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Mechanisms for forming copper pillar bumps

  • US 8,659,155 B2
  • Filed: 07/29/2010
  • Issued: 02/25/2014
  • Est. Priority Date: 11/05/2009
  • Status: Active Grant
First Claim
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1. A bump structure on a substrate, comprising:

  • a composite conductive layer embedded in the substrate, wherein the composite conductive layer includes a protective conductive layer over a base conductive layer, and wherein the protective conductive layer is made of a material less likely to be oxidized in presence of air or water than a material for the base conductive layer;

    a dielectric layer over the composite conductive layer, wherein the protective conductive layer positioned to separate the dielectric layer from the base conductive layer;

    a polymer layer over the dielectric layer; and

    a metal bump, wherein the metal bump fills a second opening of a photoresist layer, wherein the second opening is formed above a first opening created in the polymer layer to make contact with the protective conductive layer of the composite conductive layer.

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