the first side the integrated circuit is different from the patterned arrangement of through vias on the second side of the integrated circuit,wherein the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array is aligned with the second plurality of contact pads on the first side of the redistribution layer;
operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the first side of the redistribution layer to form a sensor stack;
coupling the sensor stack to a first substrate to form the detector module; and
tiling a plurality of detector modules on a second substrate to form the tileable detector array.
1 Assignment
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Accused Products
Abstract
A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
12 Citations
19 Claims
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1. A method for forming a tileable detector array, comprising:
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forming a detector module, comprising; providing a sensor array having a first side and a second side, wherein the sensor array comprises a first plurality of contact pads disposed on the second side of the sensor array; disposing the sensor array on an interconnect layer, wherein the interconnect layer comprises; a redistribution layer having a first side and a second side, wherein the redistribution layer comprises a second plurality of contact pads disposed on the first side of the redistribution layer; an integrated circuit having a plurality of through vias disposed therethrough, wherein a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, wherein the integrated circuit comprises a plurality of through vias disposed in a patterned arrangement on the first side and the second side of the integrated circuit and wherein the patterned arrangement of the through vias on the first side the integrated circuit is different from the patterned arrangement of through vias on the second side of the integrated circuit, wherein the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array is aligned with the second plurality of contact pads on the first side of the redistribution layer; operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the first side of the redistribution layer to form a sensor stack; coupling the sensor stack to a first substrate to form the detector module; and tiling a plurality of detector modules on a second substrate to form the tileable detector array. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A tileable detector array, comprising:
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a first substrate having a first side and a second side; a plurality of detector modules arranged on the first side of the first substrate, wherein each of the plurality of detector modules comprises; a sensor array having a first side and a second side, wherein a first plurality of contact pads is disposed on the second side of the sensor array; an interconnect layer comprising; a redistribution layer having a first side and a second side, wherein the redistribution layer comprises a second plurality of contact pads disposed on the first side of the redistribution layer; an integrated circuit having a plurality of through vias disposed therethrough, wherein a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, wherein the integrated circuit comprises a plurality of through vias disposed in a patterned arrangement on the first side and the second side of the integrated circuit and wherein the patterned arrangement of the through vias on the first side the integrated circuit is different from the patterned arrangement of through vias on the second side of the integrated circuit, wherein the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array is aligned with the second plurality of contact pads on the first side of the redistribution layer, and wherein the first plurality of contact pads on the second side of the sensor array is operationally coupled to the second plurality of contact pads on the redistribution layer; and coupling means disposed on a second side of the integrated circuit, wherein the plurality of detector modules is coupled to the first side of the first substrate via the coupling means disposed on the second side of the integrated circuit. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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Specification