Electrical circuit with a nanostructure and method for producing a contact connection of a nanostructure
First Claim
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1. A circuit comprising:
- at least one nanostructure; and
a carbon interconnect formed by a layer essentially comprising carbon,wherein the nanostructure and the carbon interconnect are directly coupled to one another,wherein a thickness of the layer is controlled by means of the duration of a layer deposition process; and
wherein the layer essentially comprising carbon is a polycrystalline carbon layer including crystalline regions having hexagonal lattice structures separated by regions having no hexagonal lattice structures or separated by regions having hexagonal lattice structures that have an orientation arranged differently than the adjacent crystalline regions.
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Abstract
A circuit is disclosed. The circuit includes at least one nanostructure and a carbon interconnect formed by a substantially carbon layer, wherein the nanostructure and the carbon interconnect are directly coupled to one another.
51 Citations
22 Claims
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1. A circuit comprising:
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at least one nanostructure; and a carbon interconnect formed by a layer essentially comprising carbon, wherein the nanostructure and the carbon interconnect are directly coupled to one another, wherein a thickness of the layer is controlled by means of the duration of a layer deposition process; and wherein the layer essentially comprising carbon is a polycrystalline carbon layer including crystalline regions having hexagonal lattice structures separated by regions having no hexagonal lattice structures or separated by regions having hexagonal lattice structures that have an orientation arranged differently than the adjacent crystalline regions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method for producing a circuit including a contact-connection of a nanostructure on a substrate, comprising:
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forming a nanostructure; and forming a carbon interconnect, where the nanostructure and the carbon interconnect are formed in such a way that they make direct contact with one another, wherein the carbon interconnect is formed by a layer essentially comprising carbon, wherein a thickness of the layer is controlled by means of the duration of a layer deposition process, and wherein the layer essentially comprising carbon is a polycrystalline carbon layer including crystalline regions having hexagonal lattice structures separated by regions having no hexagonal lattice structures or separated by regions having hexagonal lattice structures that have an orientation arranged differently than the adjacent crystalline regions. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification