Mechanical layer and methods of making the same

• US 8,659,816 B2
• Filed: 04/25/2011
• Issued: 02/25/2014
• Est. Priority Date: 04/25/2011
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Tao, Yi, Lee, Hojin, Zhong, Fan
• Primary Examiner(s): Lester, Evelyn A.
• Application Number:
  US13/093,716
• Publication Number:
  US 20120268430A1
• Time in Patent Office: 1,037 Days
• Field of Search: 359290-292, 359/295, 359/298, 359/315, 359/318, 359/223.1, 359/224.1, 359/224.2
• US Class Current: 359/290
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

This disclosure provides mechanical layers and methods of forming the same. In one aspect, a method of forming a pixel includes depositing a black mask on a substrate, depositing an optical stack over the black mask, and forming a mechanical layer over the optical stack. The black mask is disposed along at least a portion of a side of the pixel, and the mechanical layer defines a cavity between the mechanical layer and the optical stack. The mechanical layer includes a reflective layer, a dielectric layer, and a cap layer, and the dielectric layer is disposed between the reflective layer and the cap layer. The method further includes forming a notch in the dielectric layer of the mechanical layer along the side of the pixel so as to reduce the overlap of the dielectric layer with the black mask along the side of the pixel.

Claims

1. An apparatus, comprising:

a substrate; and

a plurality of pixels arranged in an array on the substrate, each pixel including

a black mask disposed on the substrate along at least a portion of a side of each pixel,

an optical stack disposed over the substrate and over at least a portion of the black mask,

a mechanical layer disposed over the optical stack, the mechanical layer including a reflective layer, a cap layer, and a dielectric layer, the dielectric layer disposed between the reflective layer and the cap layer,

a cavity between the mechanical layer and the optical stack, the mechanical layer movable through the cavity between an actuated position and a relaxed position,

wherein the mechanical layer includes a notch in the dielectric layer along the side of each pixel, the notch reducing the overlap of the dielectric layer with the black mask along the side of the pixel.

2. The apparatus of claim 1, wherein the reflective layer and the cap layer extend past a portion of the dielectric layer and electrically contact each other in at least a portion of the notch.

3. The apparatus of claim 1, wherein the notch in the mechanical layer extends through each of the reflective layer, the dielectric layer, and the cap layer along the side of each pixel.

4. The apparatus of claim 1, wherein the reflective layer and the cap layer each include aluminum-copper (AlCu).

5. The apparatus of claim 4, wherein the dielectric layer includes silicon oxynitride (SiON).

6. The apparatus of claim 1, wherein the notch has a length dimension extending along the side of the pixel of between about 2 μ

m and about 30 μ

m.

7. The apparatus of claim 1, wherein the notch has a width dimension extending from an edge of the mechanical layer into the mechanical layer of between about 0.5 μ

m and about 5 μ

m.

8. The apparatus of claim 1, wherein each pixel includes a plurality of sides and the black mask is disposed along at least a portion of each side, and wherein the mechanical layer includes a notch in the dielectric layer along each side of each of the plurality of pixels.

9. The apparatus of claim 1, further comprising a stationary electrode positioned between the substrate and the cavity.

10. The apparatus of claim 9, further comprising:

a display;

a processor that is configured to communicate with the display, the processor being configured to process image data; and

a memory device that is configured to communicate with the processor.

11. The apparatus of claim 10, further comprising a driver circuit configured to send at least one signal to the display.

12. The apparatus of claim 11, further comprising a controller configured to send at least a portion of the image data to the driver circuit.

13. The apparatus of claim 12, further comprising an image source module configured to send the image data to the processor.

14. A method of forming an electromechanical device having a plurality of pixels, the method comprising:

depositing a black mask on a substrate, the black mask disposed along at least a portion of a side of each pixel;

depositing an optical stack over the substrate and over at least a portion of the black mask;

forming a mechanical layer over the optical stack, wherein forming the mechanical layer includes providing a reflective layer, a dielectric layer over the reflective layer, and a cap layer over the supporting layer;

forming a cavity between the mechanical layer and the optical stack, the mechanical layer movable through the cavity between an actuated position and a relaxed position, and

forming a notch in the dielectric layer of the mechanical layer along the side of each pixel, the notch reducing the overlap of the dielectric layer with the black mask along the side of the pixel.

15. The method of claim 14, further comprising depositing a sacrificial layer before forming the mechanical layer and removing the sacrificial layer after depositing the mechanical layer to form the cavity of the pixel, wherein the sacrificial layer has a thickness selected to define a height of the cavity.

16. The method of claim 15, further comprising forming a hole in the sacrificial layer and depositing a support post in the hole before depositing the mechanical layer.

17. The method of claim 14, further comprising forming a notch in the cap and reflective layers of the mechanical layer along the side of each pixel.

18. The method of claim 14, wherein the reflective layer and the cap layer are formed to extend past a portion of the dielectric layer and electrically contact each other in at least a portion of the notch.

19. The method of claim 14, wherein the reflective layer and the cap layer each include aluminum-copper (AlCu).

20. The method of claim 19, wherein the dielectric layer includes silicon oxynitride (SiON).

21. The method of claim 14, wherein the notch has a length dimension extending along the side of the pixel of between about 2 μ

m and about 30 μ

m.

22. The method of claim 14, wherein the notch has a width dimension extending into the mechanical layer of the pixel of between about 0.5 μ

m and about 5 μ

m.

23. The method of claim 14, wherein each pixel includes a plurality of sides and the black mask is deposited along at least a portion of each side of each of the plurality of pixels.

24. The method of claim 23, further comprising forming a notch in the dielectric layer of the mechanical layer along each side of the pixel.

25. An apparatus, comprising:

a substrate; and

a plurality of pixels arranged in an array on the substrate, each pixel including

a means for absorbing light on the substrate, the light absorbing means including a portion disposed along a side of each pixel,

an optical stack disposed over the substrate and over at least a portion of the light absorbing means,

a mechanical layer disposed over the optical stack, the mechanical layer including a reflective layer, a dielectric layer, and a cap layer, the dielectric layer disposed between the reflective layer and the cap layer,

a cavity between the mechanical layer and the optical stack, the mechanical layer movable through the cavity between an actuated position and a relaxed position,

wherein the mechanical layer further includes a means for reducing overlap along the side of each pixel, the overlap reducing means reducing the overlap of the dielectric layer with the light absorbing means along the side of the pixel.

26. The apparatus of claim 25, wherein the overlap reducing means includes a notch in the dielectric layer of the mechanical layer along the side of each pixel, the notch being dimensioned so as to reduce the overlap of the dielectric layer with the light absorbing means along the side of each pixel.

27. The apparatus of claim 25, wherein the light absorbing means includes a black mask.

28. The apparatus of claim 25, wherein the reflective layer and the cap layer extend past the dielectric layer and electrically contact each other in at least a portion of the overlap reducing means.

29. The apparatus of claim 25, wherein the overlap reducing means is further configured to reduce the overlap of the reflective and cap layers with the light absorbing means.

30. The apparatus of claim 25, wherein the reflective layer and the cap layer comprise aluminum-copper (AlCu).

31. The apparatus of claim 25, wherein the dielectric layer comprises silicon oxynitride (SiON).