×

Electronic device housing assembly and manufacturing method thereof

  • US 8,659,497 B2
  • Filed: 06/20/2011
  • Issued: 02/25/2014
  • Est. Priority Date: 11/22/2010
  • Status: Expired due to Fees
First Claim
Patent Images

1. A housing assembly, comprising:

  • an outer housing defining an antenna opening;

    a support member positioned in the outer housing, and enclosing the antenna opening, wherein the support member defines a receiving portion for receiving an antenna module, and the receiving portion is aligned with the antenna opening;

    an antenna cover positioned in the antenna opening;

    wherein the housing assembly further comprises a foam member and an adhesive member, both of which are positioned between the support member and the antenna cover, and the foam member surrounds the adhesive member, and the adhesive member fixing the antenna cover to the support member.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×