Low impedance, low modulus wire configurations for a medical device

• US 8,660,662 B2
• Filed: 04/22/2011
• Issued: 02/25/2014
• Est. Priority Date: 04/22/2011
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Li, Bernard Q., Wang, Ling
• Primary Examiner(s): Holmes, Rex R
• Application Number:
  US13/092,380
• Publication Number:
  US 20120271385A1
• Time in Patent Office: 1,040 Days
• Field of Search: 174/36, 174/102.R, 174/103, 174/105.R, 174/107, 174/108, 174/119.R, 174/126.1, 174/126.2, 174/128.1, 607115-116, 607/122
• US Class Current: 607/116
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: B21C 1/16 Metal drawing by machines or apparatus in which the drawing action is effected by other means than drums, e.g. by a longitudinally-moved carriage pulling or pushing the work or stock for making metal sheets, bars, or tubes
• CPC Class Codes: C22C 14/00 Alloys based on titanium
• CPC Class Codes: C22F 1/183 of titanium or alloys based thereon

Abstract

Techniques are disclosed related to wires that may be used within a medical device. According to one example, a wire may include a core formed of a material having a resistivity of less than 25 micro-ohm-cm and a layer of a biocompatible beta titanium alloy surrounding the core. As one example, the beta titanium alloy has an elastic modulus ranging from 30 GigaPascals (GPa) to 90 GPa and comprises at least two elements from a group consisting of titanium, molybdenum, niobium, tantalum, zirconium, chromium, iron and tin. In one embodiment, the core may be formed of silver, tantalum, a tantalum alloy, niobium, a niobium alloy, platinum, a platinum alloy, palladium, or a palladium alloy. In some examples, one or more wires may be incorporated into a coil or a cable and one or more such coils or cables may be carried by a medical device such as a medical electrical lead.

Claims

1. An implantable device (IMD), comprising:

a core formed of a material having a resistivity of less than 25 micro-ohm-cm; and

a layer of biocompatible beta titanium alloy selected from Ti-15Mo, TiOsteum (Ti-35Nb-7Zr-5Ta), TNTZ (Ti-29Nb-12Ta-5Zr), TNCS (Ti- 19Nb-5Cr-4Sn), TNCS (Ti- 18.6Nb-4.5Cr-4Sn), Ti—

Nb—

Cr—

Zr (Ti-20Nb-5Cr-4Zr), TMFZ, TLM (Ti-22Nb-3Zr-3Mo-2Sn), TLM (Ti-22.4Nb-2.8Zr-2.7Mo-1.8Sn) and Ti-30Ta surrounding the core to form a wire, the alloy having an elastic modulus ranging from 30 GigaPascals (GPa) to 90 GPa.

2. The IMD of claim 1, wherein the core is formed of silver.

3. The IMD of claim 1, wherein the core is formed of a material having a resistivity of between 10 and 20 micro-ohm-cm.

4. The IMD of claim 1, wherein an outer diameter of the wire is between .001 inches and .01 inches.

5. The IMD of claim 1, wherein the outer diameter of the wire is between .003 inches and .005 inches.

6. The IMD of claim 1, further comprising an electrically-coupled element that is electrically coupled to the wire, wherein a fraction of a cross-sectional area of the core to the cross-sectional area of the wire is selected so that a resistance of the wire is substantially the same as a resistance of the element.

7. The IMD claim 6, wherein the resistance of the wire is tuned to a value of between 3 ohms and 15 ohms per 4 inches of wire.

8. The IMD of claim 1, further comprising an insulating layer surrounding the layer surrounding the core.

9. The IMD of claim 8, wherein the insulating layer is ethylene tetrafluoroethylene (ETFE).

10. The IMD of claim 1, wherein the core is formed of tantalum, a tantalum alloy, niobium, a niobium alloy or platinum.

11. The IMD of claim 1, wherein the layer surrounding the core and the core are cold drawn and then heated to a beta transit temperature of the beta titanium alloy of between 730°

C.-815°

C.

12. The IMD of claim 1, wherein the layer surrounding the core and the core are cold drawn and then heated to a beta transit temperature of the beta titanium alloy of between 600°

C.-900°

C.

13. The IMD of claim 1, further compromising:

multiple cores, each formed of a material having a resistivity of less than 25 micro-ohm-cm; and

a respective layer of the biocompatible be titanium alloy surrounding each core to form a respective filar; and

wherein the filars are configured as a coil.

14. The IMD of claim 13, wherein the coil has an outer diameter of less than .03 inches.

15. The IMD of claim 13, wherein a ratio of a pitch of the coil to an outer diameter of the coil is greater than one.

16. The IMD of claim 13, wherein the IMD comprises more than four filars.

17. The IMD of claim 1 farther comprising:

multiple cores, each formed of a material having a resistivity of less than 25 micro-ohm-cm; and

a respective layer of the biocompatible beta titanium alloy surrounding each core to term a respective wire; and

wherein the wires are configured as at least one cable that has been heated to a stress-relieve temperature of the beta titanium alloy.

18. The IMD of claim 17, wherein the biocompatible beta titanium alloy is Ti-15Mo and the at least one cable has been heated to a stress-relieve temperature of between 500°

C.-650°

C. for less than 10 seconds.

19. The IMD of claim. 17, wherein the wires are configured as multiple cables, and further comprising a lead body comprising at least eight lumens, each lumen carrying a respective one of the cables.

20. The IMD of claim 1, wherein the layer of beta titanium alloy is an ubroken lever having a substantially uniform thickness.

25. The implantable medical device claim 1, wherein the biocompatible beta titanium alloy is Ti-15Mo.

21. An electrically-conducting element for a medical electrical device, comprising:

a core formed of a material having a resistivity of less than 25 micro-ohm-cm; and

a layer of biocompatible beta titanium alloy selected from Ti-15Mo, TiOsteum (Ti-35Nb-7Zr-5Ta), TNTZ (Ti-29Nb-12Ta-5Zr), TNCS (Ti- 19Nb-5Cr-4Sn), TNCS (Ti- 18.6Nb-4.5Cr-4Sn), Ti—

Nb—

Cr—

Zr (Ti-20Nb-5Cr-4Zr), TMFZ, TLM (Ti-22Nb-3Zr-3Mo-2Sn), TLM (Ti-22.4Nb-2.8Zr-2.7Mo-1.8Sn) and Ti-30Ta surrounding the core to form a wire, the alloy having an elastic modulus ranging from 30 GigaPascals (GPa) to 90 GPa.

22. The electrical-coducting element of claim 21,wherein the core is formed of a material having a resistivity of between 10 micro-ohm-cm and 20 micro-ohm-cm.)

23. The electrically-conducting element of claim 21, wherein the core is formed of silver, tantalum, a tantalum alloy, niobium, a niobium alloy, platinum, a platinum alloy, palladium, or a palladium alloy.

24. The electrically-conducting element of claim 21, wherein the layer surrounding the core is formed of Ti-15Mo.