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Low impedance, low modulus wire configurations for a medical device

  • US 8,660,662 B2
  • Filed: 04/22/2011
  • Issued: 02/25/2014
  • Est. Priority Date: 04/22/2011
  • Status: Active Grant
First Claim
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1. An implantable device (IMD), comprising:

  • a core formed of a material having a resistivity of less than 25 micro-ohm-cm; and

    a layer of biocompatible beta titanium alloy selected from Ti-15Mo, TiOsteum (Ti-35Nb-7Zr-5Ta), TNTZ (Ti-29Nb-12Ta-5Zr), TNCS (Ti- 19Nb-5Cr-4Sn), TNCS (Ti- 18.6Nb-4.5Cr-4Sn), Ti—

    Nb—

    Cr—

    Zr (Ti-20Nb-5Cr-4Zr), TMFZ, TLM (Ti-22Nb-3Zr-3Mo-2Sn), TLM (Ti-22.4Nb-2.8Zr-2.7Mo-1.8Sn) and Ti-30Ta surrounding the core to form a wire, the alloy having an elastic modulus ranging from 30 GigaPascals (GPa) to 90 GPa.

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