Integrated transmitter with on-chip power distribution

• US 8,660,505 B2
• Filed: 10/05/2012
• Issued: 02/25/2014
• Est. Priority Date: 06/09/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza, Rofougaran, Maryam
• Primary Examiner(s): LE, NHAN T
• Application Number:
  US13/646,297
• Publication Number:
  US 20130072141A1
• Time in Patent Office: 508 Days
• Field of Search: 4551151-1153, 455/127.1, 455/127.5, 455/129, 455/333, 455/341, 343/700.MS
• US Class Current: 455/129
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for an integrated leaky wave antenna-based transmitter and on-chip power distribution are disclosed, and may include supplying one or more bias voltages and ground for a chip including a plurality of power amplifiers (PAs) utilizing bias voltage and ground lines. One or more leaky wave antennas (LWAs) may be communicatively coupled to the power amplifiers. Wireless signals may be transmitted utilizing the LWAs integrated in the lines in the chip. Radio frequency (RF) signals may be transmitted via the plurality of LWAs. The RF signals may include 60 GHz signals and the LWAs may include microstrip and/or coplanar waveguides. A cavity length of the LWAs may be configured by a spacing between conductive lines in the microstrip and/or coplanar waveguides. The LWAs may be configured to transmit the wireless signals at a desired angle from a surface of the chip.

Claims

1. A wireless system comprising:

a circuit comprising a power amplifier on a chip, wherein said power amplifier is coupled to a leaky wave antenna, said leaky wave antenna being integrated in a power supply voltage line that supplies DC power to said chip and to said power amplifier, said circuit being configured to;

transmit wireless signals utilizing said leaky wave antenna integrated in said power supply voltage line.

2. The wireless system of claim 1, wherein said wireless signals are radio frequency (RF) signals.

3. The wireless system of claim 2, wherein said RF signals have frequencies of at least 60 GHz.

4. The wireless system of claim 1, wherein said leaky wave antenna comprises a microstrip waveguide.

5. The wireless system of claim 4, wherein a cavity length of said leaky wave antenna is dependent on a spacing between conductive lines in said microstrip waveguide.

6. The wireless system of claim 1, wherein said leaky wave antenna comprises a coplanar waveguide.

7. The wireless system of claim 6, wherein a cavity length of said leaky wave antenna is dependent on a spacing between conductive lines in said coplanar waveguide.

8. The wireless system of claim 1, wherein said circuit is operable to configure said leaky wave antenna to transmit said wireless signals at a desired angle from a surface of said chip.

9. The wireless system of claim 1, wherein a gain of said power amplifier is configured for a desired transmitted output power.

10. A wireless system comprising:

a circuit comprising a power amplifier on a chip, wherein said power amplifier is coupled to a leaky wave antenna, said leaky wave antenna being integrated in a ground line that supplies ground to said chip and to said power amplifier, said circuit being configured to;

transmit wireless signals utilizing said leaky wave antenna integrated in said ground line.

11. The wireless system of claim 10, wherein said wireless signals are radio frequency (RF) signals.

12. The wireless system of claim 11, wherein said RF signals have frequencies of at least 60 GHz.

13. The wireless system of claim 10, wherein said leaky wave antenna comprises a microstrip waveguide.

14. The wireless system of claim 13, wherein a cavity length of said leaky wave antenna is dependent on a spacing between conductive lines in said microstrip waveguide.

15. The wireless system of claim 10, wherein said leaky wave antenna comprises a coplanar waveguide.

16. The wireless system of claim 15, wherein a cavity length of said leaky wave antenna is dependent on a spacing between conductive lines in said coplanar waveguide.

17. The wireless system of claim 10, wherein said circuit is operable to configure said leaky wave antenna to transmit said wireless signals at a desired angle from a surface of said chip.

18. The wireless system of claim 10, wherein a gain of said power amplifier is configured for a desired transmitted output power.